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公开(公告)号：US20160057896A1
公开(公告)日：2016-02-25
申请号：US14722310
申请日：2015-05-27
发明人： Tadahiro SASAKI , Hiroshi YAMADA
CPC分类号： H05K5/0239 , H01P1/2005 , H05K9/0056 , H05K9/0081
摘要： According to an embodiment, an electronic device includes a housing, metal patches, and a first metal member. The housing includes a bottom, a lid, and a side unit. The side unit is disposed to enclose a space between the bottom and the lid. A circuit substrate is disposed on a bottom surface of the bottom. The side unit is conductive and connected to a ground potential. The metal patches are disposed on a lid surface of the lid. The metal patches are arranged periodically in a first direction and a second direction. The second direction intersects the first direction. The metal patches are connected to the ground potential. The first metal member is disposed on the lid surface. The first metal member is connected to the ground potential. The first metal member includes a first portion. The first portion contacts a first surface of the side unit.
摘要翻译： 根据实施例，电子设备包括壳体，金属贴片和第一金属构件。 壳体包括底部，盖子和侧部单元。 侧面单元设置成包围底部和盖子之间的空间。 电路基板设置在底部的底面上。 侧面单元导电并连接到地电位。 金属贴片设置在盖的盖表面上。 金属贴片沿第一方向和第二方向周期性地布置。 第二个方向与第一个方向相交。 金属贴片连接到地电位。 第一金属构件设置在盖表面上。 第一金属构件连接到地电位。 第一金属构件包括第一部分。 第一部分接触侧单元的第一表面。
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公开(公告)号：US20170077580A1
公开(公告)日：2017-03-16
申请号：US15259395
申请日：2016-09-08
发明人： Tamio KAWAGUCHI , Noritsugu SHIOKAWA , Hiroaki IKEUCHI , Tadahiro SASAKI , Kohei NAKAYAMA , Mutsuki YAMAZAKI , Hiroyuki KAYANO
IPC分类号： H01P3/16
摘要： A thermal insulation waveguide between a high-temperature unit and a low-temperature unit in a vacuum, chamber of an embodiment, the thermal insulation waveguide includes, a first substrate including a first line in the high-temperature unit, a second substrate including a second line in the low temperature unit, and a thermal insulation element connecting the substrates, and including a third line including an inductance component and connecting the first and second lines. The first substrate includes a first capacitor unit connected with the first line. The second substrate includes a second capacitor unit connected with the second line.
摘要翻译： 在一个实施例的真空室中的高温单元和低温单元之间的绝热波导，所述绝热波导包括：包括所述高温单元中的第一线的第一基板，包括第一基板的第二基板 低温单元中的第二线，以及连接基板的绝热元件，并且包括具有电感元件的第三线，并连接第一线和第二线。 第一基板包括与第一线连接的第一电容器单元。 第二基板包括与第二线连接的第二电容器单元。
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公开(公告)号：US20150201488A1
公开(公告)日：2015-07-16
申请号：US14585657
申请日：2014-12-30
CPC分类号： H05K1/0222 , H05K1/162 , H05K1/165 , H05K1/167 , H05K2201/0187 , H05K2201/0195
摘要： A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film.
摘要翻译： 实施方式的布线基板包括通孔，设置在贯通通孔周围的第一绝缘膜，设置在第一绝缘膜周围的第二绝缘膜，设置在第二绝缘膜周围的第三绝缘膜，以及设置在第三绝缘膜周围的树脂 电影。 树脂包括填料。 第二绝缘膜的相对介电常数低于第一绝缘膜的相对介电常数。 第三绝缘膜的相对介电常数高于第二绝缘膜的相对介电常数。
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公开(公告)号：US20170172001A1
公开(公告)日：2017-06-15
申请号：US15445750
申请日：2017-02-28
发明人： Tadahiro SASAKI , Hiroyuki Kayano , Noritsugu Shiokawa , Tamio Kawaguchi , Hiroaki Ikeuchi , Mutsuki Yamazaki
CPC分类号： H05K5/0217 , H01L23/04 , H01L23/66 , H05K9/0007 , H05K9/0045
摘要： According to one embodiment, an electronic device includes a housing, an electronic component, a first conductor, and a second conductor. The housing includes a first plate portion, a second plate portion, and a third plate portion. The first plate portion has a first surface. The second plate portion is separated from the first surface. The third plate portion has a third surface. The electronic component is provided inside the housing. The first conductor is provided inside the first plate portion. The second conductor includes first region and a second region. The second conductor is provided between the first plate portion and the second plate portion. An end of the first region is connected to the first conductor. An opening is provided between at least a portion of the first region and at least a portion of the second region.
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公开(公告)号：US20150084167A1
公开(公告)日：2015-03-26
申请号：US14460694
申请日：2014-08-15
发明人： Tadahiro SASAKI , Hiroshi YAMADA
CPC分类号： H05K1/0236 , H01L23/49822 , H01L23/49838 , H01L24/19 , H01L2224/04105 , H01L2224/16225 , H01L2224/16235 , H01L2224/24137 , H01L2924/1531 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0225 , H05K1/0231 , H05K1/0233 , H05K1/0242 , H05K1/0243 , H05K1/0298 , H05K2201/0715 , H05K2201/09254 , H05K2201/0969 , H05K2201/09727
摘要： An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the first insulating layer, a second metal patch provided on the first insulating layer, a second insulating layer provided on the first and second metal patches, an interconnect layer provided on the second insulating layer, a third insulating layer provided on the interconnect layer, a first via connected to the electrode plane and the first metal patch, and a second via connected to the electrode plane and the second metal patch. The second metal patch is separately adjacent to the first metal patch. The interconnect layer has a first opening and a second opening. The first via penetrates through the first opening. The second via penetrates through the second opening.
摘要翻译： 实施例的EBG结构包括电极平面，设置在电极平面上的第一绝缘层，设置在第一绝缘层上的第一金属贴片，设置在第一绝缘层上的第二金属贴片，设置在第一绝缘层上的第二绝缘层 第一和第二金属贴片，设置在第二绝缘层上的互连层，设置在互连层上的第三绝缘层，连接到电极平面和第一金属贴片的第一通孔，以及连接到电极平面的第二通孔和 第二个金属贴片。 第二金属贴片与第一金属贴片分开相邻。 互连层具有第一开口和第二开口。 第一个通孔穿过第一个开口。 第二通孔穿过第二开口。
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公开(公告)号：US20150021748A1
公开(公告)日：2015-01-22
申请号：US14332542
申请日：2014-07-16
IPC分类号： H01L23/66 , H01L23/053
CPC分类号： H01L23/66 , H01L23/053 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device of an embodiment includes: a substrate, a high-frequency integrated circuit being provided on the substrate, a cap, and a sealing wall provided between the substrate and the cap. The cap includes a first conductive layer, a second conductive layer, an insulating layer provided between the first conductive layer and the second conductive layer, and a conductive via provided in the insulating layer. The conductive via connects the first conductive layer and the second conductive layer. The first conductive layer or the second conductive layer is connected to a ground potential. The sealing wall surrounds the high-frequency integrated circuit.
摘要翻译： 实施例的半导体器件包括：基板，设置在基板上的高频集成电路，盖和设置在基板和盖之间的密封壁。 盖包括第一导电层，第二导电层，设置在第一导电层和第二导电层之间的绝缘层，以及设置在绝缘层中的导电通孔。 导电通孔连接第一导电层和第二导电层。 第一导电层或第二导电层连接到接地电位。 密封壁围绕高频集成电路。
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公开(公告)号：US20150022416A1
公开(公告)日：2015-01-22
申请号：US14332781
申请日：2014-07-16
发明人： Tadahiro SASAKI , Kazuhiko ITAYA , Hiroshi YAMADA , Yutaka ONOZUKA , Nobuto Managaki , Atsuko IIDA
IPC分类号： H01Q1/52
CPC分类号： H01Q9/0407 , H01Q15/008 , H01Q23/00
摘要： An antenna device of the present embodiment includes: a first conductive layer connected to a ground potential, a semiconductor device provided above the first conductive layer, a second conductive layer provided above the semiconductor device, a first via connecting the second conductive layer and the first conductive layer, a third conductive layer provided above the second conductive layer, a second via passing through the first opening, and an antenna provided above the third conductive layer. A dielectric is provided between the second conductive layer and the semiconductor device, between the third conductive layer and the second conductive layer, and between the antenna and the third conductive layer. The second conductive layer includes a first opening. The second via connects the third conductive layer and the first conductive layer.
摘要翻译： 本实施例的天线装置包括：连接到接地电位的第一导电层，设置在第一导电层上方的半导体器件，设置在半导体器件上方的第二导电层，连接第二导电层和第一导电层的第一导电层 导电层，设置在第二导电层上方的第三导电层，穿过第一开口的第二通孔，以及设置在第三导电层上方的天线。 在第二导电层和半导体器件之间，在第三导电层和第二导电层之间以及天线和第三导电层之间提供电介质。 第二导电层包括第一开口。 第二通孔连接第三导电层和第一导电层。
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公开(公告)号：US20140240055A1
公开(公告)日：2014-08-28
申请号：US14183720
申请日：2014-02-19
发明人： Tadahiro SASAKI , HIROSHI YAMADA
IPC分类号： H01P1/212
CPC分类号： H01P1/212 , H01P1/2005 , H05K1/0236 , H05K1/0298
摘要： An electronic circuit according to an embodiment includes a power supply line having a first EBG pattern, the first EBG pattern including a plurality of first linear parts and a first slit, each of the first linear parts extending along a direction in which the power supply line extends and surrounded by the first slit except one end of the first linear part.
摘要翻译： 根据实施例的电子电路包括具有第一EBG图案的电源线，所述第一EBG图案包括多个第一直线部分和第一狭缝，所述第一直线部分中的每一个沿着所述电源线 由第一狭缝除了第一线性部分的一端外延伸并包围。
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