摘要:
A touch detecting system for installation on a touch panel includes two point light sources arranged along one side of a touch panel, an optical sensor disposed at an opposite second side of the touch panel, at least one optical lens, and a processing unit. The at least on optical lens is disposed between the second side of the touch panel and the optical sensor. The at least one optical lens is spaced from the touch panel and the optical sensor, for directing the light from the point light sources to the optical sensor. The optical sensor captures an image which including two dark points of the light from the point light sources when a touch object is on the touch panel. The processing unit determines the position of the touch object on the touch panel based on positions of the dark points in the image.
摘要:
A reactor and method for performing chemical vapor deposition are disclosed. A chemical vapor deposition reactor can have a cylindrical chamber that comprises a cylindrical lid support and an annular gas distribution plate. Said chamber can be configured to have a horizontal laminar flow of at least one gas stream in the radial direction and a vertical downward flow of another gas stream over wafers. A large capacity of a CVD reactor with simple structures, easy maintenance and low consumption of reactants can be achieved. High uniformity, repeatability, reproducibility and consistency of depositing layers on wafers can be obtained.
摘要:
The invention provides a method of loading balance that is based on BS structure, it includes the following steps: using a 4-layers switch to distribute the application request for the proxy server; using the so-called proxy server to distribute application request for application server; and establishing the corresponding WEBLOGIC clusters in accordance with each application request. This invention provides method of loading balance that is based on BS structure that is rationally configure the connection between 4-layers switch and the proxy layer of proxy server; at the same time, maintains the loading balance of the application server and eliminates the single-spot fault by utilizing the advantages of the WEBLOGIC clusters server communication and the back-up synchronization of the users' calling back.
摘要:
A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance.
摘要:
The present disclosure provides isolated monoclonal antibodies, particularly human monoclonal antibodies, or antigen binding portions thereof, that specifically bind to integrin α5β1 with high affinity. Nucleic acid molecules encoding the antibodies of the disclosure, expression vectors, host cells and methods for expressing the antibodies of the disclosure are also provided. Immunoconjugates, bispecific molecules and pharmaceutical compositions comprising the antibodies or antigen binding portions thereof are also provided. The disclosure also provides methods for treating various cancers using the anti-α5β1 antibodies or antigen binding portions thereof described herein.
摘要:
A multichip package includes a first chip and a second chip coupled with the first chip. The first chip includes a first base with a semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer. The first external bonding portion is electrically connected to the first electrical connection unit. The second chip includes an integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit.