公开(公告)号：US06294271B1

公开(公告)日：2001-09-25

申请号：US09499382

申请日：2000-02-07

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/10253 ,  Y10T428/12528 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

摘要翻译： 在包含液体环氧树脂和无机填料的液体环氧树脂组合物中，在环氧树脂中溶解度高达1重量％的特定咪唑化合物，熔点至少为170℃，平均粒径 为1〜5μm，最大粒径为20μm以下的固化促进剂。 所得到的组合物适合作为倒装芯片型半导体器件的密封材料，因为其具有改善的薄膜浸润和储存稳定性。

公开(公告)号：US06733902B2

公开(公告)日：2004-05-11

申请号：US10218625

申请日：2002-08-15

申请人： Kazuaki Sumita ,  Tatsuya Kanamaru ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Tatsuya Kanamaru ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L24/31 ,  C08G59/306 ,  C08G59/3254 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/3512 ,  H01L2924/00

摘要： A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

摘要翻译： 液体环氧树脂组合物包括（A）液体环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料和（E）由 含有烯基的环氧树脂或酚醛树脂与有机聚硅氧烷，液态环氧树脂组合物固化成Tg为30-120℃的产物和特定的动态粘弹性行为。 该组合物粘附于硅片，该固化产品对热和热冲击具有高度的抗性，并且该组合物可用作倒装芯片型半导体器件的密封剂。

公开(公告)号：US06534193B2

公开(公告)日：2003-03-18

申请号：US09912400

申请日：2001-07-26

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L24/31 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/12528 ,  C08L2666/04 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.

公开(公告)号：US06323263B1

公开(公告)日：2001-11-27

申请号：US09708682

申请日：2000-11-09

申请人： Haruyoshi Kuwabawa ,  Kazuaki Sumita ,  Toshio Shiobara

发明人： Haruyoshi Kuwabawa ,  Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： C08K336

CPC分类号： C08G59/4215 ,  C08K3/36 ,  C08K2201/014 ,  Y10T428/12528 ,  C08L63/00

摘要： In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved interstitial infiltration and has a low modulus of elasticity in the cured state.

摘要翻译： 在包含（A）液体环氧树脂，（B）固化剂和（C）无机填料）的半导体密封液体环氧树脂组合物中，无机填料具有这样的受控粒度分布，使组合物提供改善的间隙渗透 并且在固化状态下具有低的弹性模量。

公开(公告)号：US06310120B1

公开(公告)日：2001-10-30

申请号：US09499038

申请日：2000-02-07

申请人： Toshio Shiobara ,  Kazuaki Sumita

发明人： Toshio Shiobara ,  Kazuaki Sumita

IPC分类号： C08K322

CPC分类号： H01L24/31 ,  C08G59/4215 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83951 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0104 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) spherical silica, (D) a soft x-ray non-transmissive spherical inorganic filler, and (E) a curing accelerator is suited as an underfill material for flip-chip type semiconductor devices. The sealing material has improved thin-film infiltration and storage stability. The filled state or seal defects can be readily inspected using soft x-rays.

摘要翻译： 一种密封材料，其包含（A）液体环氧树脂，（B）固化剂，（C）球形二氧化硅，（D）软x射线非透射性球形无机填料和（E）固化促进剂适合作为 用于倒装芯片型半导体器件的底部填充材料。 密封材料具有改善的薄膜渗透和储存稳定性。 使用软X射线可以方便地检查填充状态或密封缺陷。

公开(公告)号：US20090184431A1

公开(公告)日：2009-07-23

申请号：US12289268

申请日：2008-10-23

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L23/48 ,  C07F7/08 ,  C08L63/00 ,  C08K3/36

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising at least 5% by weight of a specific aromatic amine compound, and (C) an inorganic filler has a low viscosity for ease of working, cures into a cured product which has improved adhesion to the surface of silicon chips, and offers an encapsulated semiconductor device that does not suffer a failure even at a reflow temperature of 260-270° C., does not deteriorate under hot humid conditions, and does not peel or crack on thermal cycling.

摘要翻译： 一种液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）包含至少5重量％的特定芳族胺化合物的芳族胺固化剂和（C）无机填料，其粘度低 工作，固化成固化产品，其具有改善的对硅片表面的粘合性，并提供即使在260-270℃的回流温度下也不会发生故障的封装半导体器件，在热潮湿条件下不劣化 ，并且不会在热循环时剥离或破裂。

公开(公告)号：US06780674B2

公开(公告)日：2004-08-24

申请号：US10327145

申请日：2002-12-24

申请人： Kazuaki Sumita ,  Haruyoshi Kuwabara ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Haruyoshi Kuwabara ,  Toshio Shiobara

IPC分类号： H01L2158

CPC分类号： C08L63/00 ,  C08G59/226 ,  C08G59/38 ,  H01L23/293 ,  H01L2224/73204 ,  H01L2924/12044 ,  Y10T428/31511 ,  Y10T428/31515

摘要： In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.

摘要翻译： 在包含液体环氧树脂，固化剂，固化促进剂和无机填料的液体环氧树脂组合物中，液体环氧树脂是（a）含有两个或更少环氧官能团的液体环氧树脂和（b ）含有重量比（a）/（b）为9/1至1/4的两个或多个环氧官能团的固体环氧树脂，其在25℃下的粘度高达10,000泊，如 E型粘度计。 该组合物粘附到硅片上，固化产品对湿度和热冲击具有高度的耐受性，并且该组合物可用作半导体器件的密封剂。

公开(公告)号：US06558812B2

公开(公告)日：2003-05-06

申请号：US09955930

申请日：2001-09-20

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： C08G59/4284 ,  C08G59/4215 ,  C08G59/58 ,  H01L21/563 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/12528 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.

公开(公告)号：US06479167B2

公开(公告)日：2002-11-12

申请号：US09774581

申请日：2001-02-01

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L21/563 ,  C08G59/188 ,  C08G59/68 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/12528 ,  H01L2924/00 ,  H01L2924/3512

摘要： A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.

摘要翻译： 用于倒装芯片型半导体器件的密封材料包括液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）任选的固化剂，（C）无机填料，和（D）1至15份 每100重量份组分A和B组合的微胶囊化催化剂的重量。 密封材料的优异的薄膜渗透性和储存稳定性使得使用密封材料制造的倒装芯片型半导体器件具有非常高的可靠性。

公开(公告)号：US06225704B1

公开(公告)日：2001-05-01

申请号：US09499022

申请日：2000-02-07

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2329

CPC分类号： H01L21/563 ,  H01L23/3185 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512

摘要： A flip-chip type semiconductor device has a semiconductor chip mounted on a substrate via a plurality of bumps. The gap between the substrate and the chip is filled with an underfill material and sealed along sides thereof with a fillet material. The underfill material is a cured epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, having a coefficient of expansion of 20-40 ppm/° C. below its Tg. The fillet material is a similar cured epoxy resin composition having a coefficient of expansion of less than 20 ppm/° C. below its Tg. The device is highly reliable.

摘要翻译： 倒装芯片型半导体器件具有通过多个凸块安装在基板上的半导体芯片。 衬底和芯片之间的间隙填充有底部填充材料，并用圆角材料沿侧面密封。 底部填充材料是包含液体环氧树脂和无机填料的固化环氧树脂组合物，其膨胀系数在其Tg以下为20-40ppm /℃。 圆角材料是类似的固化环氧树脂组合物，其膨胀系数低于Tg的20ppm /℃。 该设备高度可靠。