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公开(公告)号：US09105391B2
公开(公告)日：2015-08-11
申请号：US12370208
申请日：2009-02-12
IPC分类号： H01F5/00 , H01F27/28 , H01L27/08 , H01F19/04 , H01F19/08 , H01F27/32 , H03F3/45 , H03H7/52 , H04L25/02 , H01F17/00 , H01F27/40
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/0013 , H01F19/04 , H01F19/08 , H01F27/324 , H01F27/40 , H01F2019/085 , H01F2027/2809 , H01L2224/48137 , H01L2224/48195 , H01L2224/49175 , H01L2924/3025 , H03F3/45192 , H03F3/45475 , H03F2203/45008 , H03F2203/45101 , H03F2203/45586 , H03H7/52 , H04L25/0266 , Y10T29/4902 , H01L2924/00
摘要： Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material.
摘要翻译： 这里公开的线圈换能器的各种实施例被配置为在小包装中提供高电压隔离和高电压击穿性能特性。 线圈换能器被提供穿过并且可以通过设置在其相对侧上的主要和次要线圈传送和接收数据或功率信号，而不在其间发生高压击穿。 中心芯层将发射和接收线圈分开，并且没有通孔布置。 线圈换能器的至少部分由电绝缘的非金属非半导体低介电损耗材料形成。
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公开(公告)号：US20090243782A1
公开(公告)日：2009-10-01
申请号：US12370208
申请日：2009-02-12
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/0013 , H01F19/04 , H01F19/08 , H01F27/324 , H01F27/40 , H01F2019/085 , H01F2027/2809 , H01L2224/48137 , H01L2224/48195 , H01L2224/49175 , H01L2924/3025 , H03F3/45192 , H03F3/45475 , H03F2203/45008 , H03F2203/45101 , H03F2203/45586 , H03H7/52 , H04L25/0266 , Y10T29/4902 , H01L2924/00
摘要： Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material.
摘要翻译： 这里公开的线圈换能器的各种实施例被配置为在小包装中提供高电压隔离和高电压击穿性能特性。 线圈换能器被提供穿过并且可以通过设置在其相对侧上的主要和次要线圈传送和接收数据或功率信号，而不在其间发生高压击穿。 中心芯层将发射和接收线圈分开，并且没有通孔布置。 线圈换能器的至少部分由电绝缘的非金属非半导体低介电损耗材料形成。
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公开(公告)号：US5986339A
公开(公告)日：1999-11-16
申请号：US115575
申请日：1998-07-14
申请人： Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
发明人： Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
IPC分类号： H05K1/11 , H05K3/00 , H05K3/46 , H01L23/053 , H01L23/48
CPC分类号： H05K3/462 , H01L2224/81894 , H05K1/113 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2203/063 , H05K2203/1572 , H05K3/0094 , H05K3/4623 , H05K3/4647
摘要： A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
摘要翻译： 多层封装包括多个互连的大层数（LLC）衬底。 LLC基板各自包括在基板的顶表面和底表面上的导电焊盘，衬底中的通孔包括用于接触顶表面和底表面上的焊盘的导电材料，以及在通孔上的焊盘上的柱。 基板的支柱彼此面对并相互抵接，并电连接在一起。 不可流动的粘合膜将LLC基底机械地结合，并且具有接收基底的柱的孔。
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公开(公告)号：US5786238A
公开(公告)日：1998-07-28
申请号：US799128
申请日：1997-02-13
申请人： Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
发明人： Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
CPC分类号： H05K3/462 , H01L2224/81894 , H05K1/113 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2203/063 , H05K2203/1572 , H05K3/0094 , H05K3/4623 , H05K3/4647
摘要： A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.
摘要翻译： 层叠大层数（LLC）衬底的工艺包括通过各自的衬底形成第一和第二过孔。 通过各个通孔中的每一个形成导电路径，并且在相应的通路上形成柱，电连接到相应的导电路径。 具有孔的不可流动的粘合剂层设置在LLC衬底之间，使得柱通过孔彼此面对。 LLC基底通过不可流动的粘合剂层压在一起，以将它们机械地结合在一起，使得柱彼此邻接。 同时，孔在孔中彼此电接合。
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