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    Electrical connector with elastomeric pad having compressor fingers each including a filler member to mitigate relaxation of the elastomer
    2.
    发明授权
    Electrical connector with elastomeric pad having compressor fingers each including a filler member to mitigate relaxation of the elastomer 失效
    具有弹性体垫的电连接器，其具有压缩机指状件，每个包括填充构件以减轻弹性体的松弛

    公开(公告)号：US06991473B1

    公开(公告)日：2006-01-31

    申请号：US11000453

    申请日：2004-11-30

    申请人： Gregory Ervin Balcome ,  Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Gregory Ervin Balcome ,  Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H01R12/00 ,  H05K1/00

    CPC分类号： H01R12/62 ,  H01R13/24 ,  H01R13/6215 ,  H05K3/365 ,  H05K2201/10393

    摘要： An electrical connector includes connector pads on a printed circuit board and contact members on an insulating substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate and thereby presses the contact members against the contact pads. To counteract the inherent tendency of the compressor fingers to undergo stress relaxation after the compressor mat has been clamped, the connector also includes filler members disposed at least partially within the compressor fingers, essentially a “button-within-a-button” arrangement. Optionally, a filler deflection member may be interposed between the compression mat and a clamping plate of the clamping arrangement so that the filler deflection member abuts against the filler members. Alternatively, the filler members may be integral features of the deflection member.

    摘要翻译： 电连接器包括印刷电路板上的连接器焊盘和绝缘基板上的接触部件。 接触构件通过具有压缩指状物的压缩垫压靠在接触垫上。 夹紧装置迫使压缩机手指抵靠基板，从而将接触构件压靠在接触垫上。 为了抵消在压缩机垫被夹紧之后压缩机手指经受应力松弛的固有趋势，连接器还包括至少部分地设置在压缩机指状件内的填充构件，基本上是“按钮内按钮”结构。 可选地，填料偏转构件可插入在压缩垫和夹紧装置的夹紧板之间，使得填料偏转构件抵靠填料构件。 或者，填充构件可以是偏转构件的整体特征。

    VIA STUB ELIMINATION
    3.
    发明申请
    VIA STUB ELIMINATION 审中-公开
    通过立场消除

    公开(公告)号：US20120211273A1

    公开(公告)日：2012-08-23

    申请号：US13417023

    申请日：2012-03-09

    申请人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H05K1/11 ,  H05K3/00

    CPC分类号： H05K3/429 ,  B33Y80/00 ,  H05K1/0237 ,  H05K1/115 ,  H05K3/0082 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/09645 ,  H05K2203/056 ,  H05K2203/0565 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place.

    摘要翻译： 公开了用于印刷电路板（PWB）和其它基板中的通孔短截线的增强机构。 在一个实施例中，衬底包括多个绝缘体层和内部导电迹线。 第一和第二通孔完全延伸穿过衬底并且分别穿过在衬底内的不同深度的第一和第二内部导电迹线。 光刻技术用于在将第一和第二导电通孔分别电镀到第一和第二通孔之前，在通孔中产生受控的可变深度的电镀通孔（PTH）插头。 控制这些PTH插头的深度（例如，使用光掩模和/或可变激光功率）来防止第一和第二导电通孔分别基本上延伸超出第一和第二内部导电迹线，从而防止通孔短路 形成在第一位。

    Horizontally Split Vias
    4.
    发明申请
    Horizontally Split Vias 有权
    水平分流通风口

    公开(公告)号：US20100044096A1

    公开(公告)日：2010-02-25

    申请号：US12193842

    申请日：2008-08-19

    申请人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H05K1/11 ,  B05D5/12 ,  B05D3/00

    CPC分类号： H05K3/429 ,  B33Y30/00 ,  B33Y80/00 ,  H05K1/115 ,  H05K3/0082 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2203/056 ,  H05K2203/0565 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A mechanism is disclosed for providing horizontally split vias are provided in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×.

    摘要翻译： 公开了一种用于在印刷电路板（PWB）和其它基板中提供水平分割通孔的机构。 在一个实施例中，衬底包括多个绝缘体层和内部导电迹线。 第一和第二通孔完全延伸穿过衬底并且分别穿过在衬底内的不同深度的内部导电迹线的第一/第二和第三/第四通孔。 光刻技术用于在将第一/第二导电通孔电镀到第一通孔上之前并且在将第三/第四导电通孔电镀到第一通孔之前，在通孔中产生受控的可变深度的电镀通孔（PTH）插头 第二通孔。 控制这些PTH插头的深度（例如，使用光掩模和/或可变激光功率）来防止导电通孔基本上延伸超过它们各自的内部导电迹线，从而水平地喷射镀在每个通孔上的两个导电通孔， 孔。 这有利地将布线密度提高到2×。

    Method for via stub elimination
    5.
    发明授权
    Method for via stub elimination 有权
    通过短截线消除的方法

    公开(公告)号：US08230592B2

    公开(公告)日：2012-07-31

    申请号：US12193837

    申请日：2008-08-19

    申请人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H01K3/10

    CPC分类号： H05K3/429 ,  B33Y80/00 ,  H05K1/0237 ,  H05K1/115 ,  H05K3/0082 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/09645 ,  H05K2203/056 ,  H05K2203/0565 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. This advantageously eliminates the costly and time consuming process of via stub backdrilling.

    摘要翻译： 公开了用于印刷电路板（PWB）和其它基板中的通孔短截线的增强机构。 在一个实施例中，衬底包括多个绝缘体层和内部导电迹线。 第一和第二通孔完全延伸穿过衬底并且分别穿过在衬底内的不同深度的第一和第二内部导电迹线。 光刻技术用于在将第一和第二导电通孔分别电镀到第一和第二通孔之前，在通孔中产生受控的可变深度的电镀通孔（PTH）插头。 控制这些PTH插头的深度（例如，使用光掩模和/或可变激光功率）来防止第一和第二导电通孔分别基本上延伸超出第一和第二内部导电迹线，从而防止通孔短路 形成在第一位。 这有利地消除了通过短管回钻的昂贵且耗时的过程。

    Method of forming a substrate having a plurality of insulator layers
    6.
    发明授权
    Method of forming a substrate having a plurality of insulator layers 有权
    形成具有多个绝缘体层的衬底的方法

    公开(公告)号：US08136240B2

    公开(公告)日：2012-03-20

    申请号：US12193842

    申请日：2008-08-19

    申请人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H01K3/00

    CPC分类号： H05K3/429 ,  B33Y30/00 ,  B33Y80/00 ,  H05K1/115 ,  H05K3/0082 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2203/056 ,  H05K2203/0565 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A mechanism is disclosed for providing horizontally split vias in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×.

    摘要翻译： 公开了用于在印刷电路板（PWB）和其它基板中提供水平分开的通孔的机构。 在一个实施例中，衬底包括多个绝缘体层和内部导电迹线。 第一和第二通孔完全延伸穿过衬底并且分别穿过在衬底内的不同深度的内部导电迹线的第一/第二和第三/第四通孔。 光刻技术用于在将第一/第二导电通孔电镀到第一通孔上之前并且在将第三/第四导电通孔电镀到第一通孔之前，在通孔中产生受控的可变深度的电镀通孔（PTH）插头 第二通孔。 控制这些PTH插头的深度（例如，使用光掩模和/或可变激光功率）来防止导电通孔基本上延伸超过它们各自的内部导电迹线，从而水平地喷射镀在每个通孔上的两个导电通孔， 孔。 这有利地将布线密度提高到2×。

    Via Stub Elimination
    7.
    发明申请
    Via Stub Elimination 有权
    通过短截线消除

    公开(公告)号：US20100044095A1

    公开(公告)日：2010-02-25

    申请号：US12193837

    申请日：2008-08-19

    申请人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： H05K1/11

    CPC分类号： H05K3/429 ,  B33Y80/00 ,  H05K1/0237 ,  H05K1/115 ,  H05K3/0082 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/09645 ,  H05K2203/056 ,  H05K2203/0565 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. This advantageously eliminates the costly and time consuming process of via stub backdrilling.

    摘要翻译： 公开了用于印刷电路板（PWB）和其它基板中的通孔短截线的增强机构。 在一个实施例中，衬底包括多个绝缘体层和内部导电迹线。 第一和第二通孔完全延伸穿过衬底并且分别穿过在衬底内的不同深度的第一和第二内部导电迹线。 光刻技术用于在将第一和第二导电通孔分别电镀到第一和第二通孔之前，在通孔中产生受控的可变深度的电镀通孔（PTH）插头。 控制这些PTH插头的深度（例如，使用光掩模和/或可变激光功率）来防止第一和第二导电通孔分别基本上延伸超出第一和第二内部导电迹线，从而防止通孔短路 形成在第一位。 这有利地消除了通过短管回钻的昂贵且耗时的过程。

    Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability
    8.
    发明申请
    Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability 审中-公开
    一种能够轻松地从另一种底物去除另一种底物的装置和方法，用于增强返工性和回收性

    公开(公告)号：US20080264563A1

    公开(公告)日：2008-10-30

    申请号：US11740350

    申请日：2007-04-26

    申请人： Joseph Kuczynski ,  Donald D. Severson ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    发明人： Joseph Kuczynski ,  Donald D. Severson ,  Kevin Albert Splittstoesser ,  Timothy Jerome Tofil ,  Paul Alan Vermilyea

    IPC分类号： B29C63/00

    CPC分类号： B29C63/0013 ,  B29L2031/744 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T428/14

    摘要： A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or recyclability. An adhesive layer affixes the substrates to each other. A coating that includes a dewetting agent (DA) is interposed between the second substrate and the adhesive layer. Removal is facilitated by applying heat and/or pressure to activate the DA. Preferably, the DA thermally decomposes to form gaseous products at a predefined temperature. Heat may be applied through one or more of the substrates to drive the DA to decomposition, which forms bubbles that lift the first substrate relative to the second substrate. Optionally, the DA may be encapsulated in microspheres. For example, the DA may be silicone oil and/or an adhesive solvent encapsulated in microspheres and may be activated by applying pressure sufficient to crush the microspheres.

    摘要翻译： 一种方法和装置使得能够从第二基板（例如，计算机外壳的盖子）容易地移除第一基板（例如，标签，EMC垫片等），以增强可再加工性或可再循环性。 粘合剂层将基板彼此粘合。 包含去湿剂（DA）的涂层插入在第二基材和粘合剂层之间。 通过施加热和/或压力来激活DA来促进去除。 优选地，DA在预定温度下热分解形成气态产物。 可以通过一个或多个基底施加热量以驱动DA分解，其形成相对于第二基底提升第一基底的气泡。 任选地，DA可以包封在微球体中。 例如，DA可以是硅油和/或包封在微球中的粘合剂溶剂，并且可以通过施加足以压碎微球的压力来活化。