摘要:
An internal circuitry protection scheme which protects on-IC circuitry when an external regulator voltage pin is shorted to a higher voltage. The circuit prevents damage to the on-die circuitry that is on the internal voltage rail, by clamping the received voltage, thereby eliminating the chance of damaging the on die circuitry. The circuit offers protection even if the voltage difference is large, but the difference remains small between the internal rail and the external regulated voltage under normal operation.
摘要:
An integrated circuit (10) is disclosed comprising a fundamental frequency oscillator comprising a reference node (32) whose voltage varies between a high threshold and a low threshold. The fundamental frequency oscillator is operable to generate a first output at the fundamental frequency on a first output node (36). The integrated circuit (10) also comprises a circuit (C2) coupled to the reference node. The circuit (C2) is operable to sense the voltage at the reference node (32), to determine when the voltage exceeds an intermediate threshold between the high threshold and the low threshold, and to generate a second output in response to the determination. The integrated circuit (10) also comprises logic (40) coupled to the circuit (C2) and load circuitry (50) coupled to the logic (40). The logic (40) is operable to generate an output signal at an output frequency greater than the fundamental frequency in response to the second output and the first output.
摘要:
A controlled area network (CAN) driver provides improved symmetry between its differential output signals CAN-H and CAN-L, and provides protection for its low voltage devices from voltage transients occurring on its output lines. A plurality of CAN drivers 80 are serially interconnected to form a driver system, wherein each downstream driver stage receives a time-delayed form of the digital input signal TxD, each stage providing a time-delayed contribution to the differential output signals of the overall driver system.
摘要:
One aspect of the invention is an integrated circuit (10 or 110) comprising an amplifier (11 or 111) having at least two poles in its frequency response and an output impedance compensation circuit (M1A, M2, M3, AC1 or M1A, M2, M3, M4, AC1) coupled to an output node (30) of the amplifier (11 or 111). The output impedance compensation circuit (M1A, M2, M3, AC1 or M1A, M2, M3, M4, AC1) is operable to create a feedback signal proportional to the impedance of an output load (50) coupled to the output node (30), and create a zero in the frequency response of the amplifier (11 or 111) in response to the feedback signal between the at least two poles.
摘要:
A circuit for protecting a transistor against electrical transients. The circuit comprises a first diode coupled between a first terminal coupled to a power supply and a control terminal of the protected transistor. The circuit also comprises a second diode and a resistor coupling the control terminal of the protected transistor to a reference potential. A second transistor is coupled in shunt to the protected transistor. The voltage on the control terminal of the second transistor is determined by the current through the resistor. The embodiments may be implemented in an integrated circuit wherein the second, shunting transistor is formed from parasitic elements within the semiconductor body in which the protected transistor is formed. In one embodiment, the protected MOS transistor is formed in an n-well 504 and a shunting bipolar transistor is formed between the n-well 504 and an n-doped guard ring 500 formed adjacent to the n-well in the p-doped substrate 508.
摘要:
A transistor including a source region 506 in a semiconductor body 502; a bulk region 508 in the semiconductor body adjacent the source region; a drain region in the semiconductor body adjacent the bulk region but opposite the source region, the drain region including doped regions 504,514 of n and p dopant types; and a field plate 516 formed over the semiconductor body adjacent the drain region between the drain region and the bulk region.
摘要:
An EEPROM cell (10) formed on a substrate (18) using conventional process steps is provided. The cell (10) includes first (12) and second (14) conductive regions in the substrate (18) below the substrate's outer surface (28), and the first (12) and second (14) conductive regions are laterally displaced from one another by a predetermined distance (32). The cell (10) also includes an insulating layer (20) outwardly from the outer surface (28) of the substrate (18) positioned so that its edges are substantially in alignment between the first (12) and second (14) conductive regions. The cell (10) further includes a floating gate layer (22) outwardly from the insulating layer (20) and in substantially the same shape as the insulating layer (20). The cell (10) also includes a diffusion region (24 or 26) that extends laterally from at least one of the first (12) and second (14) conductive regions so as to overlap with the insulating layer (20). The diffusion region (24 or 26) provides a source of charge for placement on the floating gate layer (22) when programming the EEPROM cell (10).
摘要:
An optimized power output clamping structure, includes a power output transistor having a first breakdown voltage and a breakdown structure having a second breakdown voltage coupled to the power output transistor. The second breakdown voltage is less than the first breakdown voltage and follows the first breakdown voltage across all temperature and semiconductor process variations. This feature allows a reduction in breakdown voltage guardbanding and increases output structure reliability. A method of protecting a circuit from inductive flyback is also disclosed. The method includes the steps of driving an inductive load with drive circuitry, turning off the inductive load, and clamping an inductive voltage at a voltage magnitude that protects the drive circuitry from breakdown across all temperature and processing variations.
摘要:
A circuit and method for providing a low drop out voltage regulator. A source follower circuit is provided having a transistor (MD1) with an output terminal for driving a load at its source terminal and a voltage supply coupled to the drain terminal. At least one diode (D1) is coupled between the gate terminal and a ground reference to provide a predetermined voltage at the gate of the transistor (MD1). A voltage multiplier circuit is provided having an input (IN) for receiving an oscillating input voltage and a charge storage device (39) coupled between the oscillating input and a voltage reference (Vref), and being further coupled in series with the voltage reference and then to the gate terminal of the transistor (MD1). The oscillating input voltage is used to charge the charge storage device (39) to a voltage approximately equal to the voltage reference. When the supply voltage falls below the normal level, the series combination of the voltage reference and the charge storage device provides a multiplied voltage at the gate of the transistor, for example a voltage of twice the reference voltage. This high gate voltage keeps the output at the source of the transistor at a high voltage that is approximately equal to the supply voltage, such that the circuit provides a low drop out voltage under low supply voltage conditions.
摘要:
A testable temperature warning circuit (120) in an integrated circuit substrate (124) provides a warning if the substrate temperature exceeds a critical temperature. A programming circuit (140) controls a selection, circuit (128) to establish a programmably selectable temperature at either the critical temperature or a second predetermined temperature lower than the critical temperature to enable the warning circuit operation to be tested at a temperature lower than the critical temperature. In one embodiment, the selection circuit 128 comprises a current source that produces a voltage drop across the resistor 121 and base-emitter of the transistor 122 produces a substrate temperature indicating current of magnitude related to the temperature of the substrate. The substrate temperature indicating current at the second temperature is extrapolatingly related to the substrate temperature indicating current at the critical temperature. A method is also presented for testing a temperature warning circuit fabricated in an integrated circuit substrate.