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Patent Agency Ranking
公开(公告)号：US09645097B2
公开(公告)日：2017-05-09
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
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公开(公告)号：US09747520B2
公开(公告)日：2017-08-29
申请号：US15068320
申请日：2016-03-11
Applicant: KLA-TENCOR CORPORATION
Inventor： Shifang Li , Youxian Wen , Sven Schwitalla , Prashant Aji , Lena Nicolaides
CPC classification number: G06K9/6201 , G03F1/84 , G06T5/50 , G06T7/001 , G06T2207/10016 , G06T2207/10024 , G06T2207/20224 , G06T2207/30148 , H04N5/2256
Abstract: Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.
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3.发明申请公开(公告)号：US20160275671A1
公开(公告)日：2016-09-22
申请号：US15068320
申请日：2016-03-11
Applicant: KLA-TENCOR CORPORATION
Inventor： Shifang Li , Youxian Wen , Sven Schwitalla , Prashant Aji , Lena Nicolaides
CPC classification number: G06K9/6201 , G03F1/84 , G06T5/50 , G06T7/001 , G06T2207/10016 , G06T2207/10024 , G06T2207/20224 , G06T2207/30148 , H04N5/2256
Abstract: Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.
Abstract translation: 公开了一种用于提高检测灵敏度以使用检查工具检测晶片中的缺陷的系统和方法。 多个发光二极管照亮晶片的至少一部分并捕获一组灰度图像。 在灰度图像集合的每个图像中确定残差信号，并从灰度图像集合的每个图像中减去残留信号。 基于减法灰度图像集确定缺陷。 可以在所公开的系统和方法的一些实施例中构建和改进检查工具和晶片的模型。
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公开(公告)号：US09658150B2
公开(公告)日：2017-05-23
申请号：US14990233
申请日：2016-01-07
Applicant: KLA-TENCOR CORPORATION
Inventor： Shifang Li , Youxian Wen
CPC classification number: G01N21/21 , G01B11/02 , G01B11/06 , G01B11/30 , G01B11/303 , G01N21/9501 , G01N2021/399 , G01N2021/8845 , G01N2021/8848 , G03F7/70608 , G03F7/70625
Abstract: A system determines a value, such as a thickness, surface roughness, material concentration, and/or critical dimension, of a layer on a wafer based on normalized signals and reflected total intensities. A light source directs a beam at a surface of the wafer. A sensor receives the reflected beam and provides at least a pair of polarization channels. The signals from the polarization channels are received by a controller, which normalizes a difference between a pair of the signals to generate the normalized result. The value of the wafer is determined through analyzing the signal with a modeling of the system.
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5.发明申请公开(公告)号：US20150370175A1
公开(公告)日：2015-12-24
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
Abstract translation: 公开了用于检查和处理半导体晶片的方法和装置。 该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。 边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。 边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内 这种晶片的输出辐射。 光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。 边缘检测系统与光刻系统成对连接。
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