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    Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device
    5.
    发明授权
    Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权
    柔性电路电极阵列器件及柔性电路电极器件的背面处理方法

    公开(公告)号：US08738149B2

    公开(公告)日：2014-05-27

    申请号：US13397604

    申请日：2012-02-15

    申请人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    发明人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    IPC分类号： A61N1/04

    CPC分类号： A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  B23K26/361 ,  B23K26/362

    摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

    摘要翻译： 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

    Flexible Circuit Electrode Array Device and a Method for Backside Processing of a Flexible Circuit Electrode Device
    6.
    发明申请
    Flexible Circuit Electrode Array Device and a Method for Backside Processing of a Flexible Circuit Electrode Device 有权
    柔性电路电极阵列器件及柔性电路电极器件背面加工方法

    公开(公告)号：US20120150270A1

    公开(公告)日：2012-06-14

    申请号：US13397604

    申请日：2012-02-15

    申请人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    发明人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    IPC分类号： A61N1/05

    CPC分类号： A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  B23K26/361 ,  B23K26/362

    摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

    摘要翻译： 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

    Electrode with increased stability and method of manufacturing the same
    7.
    发明授权
    Electrode with increased stability and method of manufacturing the same 有权
    增加稳定性的电极及其制造方法

    公开(公告)号：US07937153B2

    公开(公告)日：2011-05-03

    申请号：US11820744

    申请日：2007-06-19

    申请人： Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

    发明人： Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

    IPC分类号： A61N1/00

    CPC分类号： A61N1/0543 ,  A61N1/36046

    摘要： An implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. An implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.

    摘要翻译： 具有增加的稳定性的可植入电极具有聚集结构，其中电极的表面被包括充满棒或柱的开口的材料覆盖。 具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

    FLEXIBLE CIRCUIT ELECTRODE ARRAY
    9.
    发明申请
    FLEXIBLE CIRCUIT ELECTRODE ARRAY 审中-公开
    柔性电路阵列

    公开(公告)号：US20080221653A1

    公开(公告)日：2008-09-11

    申请号：US12044830

    申请日：2008-03-07

    申请人： Rajat Agrawal ,  Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Brian V. Mech ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  Dao Min Zhou

    发明人： Rajat Agrawal ,  Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Brian V. Mech ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  Dao Min Zhou

    IPC分类号： A61N1/00

    CPC分类号： A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  A61N1/36046

    摘要： A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a central opening in the area of the metal traces. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a soft polymer filling an attachment point. A flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a hump to avoid a touching of the flexible electrode array and the optic nerve.

    摘要翻译： 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 和金属痕迹区域的中心开口。 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 和填充附着点的软质聚合物。 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 和一个驼峰以避免触摸柔性电极阵列和视神经。