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    OPTICAL ELECTRONIC PACKAGE
    1.
    发明申请
    OPTICAL ELECTRONIC PACKAGE 有权
    光电子包装

    公开(公告)号：US20130009173A1

    公开(公告)日：2013-01-10

    申请号：US13531638

    申请日：2012-06-25

    申请人： Julien Vittu ,  Romain Coffy

    发明人： Julien Vittu ,  Romain Coffy

    IPC分类号： H01L33/48

    CPC分类号： G01S17/026 ,  G01J1/0271 ,  G01J1/0403 ,  G01J1/0407 ,  G01S7/4813 ,  H01L25/167 ,  H01L31/16 ,  H01L33/48 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A receiving integrated circuit chip is mounted on the rear face and includes an optical sensor situated opposite the blind cavity. A transparent encapsulant extends above the optical sensor and at least partially fills the through passage. An emitting integrated circuit chip, embedded in the transparent encapsulant, includes an optical emitter of luminous radiation. The emitting integrated circuit chip may be mounted to the front face or within the through passage to the receiving integrated circuit chip. The substrate wafer may further include a second through passage. The receiving integrated circuit chip further includes a second optical sensor situated opposite the second through passage. A cover plate is mounted to the front face at the second through passage.

    摘要翻译： 电子封装包括具有前表面和后表面的基底晶片和具有前窗和与前窗横向连通的盲腔的通孔。 接收集成电路芯片安装在后表面上并且包括位于盲腔相对的光学传感器。 透明密封剂在光学传感器上方延伸并且至少部分地填充通过通道。 嵌入在透明密封剂中的发射集成电路芯片包括发光体的发光体。 发射集成电路芯片可以安装到前面或通向接收集成电路芯片的通路内。 衬底晶片还可以包括第二穿通通道。 接收集成电路芯片还包括与第二贯穿通道相对的第二光学传感器。 盖板在第二通道处被安装到前表面。

    Optical semiconductor housing and method for making same
    2.
    发明授权
    Optical semiconductor housing and method for making same 有权
    光学半导体外壳及其制造方法

    公开(公告)号：US06787869B1

    公开(公告)日：2004-09-07

    申请号：US10129312

    申请日：2002-09-20

    申请人： Julien Vittu

    发明人： Julien Vittu

    IPC分类号： H01L310203

    CPC分类号： H01L31/0203 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/00014

    摘要： Optical semiconductor package (10) and process for fabricating an optical semiconductor package, in which an electrical connection support plate has a through-passage (37); a semiconductor component (34), a front face (33) of which has an optical sensor and which is fixed to a rear face of the plate in such a way that its optical sensor is situated opposite the through-passage; electrical connection (38) connects the optical component to the support plate; the component is encapsulated on the rear face of the support plate; a lid (50), which is at least partially transparent, is fixed to a front face of the support plate and covers the through-passage; and external electrical connections (51) are located on an exposed part of the support plate. Furthermore, another semiconductor component (41) may be fixed to the rear face of the support plate (43) and electrically connected, to the latter, this component also being encapsulated (49).

    摘要翻译： 光学半导体封装（10）以及用于制造光学半导体封装的工艺，其中电连接支撑板具有通孔（37）; 半导体部件（34），其前表面（33）具有光学传感器，并且固定到所述板的后表面，使得其光学传感器位于与通路相对的位置; 电连接（38）将光学部件连接到支撑板; 该部件被封装在支撑板的后表面上; 至少部分透明的盖子（50）固定到支撑板的前表面并覆盖通过通道; 并且外部电连接（51）位于支撑板的暴露部分上。 此外，另外的半导体部件（41）也可以固定在支撑板（43）的背面，并与后者电连接，该部件也被封装（49）。

    Semiconductor package
    4.
    发明申请
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US20050046010A1

    公开(公告)日：2005-03-03

    申请号：US10827610

    申请日：2004-04-19

    申请人： Julien Vittu

    发明人： Julien Vittu

    IPC分类号： G02B7/02 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L31/0203 ,  H01L31/0232

    CPC分类号： H01L31/0203 ,  G02B7/022 ,  H01L31/02325 ,  H04N5/2257

    摘要： A semiconductor package includes a body having a cavity closed by a lid. In the cavity, an integrated-circuit chip is placed. Electrical connection leads are carried by the body. These leads have resilient inner terminal parts which lie in the cavity and are suitable for being in contact with electrical connection pads on the said chip. The lid acts so as to keep the said inner terminal parts of the leads in resilient contact on the electrical connection pads on the chip.

    摘要翻译： 半导体封装包括具有由盖封闭的空腔的主体。 在空腔中放置集成电路芯片。 电气连接引线由机体承载。 这些引线具有弹性内端子部分，其位于空腔中并且适于与所述芯片上的电连接焊盘接触。 盖子用于将引线的所述内部端子部分弹性接触保持在芯片上的电连接焊盘上。

    Device comprising a camera module with automatic focusing and corresponding assembly method
    5.
    发明授权
    Device comprising a camera module with automatic focusing and corresponding assembly method 有权
    装置包括具有自动对焦的相机模块和相应的装配方法

    公开(公告)号：US07893992B2

    公开(公告)日：2011-02-22

    申请号：US11351352

    申请日：2006-02-09

    申请人： Julien Vittu

    发明人： Julien Vittu

    IPC分类号： H04N5/225 ,  H04N5/232

    CPC分类号： G03B29/00 ,  G03B13/36 ,  G03B17/12 ,  G03B17/16 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212

    摘要： Device comprising a camera module with automatic focusing itself comprising an optical chip (8) and an optical block (7), the optical block (7) integrating at least an objective (3), at least a focusing means (11) for adjusting the focus of the objective (3), the optical chip (8) integrating at least an image sensor (14) placed on a first face of a substrate of the optical chip (8). This optical chip (8) also includes a microprocessor (4) placed on the same substrate, receiving image signals originating from the image sensor (14) and generating a control signal based on the said image signals, that is applied to the said focusing means (11) to focus the objective (3).

    摘要翻译： 具有包括光学芯片和光学块的自动对焦的相机模块的装置，至少集成了一个物镜的光学块，至少一个用于调节物镜焦点的聚焦电路，至少集成了一个放置在其上的图像传感器的光学芯片 光学芯片的基板的第一面。 该光学芯片还包括放置在相同基板上的微处理器，接收源自图像传感器的图像信号，并基于所述图像信号生成控制信号，该信号被施加到所述聚焦装置以聚焦目标。

    OPTICAL SEMICONDUCTOR PACKAGE WITH COMPRESSIBLE ADJUSTMENT MEANS
    6.
    发明申请
    OPTICAL SEMICONDUCTOR PACKAGE WITH COMPRESSIBLE ADJUSTMENT MEANS 有权
    光学半导体封装具有可调整的调整手段

    公开(公告)号：US20090184385A1

    公开(公告)日：2009-07-23

    申请号：US12364557

    申请日：2009-02-03

    申请人： Julien Vittu

    发明人： Julien Vittu

    IPC分类号： H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An optical semiconductor package includes a support with a passage to receive a ring holding a lens situated facing an optical sensor. The support has, in the passage, at least one local release recess and the ring is equipped peripherally with a locally projecting, elastically deformable element. The local release recess and the elastically deformable element are such that, when the ring occupies an angular mounting position, the locally projecting elastically deformable element is engaged in the local recess of the support and, when the ring is pivoted from the aforementioned angular mounting position, the locally projecting elastically deformable element is moved out of the recess of the support and is compressed against the wall of the passage in order to secure the ring relative to the support.

    摘要翻译： 光学半导体封装包括具有通道的支撑件，该通道用于接收保持面向光学传感器的透镜的环。 在通道中，支撑件具有至少一个局部释放凹部，并且环周边配备有局部突出的可弹性变形的元件。 局部释放凹部和可弹性变形的元件使得当环处于角度安装位置时，局部突出的可弹性变形的元件接合在支撑件的局部凹槽中，并且当环从上述角度安装位置枢转时 ，局部突出的可弹性变形的元件从支撑件的凹部移出并被压靠在通道的壁上，以便相对于支撑件固定环。

    Optical semiconductor package with compressible adjustment means
    7.
    发明申请
    Optical semiconductor package with compressible adjustment means 有权
    具有可压缩调节装置的光学半导体封装

    公开(公告)号：US20050230772A1

    公开(公告)日：2005-10-20

    申请号：US11108624

    申请日：2005-04-18

    申请人： Julien Vittu

    发明人： Julien Vittu

    IPC分类号： G02B7/02 ,  H01L27/14 ,  H01L31/0203 ,  H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An optical semiconductor package includes a support with a passage to receive a ring holding a lens situated facing an optical sensor. The support has, in the passage, at least one local release recess and the ring is equipped peripherally with a locally projecting, elastically deformable element. The local release recess and the elastically deformable element are such that, when the ring occupies an angular mounting position, the locally projecting elastically deformable element is engaged in the local recess of the support and, when the ring is pivoted from the aforementioned angular mounting position, the locally projecting elastically deformable element is moved out of the recess of the support and is compressed against the wall of the passage in order to secure the ring relative to the support.

    摘要翻译： 光学半导体封装包括具有通道的支撑件，该通道用于接收保持面向光学传感器的透镜的环。 在通道中，支撑件具有至少一个局部释放凹部，并且环周边配备有局部突出的可弹性变形的元件。 局部释放凹部和可弹性变形的元件使得当环处于角度安装位置时，局部突出的可弹性变形的元件接合在支撑件的局部凹槽中，并且当环从上述角度安装位置枢转时 ，局部突出的可弹性变形的元件从支撑件的凹部移出并被压靠在通道的壁上，以便相对于支撑件固定环。

    Optical semiconductor housing and method for making same
    8.
    发明授权
    Optical semiconductor housing and method for making same 有权
    光学半导体外壳及其制造方法

    公开(公告)号：US06713876B1

    公开(公告)日：2004-03-30

    申请号：US10129372

    申请日：2002-10-01

    申请人： Julien Vittu ,  Remi Brechignac

    发明人： Julien Vittu ,  Remi Brechignac

    IPC分类号： H01L310232

    CPC分类号： H01L31/0203 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Optical semiconductor package and process for fabricating an optical semiconductor package, in which an electrical connection support plate (2) has a through-passage (5); a first semiconductor component (4) such as a microprocessor placed behind the support plate and lying opposite the through-passage; electrical connection metal balls (9) inserted into the annular space separating the first component from the support plate; encapsulation mechanism including an encapsulation material (12) lying in the annular space; a second semiconductor component (13), a front face (15) of which has an optical sensor and a rear face of which is fixed to the front face (20) of the first component (4) through the through-passage (5) of the support plate (2); metal electrical connection wires (17) connecting the front face of the second component and the front face of the support plate; a front encapsulation lid (21) which covers the through-passage and the metal wires at some distance and which has at least one transparent part (23) lying in front of the optical sensor, and external electrical connection (25) located on an exposed part of the support plate.

    摘要翻译： 光学半导体封装以及用于制造光学半导体封装的工艺，其中电连接支撑板（2）具有通路（5）; 第一半导体部件（4），例如放置在支撑板后面并与通路对置的微处理器; 插入到将第一部件与支撑板分离的环形空间中的电连接金属球（9） 封装机构包括位于环形空间中的封装材料（12）; 第二半导体部件（13），其前表面（15）具有光学传感器，并且其后表面经由通路（5）固定到第一部件（4）的前表面（20） 的支撑板（2）; 连接第二部件的前表面和支撑板的前表面的金属电连接线（17） 在所述光学传感器的前面具有至少一个透明部分（23）的外部电连接（25），所述前部封装盖（21）在一定距离处覆盖所述通路和所述金属线， 部分支撑板。