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公开(公告)号：US06839218B2
公开(公告)日：2005-01-04
申请号：US10219738
申请日：2002-08-16
CPC分类号： H05K3/308 , B23K1/19 , B23K2101/36 , H01G4/228
摘要： The present invention relates to a radial-type ceramic electronic component that can prevent cracking in the ceramic substrate and detachment of the terminal electrodes due to the contractile stresses in the solder. A ceramic electronic component element 1 is equipped with terminal electrodes 11 and 12 on either end of a ceramic substrate 10. A pair of lead wires 2 and 3 are soldered to the terminal electrodes 11 and 12. The support parts 2B and 3B of the lead wires 2 and 3 are bent from the soldering parts 2A and 3A in a direction away from the terminal electrodes 11 and 12.
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2.发明授权Electronic device with external terminals and method of production of the same 有权具有外部端子的电子设备及其生产方法相同公开(公告)号：US06704189B2
公开(公告)日：2004-03-09
申请号：US10404664
申请日：2003-04-02
IPC分类号： H01G4228
CPC分类号： H01G4/248 , H01C1/144 , H01C17/28 , H01G2/065 , H01G4/2325 , H05K3/3426
摘要： A multilayer ceramic capacitor with external terminals having terminal electrodes and external terminals of the electronic device body electrically bonded through a solder layer, wherein the solder layer is comprised of an Sn—Sb high temperature lead-free solder, the ratio between the Sn and Sb in this solder layer is, by ratio by weight percent, in a range of Sn/Sb=70/30 to 90/10, and the solder layer and terminal electrodes are formed between them with a diffusion layer formed by diffusion of a conductive ingredient of the terminal electrodes into the solder layer.
摘要翻译： 具有端子电极的外部端子和电子器件主体的外部端子通过焊料层电连接的多层陶瓷电容器，其中焊料层由Sn-Sb高温无铅焊料构成，Sn与Sb之间的比例 在该焊料层中，以Sn / Sb = 70/30〜90/10的范围内，以重量比计，焊料层和端子电极之间形成有通过导电成分的扩散形成的扩散层 的端子电极进入焊料层。
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公开(公告)号：US06956731B2
公开(公告)日：2005-10-18
申请号：US10506812
申请日：2003-03-07
CPC分类号： H01G4/2325
摘要： A laminate type electronic component 1 has, at least, a dielectric part 2 containing a dielectric as a constituent material, and a pair of a first external electrode 31 and a second external electrode 32, each disposed in close contact with the dielectric part 2, opposing each other by way of the dielectric part 2. The dielectric part 2 has laminated dielectric layers 21a to 21f; and at least two internal electrodes 23a to 23e disposed one by one between layers adjacent each other in the dielectric layers 21a to 21f, while each being electrically connected to one of the first external electrode 31 and second external electrode 32. At least one of the internal electrodes 23a to 23e is electrically connected to the first external electrode 31, and at least one of the internal electrodes 23a to 23e is electrically connected to the second external electrode 32.
摘要翻译： 层叠型电子部件1至少具有包含作为构成材料的电介质的电介质部2和与电介质部2紧密接触的一对第一外部电极31和第二外部电极32， 通过电介质部分2彼此相对。 电介质部分2具有叠层电介质层21a至21f; 以及在电介质层21a至21f中彼此相邻的层之间逐个设置的至少两个内部电极23a至23e，同时每个电连接到第一外部电极31和第二外部电极32中的一个。 内部电极23a至23e中的至少一个电连接到第一外部电极31，并且内部电极23a至23e中的至少一个电连接到第二外部电极32。
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公开(公告)号：US06400553B2
公开(公告)日：2002-06-04
申请号：US09840904
申请日：2001-04-25
IPC分类号： H01G406
摘要： A multi-layer ceramic electronic device having a device body including alternately arranged dielectric layers and internal electrode layers and external electrodes formed on an outer surface of the device body, wherein the external electrodes have an undercoat layer directly formed on the outer surface of the device body so as to be electrically connected with at least part of the internal electrode layers, an intermediate layer formed on the outer surface of the undercoat layer, and an outer layer formed on the outer surface of the intermediate layer; the undercoat layer includes a first conductive material mainly made of copper and a first glass ingredient; the intermediate layer includes a second conductive material mainly made of a copper-palladium-based alloy; and the outer layer includes a third conductive material mainly made of silver and further containing palladium and a second glass ingredient.
摘要翻译： 一种多层陶瓷电子器件，其具有包括交替布置的电介质层和形成在器件主体的外表面上的内部电极层和外部电极的器件本体，其中外部电极具有直接形成在器件的外表面上的底涂层 与内部电极层的至少一部分电连接，形成在底涂层的外表面上的中间层和形成在中间层的外表面上的外层; 底涂层包括主要由铜制成的第一导电材料和第一玻璃成分; 中间层包括主要由铜 - 钯基合金制成的第二导电材料; 并且外层包括主要由银制成并且还含有钯和第二玻璃成分的第三导电材料。
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公开(公告)号：US07518849B2
公开(公告)日：2009-04-14
申请号：US11727868
申请日：2007-03-28
IPC分类号： H01G4/06
CPC分类号： H01G4/0085 , H01G4/1227 , H01G4/30
摘要： A production method of a multilayer electronic device having an element body configured by alternately stacked dielectric layers formed by using dielectric paste and internal electrode layers formed by using conductive paste: wherein an adding quantity of a co-material included in conductive paste for forming internal electrode layers at the outermost positions in the stacking direction is larger than an adding quantity of a co-material included in conductive paste for forming internal electrode layers at the center position in the stacking direction when adding conductive particles and co-material particles to the conductive paste.
摘要翻译： 一种多层电子器件的制造方法，其具有通过使用电介质糊料形成的交替堆叠的电介质层和通过使用导电性糊料形成的内部电极层而构成的元件体，其中，包含在形成内部电极的导电性糊料中的共同材料的添加量 层叠方向上的最外侧位置的层比在导电性糊料中添加导电性粒子和助体材料粒子时，在叠层方向的中央位置形成内部电极层的导电性糊剂中所含的共同材料的添加量大 。
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公开(公告)号：US07304831B2
公开(公告)日：2007-12-04
申请号：US11347296
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
IPC分类号： H01G4/06
CPC分类号： H01G4/2325
摘要： A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
摘要翻译： 多层电容器包括陶瓷烧结体，设置在陶瓷烧结体中的内部电极和设置在陶瓷烧结体的外表面上的外部电极。 外部电极具有形成在陶瓷烧结体的外表面上的第一电极层，形成在第一电极层上的第二电极层和形成在第二电极层上的导电树脂层。 内部电极和第一电极层主要由贱金属组成。 第二电极层主要由贵金属或贵金属合金构成。 导电性树脂层含有作为导电材料的贵金属或贵金属合金。
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公开(公告)号：US20050041367A1
公开(公告)日：2005-02-24
申请号：US10914129
申请日：2004-08-10
申请人： Akitoshi Yoshii , Masanori Yamamoto
发明人： Akitoshi Yoshii , Masanori Yamamoto
CPC分类号： H01G2/065 , H01G4/228 , H01G4/232 , H05K3/3426 , H05K2201/10651 , Y02P70/613
摘要： An electronic component includes: an element having a pair of terminal electrodes; and a pair of metal terminals formed of metal materials respectively and connected to the pair of terminal electrodes respectively, in which: a portion of the metal terminal that extends from a base-end side of the metal terminal connectable to an external circuit to face the terminal electrode of the element is an electrode facing portion; and a tip side portion of the metal terminal in the electrode facing portion is connected to the terminal electrode, and a gap exists between a base-end side portion of the metal terminal in the electrode facing portion and the terminal electrode. Therefore, the electronic component is capable of fully absorbing a stress and realizes reduction in production cost.
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公开(公告)号：US07585802B2
公开(公告)日：2009-09-08
申请号：US12292042
申请日：2008-11-10
申请人： Kazushige Ito , Akira Sato , Akitoshi Yoshii , Masayuki Okabe , Atsushi Takeda , Takaki Shinkawa
发明人： Kazushige Ito , Akira Sato , Akitoshi Yoshii , Masayuki Okabe , Atsushi Takeda , Takaki Shinkawa
IPC分类号： C04B35/468
CPC分类号： H01G4/1227 , C04B35/468 , C04B35/6262 , C04B35/62675 , C04B35/62685 , C04B35/62805 , C04B35/62807 , C04B35/638 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3236 , C04B2235/3239 , C04B2235/3248 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3409 , C04B2235/3418 , C04B2235/3436 , C04B2235/3454 , C04B2235/6562 , C04B2235/6567 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2235/663 , C04B2235/78 , C04B2235/785 , H01G4/30
摘要： A dielectric ceramic composition comprised of at least dielectric particles having barium titanate as its main ingredient, wherein the ratio of dielectric particles having a surface diffusion structure comprised of a main ingredient phase comprised of the main ingredient and a diffusion phase present around the main ingredient phase with respect to said dielectric particles is 60% or more and the ratio of dielectric particles having a domain in the main ingredient phase with respect to the dielectric particles having the surface diffusion structure is 20% or less. According to the present invention, a dielectric ceramic composition and electronic device realizing good high temperature accelerated life can be provided.
摘要翻译： 一种电介质陶瓷组合物，其至少包括具有钛酸钡作为主要成分的电介质颗粒，其中具有表面扩散结构的电介质颗粒的比例包括主要成分相和主要成分相间的扩散相， 相对于所述电介质粒子为60％以上，并且在主成分相中具有畴的电介质粒子相对于具有表面扩散结构的电介质粒子的比率为20％以下。 根据本发明，可以提供实现良好的高温加速寿命的电介质陶瓷组合物和电子器件。
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公开(公告)号：US07584853B2
公开(公告)日：2009-09-08
申请号：US11313620
申请日：2005-12-22
IPC分类号： B65D85/00
CPC分类号： H05K13/0084 , Y10S206/813
摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.
摘要翻译： 本发明是一种电子部件系列，其包括载带，该载带具有沿着长度方向周期布置的多个存储凹部，要存储在多个存储凹部中的电子部件，覆盖多个存储凹部的盖带 的载带，以及粘合到载带和盖带的一对粘合区域，并且沿着载带的纵向方向延伸以便从两侧包围多个存储凹部，其中粘合宽度 一对粘合剂区域分别相应于储存凹槽的尺寸周期性地增加。 利用该电子部件系列，可以充分降低第一粘合区域和第二粘合区域之间的覆盖带的剥离强度的差异。
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公开(公告)号：US07177138B2
公开(公告)日：2007-02-13
申请号：US11295487
申请日：2005-12-07
申请人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
IPC分类号： H01G4/228
摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.
摘要翻译： 芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。 一对端子电极位于芯片元件本体的各个端部。 芯片元件主体具有作为与电路基板相对的安装面的一个侧面。 一对端子电极包括形成在安装面上的电极部。 这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向 和第二个方向。 电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长 在第三方向的两端区域。
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