公开(公告)号：US20120266758A1

公开(公告)日：2012-10-25

申请号：US13446961

申请日：2012-04-13

Applicant: Jongho LEE ,  Jeahyuk Wie

Inventor： Jongho LEE ,  Jeahyuk Wie

IPC: G07F9/10

CPC classification number: F24C3/085 ,  F24C15/001 ,  F24C15/006 ,  F24C15/2007

Abstract: A cooker is provided. The cooker includes a casing, a cavity part in the casing and including a cooking chamber to cook food, and an exhaust duct through which exhaust gas is discharged. The exhaust duct includes a first duct part having a lower end communicating with the cooking chamber, a second duct part extending from the other end of the first duct part, the second duct part making a predetermined angle with respect to the first duct part or having a predetermined curvature, and a flow passage extension protruded from a portion of the first duct part or the second duct part in an outward direction. At least a portion of the flow passage extension extends at an angle different from the predetermined angle between the first and second duct parts or the flow passage extension has a curvature different from the predetermined curvature of the second duct part.

Abstract translation: 提供炊具。 炊具包括壳体，壳体中的空腔部分，并且包括用于烹饪食物的烹饪室以及排出废气的排气管。 排气管道包括具有与烹饪室连通的下端的第一管道部分，从第一管道部分的另一端延伸的第二管道部分，第二管道部分相对于第一管道部分形成预定角度或具有 预定的曲率以及从第一导管部或第二导管部的一部分向外方突出的流路延伸部。 流动通道延伸部分的至少一部分以与第一和第二管道部分之间的预定角度不同的角度延伸，或者流动通道延伸部具有不同于第二管道部分的预定曲率的曲率。

公开(公告)号：US20150155199A1

公开(公告)日：2015-06-04

申请号：US14613154

申请日：2015-02-03

Applicant: Young Lyong KIM ,  Taehoon KIM ,  Jongho LEE ,  Chul-Yong JANG

Inventor： Young Lyong KIM ,  Taehoon KIM ,  Jongho LEE ,  Chul-Yong JANG

IPC: H01L21/768 ,  H01L25/00

CPC classification number: H01L21/76802 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24146 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.

Abstract translation: 半导体封装可以包括：衬底，其包括衬底连接端子，堆叠在衬底上并具有芯片连接端子的至少一个半导体芯片，覆盖衬底和至少一个半导体芯片的至少一部分的第一绝缘层和/ 或穿透第一绝缘层的互连以将衬底连接端子连接到芯片连接端子。 半导体封装可以包括堆叠的半导体芯片，半导体芯片的边缘部分构成阶梯结构，并且每个半导体芯片包括芯片连接端子; 至少一个绝缘层，至少覆盖半导体芯片的边缘部分; 和/或穿透至少一个绝缘层的互连以连接到每个半导体芯片的芯片连接端子。

公开(公告)号：US20150235995A1

公开(公告)日：2015-08-20

申请号：US14602408

申请日：2015-01-22

Applicant: Jin-Woo PARK ,  Jongho LEE

Inventor： Jin-Woo PARK ,  Jongho LEE

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/42 ,  H01L23/31

CPC classification number: H01L23/49822 ,  H01L21/565 ,  H01L21/566 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/15159 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a second package substrate on the first semiconductor chip, the second package substrate including a chip region overlapping the first semiconductor chip, the chip region including a first surface defining a concave region and a second surface defining a protruding portion in sectional view, the concave region facing the first semiconductor chip, and the protruding portion facing the concave region, and a connection region adjacent to the chip region in plan view, and a second semiconductor chip on the second package substrate, wherein the chip and connection regions of the second package substrate have a same thickness.

Abstract translation: 半导体封装包括第一封装衬底，第一封装衬底上的第一半导体芯片，第一半导体芯片上的第二封装衬底，第二封装衬底包括与第一半导体芯片重叠的芯片区域，芯片区域包括第一表面 限定了一个凹区域和一个第二表面，其限定了截面图中的突出部分，面对第一半导体芯片的凹面区域和面向凹区域的突出部分以及在俯视图中与芯片区域相邻的连接区域， 半导体芯片，其中第二封装衬底的芯片和连接区域具有相同的厚度。