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公开(公告)号:US20240188253A1
公开(公告)日:2024-06-06
申请号:US18461563
申请日:2023-09-06
Applicant: Kioxia Corporation
Inventor: Tomoya SANUKI , Yasuhito YOSHIMIZU , Yusuke HIGASHI , Hideko MUKAIDA
IPC: H05K7/20
CPC classification number: H05K7/20372 , H05K7/20381
Abstract: A semiconductor device according to an embodiment includes: a chamber including an internal structure capable of holding a pressure in the chamber lower than atmospheric pressure; one or a plurality of cooling member provided inside of the internal structure of the chamber, the cooling member holding and cooling a semiconductor device; and a heat transfer part exchanging heat with a refrigerator cooling the cooling member.
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公开(公告)号:US20240086077A1
公开(公告)日:2024-03-14
申请号:US18181824
申请日:2023-03-10
Applicant: Kioxia Corporation
Inventor: Tomoya SANUKI , Toshio FUJISAWA , Keisuke NAKATSUKA
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0659 , G06F3/0679
Abstract: According to one embodiment, a memory system includes a nonvolatile semiconductor storage device and a memory controller. The nonvolatile semiconductor storage device includes at least one memory device including a plurality of memory cells corresponding to a plurality of pages. The memory controller is configured to control the nonvolatile semiconductor storage device. The pages include a first page. The memory controller is configured to: read first data stored in the first page from the nonvolatile semiconductor storage device; correct a fail bit included in the read first data; generate first spare data including information on the fail bit corrected in the read first data; and store the first spare data in the nonvolatile semiconductor storage device.
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公开(公告)号:US20230197160A1
公开(公告)日:2023-06-22
申请号:US17898868
申请日:2022-08-30
Applicant: KIOXIA CORPORATION
Inventor: Tomoya SANUKI , Koji KOHARA , Keisuke NAKATSUKA
IPC: G11C16/10
CPC classification number: G11C16/10
Abstract: A data latch circuit includes a first transistor of a first conductivity type and a second transistor of the first conductivity type, and a third transistor of a second conductivity type and a fourth transistor of the second conductivity type. The third and fourth transistors are controlled to perform a first control operation to store data in the data latch circuit and to perform a second control operation to read the stored data.
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公开(公告)号:US20220223552A1
公开(公告)日:2022-07-14
申请号:US17695654
申请日:2022-03-15
Applicant: Kioxia Corporation
Inventor: Yasuhito YOSHIMIZU , Takashi FUKUSHIMA , Tatsuro HITOMI , Arata INOUE , Masayuki MIURA , Shinichi KANNO , Toshio FUJISAWA , Keisuke NAKATSUKA , Tomoya SANUKI
IPC: H01L23/00 , H01L23/544 , G06F11/07
Abstract: A memory chip unit includes a pad electrode including first and second portions, and a memory cell array. A prober includes a probe card and a movement mechanism. The probe card includes a probe electrode to be in contact with the pad electrode, and a memory controller electrically coupled to the probe electrode and executes reading and writing on the memory cell array. The movement mechanism executes a first operation that brings the probe electrode into contact with the first portion and does not bring the probe electrode into contact with the second portion, and a second operation that does not bring the probe electrode into contact with the first portion and brings the probe electrode into contact with the second portion.
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公开(公告)号:US20240304239A1
公开(公告)日:2024-09-12
申请号:US18587935
申请日:2024-02-26
Applicant: Kioxia Corporation
Inventor: Tomoya SANUKI , Yasuhito YOSHIMIZU
IPC: G11C11/4096 , G11C11/4074 , G11C11/408
CPC classification number: G11C11/4096 , G11C11/4074 , G11C11/4085
Abstract: A memory device includes a bit line, a source line, a first string in which a plurality of first memory cells are connected in series between the bit line and the source line, and a control circuit. The control circuit performs a sense operation for a search operation to determine if search data is stored in the plurality of first memory cells by supplying voltages to a plurality of word lines respectively corresponding to the plurality of first memory cells based on the search data and determining a similarity between the search data and data actually stored in the plurality of first memory cells based on a change in voltage of the bit line caused by current flowing between the bit line and the source line via the first string.
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公开(公告)号:US20230080259A1
公开(公告)日:2023-03-16
申请号:US18056508
申请日:2022-11-17
Applicant: Kioxia Corporation
Inventor: Tomoya SANUKI , Hiroshi MAEJIMA , Tetsuaki UTSUMI
IPC: H01L25/065 , H01L25/18 , H01L23/00
Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a first voltage generator and a second voltage generator. The memory cell is provided above a substrate. The first voltage generator is provided between the substrate and the memory cell. The first voltage generator is configured to generate a first voltage to be supplied to the memory cell. The second voltage generator is provided between the substrate and the memory cell. The second voltage generator is configured to generate the first voltage and have a circuit configuration equivalent to the first voltage generator.
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公开(公告)号:US20210296298A1
公开(公告)日:2021-09-23
申请号:US17005535
申请日:2020-08-28
Applicant: KIOXIA CORPORATION
Inventor: Tomoya SANUKI , Keisuke NAKATSUKA , Hiroshi MAEJIMA , Kenichiro YOSHII , Takashi MAEDA , Hideo WADA
Abstract: A semiconductor memory device includes a first chip and a second chip overlaid on the first chip. The second chip includes a memory cell array provided between a second semiconductor substrate and the first chip in a first direction, and first and second wires between the memory cell array and the first chip. The memory cell array includes three or more stacked bodies regularly arranged in a second direction perpendicular to the first direction and semiconductor layers extending in the stacked bodies in the first direction. Each of the stacked bodies includes gate electrodes stacked in the first direction. The first and second wires are aligned in the second direction with a gap therebetween.
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公开(公告)号:US20240099013A1
公开(公告)日:2024-03-21
申请号:US18519872
申请日:2023-11-27
Applicant: Kioxia Corporation
Inventor: Yoshiaki FUKUZUMI , Hideaki AOCHI , Mie MATSUO , Kenichiro YOSHII , Koichiro SHINDO , Kazushige KAWASAKI , Tomoya SANUKI
IPC: H10B43/40 , H01L21/18 , H01L21/768 , H01L23/00 , H01L25/065 , H01L25/18 , H10B43/27 , H10B43/30 , H10B43/50
CPC classification number: H10B43/40 , H01L21/185 , H01L21/76898 , H01L24/80 , H01L25/0657 , H01L25/18 , H10B43/27 , H10B43/30 , H10B43/50 , H01L2224/08145
Abstract: According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. The circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. The bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. The bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.
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公开(公告)号:US20230410915A1
公开(公告)日:2023-12-21
申请号:US18177115
申请日:2023-03-02
Applicant: Kioxia Corporation
Inventor: Tomoya SANUKI , Keisuke NAKATSUKA
CPC classification number: G11C16/26 , G11C11/5628 , G11C11/5642 , G11C11/5671 , G11C16/0483 , G11C16/10 , H10B41/27 , H10B43/27
Abstract: A semiconductor storage device has a bit line, a source line, a first memory cell and a second memory cell provided between the bit line and the source line and connected in series, a first word line connected to the first memory cell, a second word line connected to the second memory cell, and a control circuit. The control circuit, when executing a read operation with respect to the first memory cell, supplies a source voltage to the source line, supplies a first voltage to the first word line, and supplies a second voltage to the second word line, and a difference between the source voltage and the second voltage is smaller than a difference between the source voltage and the first voltage.
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公开(公告)号:US20230324455A1
公开(公告)日:2023-10-12
申请号:US18209398
申请日:2023-06-13
Applicant: Kioxia Corporation
Inventor: Tatsuro HITOMI , Yasuhito YOSHIMIZU , Masayuki MIURA , Arata INOUE , Hiroyuki DOHMAE , Koichi NAKAZAWA , Mitoshi MIYAOKA , Kazuhito HAYASAKA , Tomoya SANUKI
CPC classification number: G01R31/2886 , G01R1/07342
Abstract: According to one embodiment, a wafer includes a substrate including a first region and a second region that do not overlap each other; a first chip unit and a second chip unit each arranged on the substrate; a first electrode and a second electrode each electrically connected to the first chip unit; and a third electrode and a fourth electrode each electrically connected to the second chip unit. The first electrode and the third electrode are arranged in the first region. The second electrode and the fourth electrode are arranged in the second region. The first region is independent of a region in which the first chip unit and the second chip unit are provided.
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