Branched polymers from organohydrogensilicon compounds
    3.
    发明申请
    Branched polymers from organohydrogensilicon compounds 有权
    来自有机氢硅化合物的支链聚合物

    公开(公告)号:US20060074212A1

    公开(公告)日:2006-04-06

    申请号:US10538682

    申请日:2003-12-17

    IPC分类号: C08G77/06 C08G77/04

    摘要: A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.

    摘要翻译: 一种方法,包括在催化剂存在下加热,所述混合物包含(i)通过在含铂族金属的催化剂存在下混合而获得的反应产物,每个分子至少含有至少一个与硅键合的氢原子的有机氢硅化合物 和至少一种具有至少一个脂肪族不饱和键的化合物; (ii)至少一个封端剂,和任选地(iii)至少一种选自水解产物或环硅氧烷的有机硅氧烷,以使组分(i),(ii)和任选的(iii)聚合形成支链聚合物。

    Dual curing polymers and methods for their preparation and use
    7.
    发明授权
    Dual curing polymers and methods for their preparation and use 有权
    双固化聚合物及其制备和使用方法

    公开(公告)号:US08618233B2

    公开(公告)日:2013-12-31

    申请号:US12517211

    申请日:2007-11-07

    IPC分类号: C08G77/08

    摘要: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译: 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式(R22SiO2 / 2)b,(R2Si03 / 2)c,(SiO4 / 2)d,(R1')f和(R23Si01 / 2)g的单元,其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Dual Curing Polymers and Methods for Their Preparation and Use
    9.
    发明申请
    Dual Curing Polymers and Methods for Their Preparation and Use 失效
    双固化聚合物及其制备和使用方法

    公开(公告)号:US20100069523A1

    公开(公告)日:2010-03-18

    申请号:US12517220

    申请日:2007-12-10

    IPC分类号: C08J3/28 C08G77/04 C08G77/12

    摘要: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译: 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 聚合物包括式(I),(R 22 SiO 2/2)b,(R 2 SiO 3/2)c,(SiO 4/2)d,(R 1)f和(R 23 SiO 1/2)g的单元,其中每个R 1独立地为 氧原子或二价烃基; 每个R 1独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Lithography Technique Using Silicone Molds
    10.
    发明申请
    Lithography Technique Using Silicone Molds 审中-公开
    硅胶模具的平版印刷技术

    公开(公告)号:US20070269747A1

    公开(公告)日:2007-11-22

    申请号:US11659989

    申请日:2005-08-31

    IPC分类号: G03F7/00 G03F7/004 G03F7/027

    摘要: A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.

    摘要翻译: 一种方法包括以下步骤:A)用可固化(甲基)丙烯酸酯配方填充具有图案化表面的硅氧烷模具,B)固化可固化(甲基)丙烯酸酯配方以形成图案化特征,C)将硅氧烷模具和 图案化特征,任选地D)蚀刻图案化特征,以及可选地E)重复步骤A)至D)重新使用硅酮模具。 可固化(甲基)丙烯酸酯配方含有氟官能(甲基)丙烯酸酯,(甲基)丙烯酸酯和光引发剂。