THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY

    公开(公告)号:US20250087270A1

    公开(公告)日:2025-03-13

    申请号:US18953248

    申请日:2024-11-20

    Inventor: Hiroshi MAEJIMA

    Abstract: A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.

    MEMORY DEVICE
    2.
    发明申请

    公开(公告)号:US20240420764A1

    公开(公告)日:2024-12-19

    申请号:US18732967

    申请日:2024-06-04

    Inventor: Hiroshi MAEJIMA

    Abstract: According to one embodiment, a memory device includes: a first chip including a first memory cell array; a second chip in contact with the first chip and including a second memory cell array; and a third chip in contact with the second chip and including a control circuit. The first memory cell array includes first and second transistors coupled in series. The second memory cell array includes third and fourth transistors coupled in series. The control circuit includes: fifth, sixth, and seventh transistors respectively having first ends coupled to gates of the first, third, and second and fourth transistors; a first decoder configured to switch a state of the fifth transistor; and a second decoder configured to switch a state of the sixth transistor independently of the state of the fifth transistor.

    SEMICONDUCTOR MEMORY DEVICE
    3.
    发明公开

    公开(公告)号:US20240257876A1

    公开(公告)日:2024-08-01

    申请号:US18631556

    申请日:2024-04-10

    Inventor: Hiroshi MAEJIMA

    CPC classification number: G11C16/0483 G11C16/08 G11C16/10 G11C16/26 G11C16/16

    Abstract: According to one embodiment, a semiconductor memory device includes: a first memory cell array; a second memory cell array arranged above the first memory cell array; a third memory cell array arranged adjacent to the first memory cell array; a fourth memory cell array arranged above the third memory cell array and arranged adjacent to the second memory cell array; a first word line coupled to the first memory cell array and the second memory cell array; a second word line coupled to the third memory cell array and the fourth memory cell array; a first bit line coupled to the first memory cell array and the fourth memory cell array; and a second bit line coupled to the second memory cell array and the third memory cell array.

    SEMICONDUCTOR STORAGE DEVICE
    5.
    发明公开

    公开(公告)号:US20230360703A1

    公开(公告)日:2023-11-09

    申请号:US18354484

    申请日:2023-07-18

    Inventor: Hiroshi MAEJIMA

    Abstract: A semiconductor storage device includes word lines extending in first and second directions, and separated from each other in a third direction, sense amplifier circuits that partially overlap the word lines in the third direction, memory strings intersecting the word lines and extending in the third direction, memory-side bit lines extending in the first direction, separated from each other in the second direction, and including first and second adjacent memory-side bit lines, circuit-side bit lines between the word lines and the sense amplifier circuits and partially overlapping the respective memory-side bit lines in the third direction, and contact plugs extending in the third direction and respectively connecting the memory-side bit lines and the circuit-side bit lines. The contact plugs include first and second contract plugs that are electrically connected to the first and second memory-side bit lines, respectively, and are not aligned along the first or second direction.

    SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请

    公开(公告)号:US20210082879A1

    公开(公告)日:2021-03-18

    申请号:US16806079

    申请日:2020-03-02

    Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a first voltage generator and a second voltage generator. The memory cell is provided above a substrate. The first voltage generator is provided between the substrate and the memory cell. The first voltage generator is configured to generate a first voltage to be supplied to the memory cell. The second voltage generator is provided between the substrate and the memory cell. The second voltage generator is configured to generate the first voltage and have a circuit configuration equivalent to the first voltage generator.

    SEMICONDUCTOR MEMORY DEVICE
    9.
    发明公开

    公开(公告)号:US20240096419A1

    公开(公告)日:2024-03-21

    申请号:US18524458

    申请日:2023-11-30

    Inventor: Hiroshi MAEJIMA

    Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.

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