Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device
    2.
    发明授权
    Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权
    柔性电路电极阵列器件及柔性电路电极器件的背面处理方法

    公开(公告)号:US08738149B2

    公开(公告)日:2014-05-27

    申请号:US13397604

    申请日:2012-02-15

    IPC分类号: A61N1/04

    摘要: The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

    摘要翻译: 本发明涉及一种柔性电路电极阵列器件,包括:聚合物层; 其中所述聚合物层包括一个或多个金属迹线,电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法,包括:在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法,包括:处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

    Flexible Circuit Electrode Array Device and a Method for Backside Processing of a Flexible Circuit Electrode Device
    3.
    发明申请
    Flexible Circuit Electrode Array Device and a Method for Backside Processing of a Flexible Circuit Electrode Device 有权
    柔性电路电极阵列器件及柔性电路电极器件背面加工方法

    公开(公告)号:US20120150270A1

    公开(公告)日:2012-06-14

    申请号:US13397604

    申请日:2012-02-15

    IPC分类号: A61N1/05

    摘要: The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

    摘要翻译: 本发明涉及一种柔性电路电极阵列器件,包括:聚合物层; 其中所述聚合物层包括一个或多个金属迹线,电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法,包括:在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法,包括:处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。