摘要:
A package for light emitting element including a package main body 1 having a bottom face 7a on which a light emitting element 2 is arranged, and a concave portion 7 which is formed in an inverted truncated cone shape by an inner wall face 7b intersecting with the bottom face 7a with a predetermined angle, and a translucent member 6 filled in the concave portion 7 of the package main body 1, the angle between the inner wall face 7b composing the concave portion 7 and the bottom face 7a is selected within ±15° of the incident critical angle in which a direct light radiated from the light emitting element 2 undergoes total reflection at the interface between the translucent member 6 and air.
摘要:
A buried heterostructure type distributed feedback semiconductor laser comprises a semiconductor substrate transparent to an oscillation light beam, a laser stripe including a diffraction grating, an active layer, and a guiding layer formed on the semiconductor substrate, and semiconductor peripheral region formed so as to cover the laser stripe on the semiconductor substrate. The semiconductor peripheral region is transparent to an oscillation light beam. Rectangular grooves are formed near both sides of emission facet of the laser stripe more deeply than the laser stripe. Since a radiation mode from the laser stripe is reflected and scattered by the grooves, it cannot hardly reach the emission facet. Therefore, the radiation mode does not interfere with an output beam from the laser.
摘要:
Disclosed is a grating-coupled surface emitting laser capable of obtaining a beam with high directivity, structured by forming a light output window in a limited regions with high intensity radiations along the propagation direction. Its intensity distribution of radiation mode along the axis can be controlled by injecting a current independently into the multiply-divided electrodes or by pumping optically these electrodes independently. The control is, in principle, achieved by an equivalent change of the phase-shift of the gratings.
摘要:
An embodiment of the invention provides a light emitting device in which a semiconductor laser diode is used as a light source to efficiently obtain visible light having high uniformity of a luminance distribution. The light emitting device has a semiconductor laser diode that emits a laser beam. And the device has a light guide component that includes an upper surface, a lower surface, two side faces opposite each other, and two end faces opposite each other, the laser beam being incident from a first end face of the light guide component, the light guide component having indentation in the lower surface, the laser beam being reflected by the lower surface and emitted in an upper surface direction. The light emitting device also has a luminous component that is provided on an upper surface side of the light guide component and absorbs the laser beam emitted from the light guide component and emits visible light. And the device has a substance that is in contact with the lower surface and two side faces of the light guide component, a refractive index of the substance being lower than that of the light guide component.
摘要:
A medium having the function of light emission or optical amplification induced by optical pumping is surrounded by an annular laser (ring laser) having a diffraction grating (holographic structure) of the second order or more. The output of the ring laser emits through this diffraction grating (holographic structure) and is extracted as radiation mode. This is used as pumping light to be input to the medium that is disposed in the vicinity of the center of the assembly. To stabilize the threshold of the longitudinal mode, which has a greater amount of radiation mode, a gain medium and a reflective structure could be further provided around the periphery of this ring laser. This element also plays a role of optical pumping from the sides of a VCSEL.
摘要:
Disclosed are a semiconductor light emitting element whose temperature characteristics are compensated for so as to provide a stable temperature characteristics in a temperature range from -40.degree. C. to +85.degree. C., and an optical fiber transmission system using the same semiconductor light emitting element. In the semiconductor light emitting element, an active layer (2) is buried on an n-type InP semiconductor substrate (1) formed with an n-side electrode (21). The upper layers (4, 5) are covered with an insulating film (22). A p-side electrode (20) is formed on the uppermost layer of the semiconductor substrate so as to cover the insulating film (22). A relatively large metallic resistance element (30) whose resistance increases with increasing temperature is wired on the insulating film (22) as a shunt path, so as to compensate for the temperature characteristics of the semiconductor light emitting element. Therefore, since leakage current is large at a low temperature, the threshold current is high, so that the slope efficiency is small. On the other hand, since leakage current is reduced at a high temperature, a rise in the threshold current and a drop of the slope efficiency can be both compensated for.
摘要:
A linear active layer, a current block layer and a clad layer are formed on the first major surface of a wafer, while a first electrode is formed on the second major surface of the wafer. A linear first opening is formed in the first electrode. The wafer exposed to the first opening is etched to form a first guide groove linearly extending in a direction perpendicular to the active layer. A second electrode is formed on the clad layer and etched to form a linear second opening therein. The clad layer, current block layer and wafer, located directly under the second opening, are etched to form a second guide groove thereon so as to extend in a direction parallel to the active layer. The wafer is cleaved along the first guide groove to form bars each having semiconductor lasers. The bars are arranged in parallel to one another and separated from one another by the second guide groove. The wafer is cleaved or cut along the second guide groove to obtain semiconductor chips.
摘要:
A light emitting device includes first and second electrodes, a semiconductor laser element, a bonding wire, a transparent frame section, and a lid section. The first electrode includes a convex section, a bottom surface surrounding the convex section, and a first surface. The second electrode includes a first surface opposed to the bottom surface of the first electrode and a second surface. The second electrode includes an opening section and a step section receding toward the first surface from the second surface. The semiconductor laser element is provided on the convex section and includes a light-emitting layer. The bonding wire is capable of electrically connecting the semiconductor laser element and the step section. The transparent frame section surrounds the convex section and is bonded to the bottom surface and the first surface of the second electrode. The lid section is bonded to the second surface of the second electrode.
摘要:
A light emitting device includes first and second electrodes, a semiconductor laser element, a bonding wire, a transparent frame section, and a lid section. The first electrode includes a convex section, a bottom surface surrounding the convex section, and a first surface. The second electrode includes a first surface opposed to the bottom surface of the first electrode and a second surface. The second electrode includes an opening section and a step section receding toward the first surface from the second surface. The semiconductor laser element is provided on the convex section and includes a light-emitting layer. The bonding wire is capable of electrically connecting the semiconductor laser element and the step section. The transparent frame section surrounds the convex section and is bonded to the bottom surface and the first surface of the second electrode. The lid section is bonded to the second surface of the second electrode.
摘要:
Both an electric energy applying mechanism and an optical waveguide mechanism can be provided to an ITO layer (transparent electrode) by constituting an optical waveguide so as that the guided mode profile spread into the ITO layer. Also a bonding pad is provided to supply a power and apply an electric field onto the ITO layer. Accordingly, a device structure can be simplified and thus improvement in yield of the optoelectronic device having an optical waveguide and improvement in parameters of the optoelectronic device can be achieved.