公开(公告)号：US5982041A

公开(公告)日：1999-11-09

申请号：US835287

申请日：1997-04-09

申请人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

发明人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

IPC分类号： C08J3/24 ,  C09J183/00 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  H01L21/52 ,  H01L21/58 ,  H01L23/48 ,  C09J4/00 ,  B32B9/04

CPC分类号： C08J3/243 ,  C09J183/04 ,  C09J183/06 ,  C08J2383/04 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/19105 ,  Y10T428/31663

摘要： A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane.Also, a fabrication method characterized bymounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package,then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereaftercuring the die attach adhesive by the hydrosilylation reaction.A semiconductor device characterized in that it has been fabricated by the above-described method.

摘要翻译： 硅氧烷片附着粘合剂，其包含硅氧烷组合物，其通过暴露于高能量辐射诱导的丙烯酸官能的有机聚硅氧烷的自由基反应并通过烯基官能的有机聚硅氧烷和硅键合的氢官能的有机聚硅氧烷之间的氢化硅烷化反应固化。 另外，一种制造方法，其特征在于，将半导体芯片安装在基板上或封装中，并将上述硅树脂管芯粘合剂夹在半导体芯片和基板或封装之间，然后通过暴露模具而引起丙烯酸官能团的自由基反应 将粘合剂粘附到高能量辐射上，然后通过氢化硅烷化反应固化芯片附着粘合剂。 一种半导体器件，其特征在于，其通过上述方法制造。

公开(公告)号：US5932145A

公开(公告)日：1999-08-03

申请号：US960645

申请日：1997-10-30

申请人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

发明人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

IPC分类号： C08K3/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09J183/04 ,  H01B1/22 ,  H01B1/06

CPC分类号： C08L83/04 ,  C09J183/04 ,  C08G77/12 ,  C08G77/20

摘要： An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a conductive cured silicone product that has low resistance and resistivity values, a resistance value independent of temperature, and little variation in resistance and resistivity values over time.

摘要翻译： 加成反应固化导电硅氧烷组合物包括：具有烯基的有机聚硅氧烷，具有与硅键合的氢原子的有机聚硅氧烷，导电微粒，铂催化剂和挥发性溶剂; 并且组合物固化以产生具有低电阻和电阻率值的导电固化的硅氧烷产品，与温度无关的电阻值，以及随时间的电阻和电阻率值的变化小。

公开(公告)号：US6040362A

公开(公告)日：2000-03-21

申请号：US099636

申请日：1998-06-18

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08K9/02 ,  C08L83/04 ,  C08L101/12 ,  C08K9/00 ,  C08K3/10 ,  C08K3/22

CPC分类号： C08K9/02 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70

摘要： The present invention provides a heat-conducting polymer composition in which a heat-conducting metal powder is contained in a polymer, said heat-conducting polymer composition being characterized by the fact that the aforementioned powder is a metal powder which has a metal oxide layer and/or a metal nitride layer on the surfaces of the powder particles. The heat-conducting polymer composition of the present invention is characterized by the fact that said composition has a superior storage stability and thermal conductivity, and also by the fact that said composition has electrical insulating properties.

摘要翻译： 本发明提供一种导热性聚合物组合物，其中在聚合物中含有导热金属粉末，所述导热聚合物组合物的特征在于上述粉末是具有金属氧化物层的金属粉末和 /或粉末颗粒表面上的金属氮化物层。 本发明的导热性聚合物组合物的特征在于所述组合物具有优异的储存稳定性和导热性，并且还具有所述组合物具有电绝缘性的事实。

公开(公告)号：US5804631A

公开(公告)日：1998-09-08

申请号：US688456

申请日：1996-07-30

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08L83/04 ,  C09J183/04 ,  H01L21/58 ,  H01L23/495

CPC分类号： H01L24/29 ,  C08K3/08 ,  C08L83/04 ,  C09J183/04 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/83 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.

摘要翻译： 可用作硅氧烷管芯粘合剂的可固化有机硅氧烷组合物，每个包含通过加成和缩合反应固化的组合物的导电硅橡胶组合物，其在半导体芯片已经被加热之后不会削弱与半导体芯片或引线框架的引线键合性 粘合到基底或包装上; 半导体器件，其中半导体芯片使用可固化的有机硅氧烷组合物结合到其衬底或封装上，并且其中通过使用可固化的有机硅氧烷组合物证明高可靠性的半导体器件。

公开(公告)号：US6039831A

公开(公告)日：2000-03-21

申请号：US231949

申请日：1999-01-15

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08J3/24 ,  C08K3/08 ,  C08L83/04 ,  C08L83/06 ,  C08L83/07 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  B32B31/28

CPC分类号： C08L83/04 ,  C08L83/06 ,  C09J183/04 ,  C09J183/06 ,  C08G77/12 ,  C08G77/20 ,  H01L2224/48091 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/3025

摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

摘要翻译： 含有含有有机聚硅氧烷的丙烯酸官能团的氢化硅烷化固化型导电硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基底上，然后用高能量束照射组合物时，组合物的暴露外围固化成 在水解反应之前和期间，来自组合物的低分子量硅氧烷物质的迁移的程度最小化。 一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在 半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。 通过该方法制造的具有提高的可靠性的半导体器件。

公开(公告)号：US5872170A

公开(公告)日：1999-02-16

申请号：US840475

申请日：1997-04-21

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08F299/08 ,  C08K5/00 ,  C08L83/04 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  H01L21/52

CPC分类号： C09J183/04 ,  C08L83/04 ,  C08L83/06 ,  C09J183/06 ,  C08G77/12 ,  C08G77/20 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

摘要翻译： 含有含丙烯酸官能团的有机聚硅氧烷的氢化硅烷化固化型导电性硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基材上，然后用高能量束照射组合物时，组合物的暴露的周边固化 在低分子量硅氧烷物质从组合物的迁移之前和期间在水解反应中都被最小化的程度。 一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在 半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。 通过该方法制造的具有提高的可靠性的半导体器件。

公开(公告)号：US07074849B2

公开(公告)日：2006-07-11

申请号：US10822888

申请日：2004-04-13

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC分类号： B05D3/02 ,  C08K9/06 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07

CPC分类号： H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

摘要： The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound prior to incorporating the particles into the organosiloxane composition.

公开(公告)号：US06797772B2

公开(公告)日：2004-09-28

申请号：US10052760

申请日：2002-01-18

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC分类号： C08K906

CPC分类号： H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

摘要： A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule in a quantity sufficient to provide from 0.5 to 3 silicon-bonded hydrogen atoms per alkenyl radical of (A), (C) from 50-2000 parts by weight of silver particles pre-treated with an organosilicon compound selected from the group consisting of (i) alkoxy group(s)-containing silanes and (ii) organosiloxanes, (D) a platinum catalyst, (E) up to 20 weight percent based on the weight of (A) of an organosilicon compound containing at least one silicon-bonded alkoxy group per molecule, and (F) from 0.001 to 5 parts by weight per 100 parts by weight of (A) of a cure inhibitor.

摘要翻译： 组合物包括通过均匀共混获得的产物：（A）每分子100重量份含有至少两个烯基的聚有机硅氧烷，（B）每分子含有至少两个与硅键合的氢原子的有机氢硅氧烷，其量足够 对（A），（C）的每个烯基基团提供0.5至3个硅键合的氢原子，从50-2000重量份的预先用有机硅化合物处理的银粒子，所述有机硅化合物选自（i）烷氧基（ s）的硅烷和（ii）有机硅氧烷，（D）铂催化剂，（E）至多20重量％，基于每分子含有至少一个与硅键合的烷氧基的有机硅化合物的重量比（A） 和（F）0.001至5重量份/ 100重量份的（A）固化抑制剂。