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    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20120146107A1

    公开(公告)日：2012-06-14

    申请号：US13274367

    申请日：2011-10-17

    申请人： Jong-Won LIM ,  Hokyun Ahn ,  Dong Min Kang ,  Woojin Chang ,  Hae Cheon Kim ,  Eun Soo Nam

    发明人： Jong-Won LIM ,  Hokyun Ahn ,  Dong Min Kang ,  Woojin Chang ,  Hae Cheon Kim ,  Eun Soo Nam

    IPC分类号： H01L29/772 ,  H01L21/28

    CPC分类号： H01L29/42376 ,  H01L29/2003 ,  H01L29/40 ,  H01L29/402 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/7787 ,  H01L29/812

    摘要： Disclosed are a semiconductor device and a method of manufacturing the same. In the semiconductor device according to an exemplary embodiment of the present disclosure, at the time of forming a source electrode, a drain electrode, a field plate electrode, and a gate electrode on a substrate having a heterojunction structure such as AlGaN/GaN, the field plate electrode made of the same metal as the gate electrode is formed on the side surface of a second support part positioned below a head part of the gate electrode so as to prevent the gate electrode from collapsing and improve high-frequency and high-voltage characteristic of the semiconductor device.

    摘要翻译： 公开了一种半导体器件及其制造方法。 在根据本公开的示例性实施例的半导体器件中，在具有诸如AlGaN / GaN的异质结结构的衬底上形成源电极，漏电极，场板电极和栅电极时， 由与栅电极相同的金属制成的场板电极形成在位于栅电极的头部下方的第二支撑部分的侧表面上，以防止栅电极塌陷并改善高频和高电压 半导体器件的特性。

    Method for fabricating field effect transistor using a compound semiconductor
    5.
    发明授权
    Method for fabricating field effect transistor using a compound semiconductor 有权
    使用化合物半导体制造场效应晶体管的方法

    公开(公告)号：US08053345B2

    公开(公告)日：2011-11-08

    申请号：US12773216

    申请日：2010-05-04

    申请人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Woojin Chang ,  Hae Cheon Kim ,  Eun Soo Nam

    发明人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Woojin Chang ,  Hae Cheon Kim ,  Eun Soo Nam

    IPC分类号： H01L21/3205 ,  H01L21/44

    CPC分类号： H01L29/66462

    摘要： Provided is a method for fabricating a field effect transistor. In the method, an active layer and a capping layer are formed on a substrate. A source electrode and a drain electrode is formed on the capping layer. A dielectric interlayer is formed on the substrate, and resist layers having first and second openings with asymmetrical depths are formed on the dielectric interlayer between the source electrode and the drain electrode. The first opening exposes the dielectric interlayer, and the second opening exposes the lowermost of the resist layers. The dielectric interlayer in the bottom of the first opening and the lowermost resist layer under the second opening are simultaneously removed to expose the capping layer to the first opening and expose the dielectric interlayer to the second opening. The capping layer of the first opening is removed to expose the active layer. A metal layer is deposited on the substrate to simultaneously form a gate electrode and a field plate in the first opening and the second opening. The resist layers are removed to lift off the metal layer on the resist layers.

    摘要翻译： 提供了一种用于制造场效应晶体管的方法。 在该方法中，在基板上形成有源层和覆盖层。 源极电极和漏电极形成在覆盖层上。 在基板上形成电介质中间层，在源电极和漏极之间的电介质层间形成有具有不对称深度的第一和第二开口的抗蚀剂层。 第一开口露出电介质中间层，第二开口露出最低层的抗蚀剂层。 同时除去第一开口底部的电介质中间层和第二开口下面的最下面的抗蚀剂层，以将覆盖层暴露于第一开口，并将电介质中间层暴露于第二开口。 去除第一开口的覆盖层以暴露活性层。 金属层沉积在基板上，以在第一开口和第二开口中同时形成栅电极和场板。 去除抗蚀剂层以剥离抗蚀剂层上的金属层。

    Power amplifier having depletion mode high electron mobility transistor
    6.
    发明授权
    Power amplifier having depletion mode high electron mobility transistor 有权
    具有耗尽型高电子迁移率晶体管的功率放大器

    公开(公告)号：US08294521B2

    公开(公告)日：2012-10-23

    申请号：US12855055

    申请日：2010-08-12

    申请人： Dong Min Kang ,  Hong Gu Ji ,  Hokyun Ahn ,  Jong-Won Lim ,  Woojin Chang ,  Sang-Heung Lee ,  Dong-Young Kim ,  Hae Cheon Kim

    发明人： Dong Min Kang ,  Hong Gu Ji ,  Hokyun Ahn ,  Jong-Won Lim ,  Woojin Chang ,  Sang-Heung Lee ,  Dong-Young Kim ,  Hae Cheon Kim

    IPC分类号： H03F3/04

    CPC分类号： H03F3/24 ,  H03F1/565 ,  H03F3/195 ,  H03F2200/222

    摘要： Provided is a power amplifier including: a depletion mode high electron mobility transistor (D-mode HEMT) configured to amplify a signal inputted to a gate terminal and output the amplified signal through a drain terminal; an input matching circuit configured to serially ground the gate terminal; and a DC bias circuit connected between the drain terminal and a ground. Through the foregoing configuration, the HEMT may be biased only by a single DC bias circuit without any biasing means to provide a negative voltage. Also, superior matching characteristic may be provided in various operation frequency bands through a shunt inductor and a choke inductor.

    摘要翻译： 提供了一种功率放大器，包括：耗尽型高电子迁移率晶体管（D模式HEMT），被配置为放大输入到栅极端子的信号，并通过漏极端子输出放大的信号; 输入匹配电路，被配置为使所述栅极端子串联接地; 以及连接在漏极端子和地之间的DC偏置电路。 通过上述配置，HEMT可以仅由单个DC偏置电路偏压而没有任何偏置装置来提供负电压。 此外，可以通过并联电感器和扼流电感器在各种工作频带中提供优异的匹配特性。

    Method of manufacturing a field-effect transistor
    7.
    发明授权
    Method of manufacturing a field-effect transistor 有权
    制造场效应晶体管的方法

    公开(公告)号：US08586462B2

    公开(公告)日：2013-11-19

    申请号：US13307069

    申请日：2011-11-30

    申请人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Byoung-Gue Min ,  Sang-Heung Lee ,  Hae Cheon Kim ,  Eun Soo Nam

    发明人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Byoung-Gue Min ,  Sang-Heung Lee ,  Hae Cheon Kim ,  Eun Soo Nam

    IPC分类号： H01L29/808 ,  H01L21/283

    CPC分类号： H01L29/7831 ,  H01L29/2003 ,  H01L29/404 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/66863 ,  H01L29/7787 ,  H01L29/812

    摘要： Disclosed are a method of manufacturing a field-effect transistor. The disclosed method includes: providing a semiconductor substrate; forming a source ohmic metal layer on one side of the semiconductor substrate; forming a drain ohmic metal layer on another side of the semiconductor substrate; forming a gate electrode between the source ohmic metal layer and the drain ohmic metal layer, on an upper portion of the semiconductor substrate; forming an insulating film on the semiconductor substrate's upper portion including the source ohmic metal layer, the drain ohmic metal layer and the gate electrode; and forming a plurality of field electrodes on an upper portion of the insulating film, wherein the insulating film below the respective field electrodes has different thicknesses.

    摘要翻译： 公开了一种制造场效晶体管的方法。 所公开的方法包括：提供半导体衬底; 在半导体衬底的一侧上形成源极欧姆金属层; 在所述半导体衬底的另一侧上形成漏极欧姆金属层; 在所述源欧姆金属层和所述漏极欧姆金属层之间形成栅电极，在所述半导体衬底的上部; 在包括源欧姆金属层，漏极欧姆金属层和栅电极的半导体衬底的上部上形成绝缘膜; 以及在绝缘膜的上部形成多个场电极，其中各个场电极下方的绝缘膜具有不同的厚度。

    FIELD-EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    FIELD-EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF 有权
    场效应晶体管及其制造方法

    公开(公告)号：US20120153361A1

    公开(公告)日：2012-06-21

    申请号：US13307069

    申请日：2011-11-30

    申请人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Byoung-Gue Min ,  Sang-Heung Lee ,  Hae Cheon Kim ,  Eun Soo Nam

    发明人： Hokyun Ahn ,  Jong-Won Lim ,  Hyung Sup Yoon ,  Byoung-Gue Min ,  Sang-Heung Lee ,  Hae Cheon Kim ,  Eun Soo Nam

    IPC分类号： H01L21/283 ,  H01L29/808

    CPC分类号： H01L29/7831 ,  H01L29/2003 ,  H01L29/404 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/66863 ,  H01L29/7787 ,  H01L29/812

    摘要： Disclosed are a field-effect transistor and a manufacturing method thereof. The disclosed field-effect transistor includes: a semiconductor substrate; a source ohmic metal layer formed on one side of the semiconductor substrate; a drain ohmic metal layer formed on another side of the semiconductor substrate; a gate electrode formed between the source ohmic metal layer and the drain ohmic metal layer, on an upper portion of the semiconductor substrate; an insulating film formed on the semiconductor substrate's upper portion including the source ohmic metal layer, the drain ohmic metal layer and the gate electrode; and a plurality of field electrodes formed on an upper portion of the insulating film, wherein the insulating film below the respective field electrodes has different thicknesses.

    摘要翻译： 公开了场效应晶体管及其制造方法。 所公开的场效应晶体管包括：半导体衬底; 源极欧姆金属层，形成在半导体衬底的一侧上; 形成在所述半导体衬底的另一侧上的漏极欧姆金属层; 在所述源极欧姆金属层和所述漏极欧姆金属层之间形成的栅电极，位于所述半导体衬底的上部; 形成在包括源极欧姆金属层，漏极欧姆金属层和栅电极的半导体衬底的上部上的绝缘膜; 以及形成在绝缘膜的上部的多个场电极，其中，各个场电极下方的绝缘膜具有不同的厚度。