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14 条记录 (耗时 0.027 秒)

    Joining apparatus and method
    1.
    发明申请
    Joining apparatus and method 有权
    连接装置和方法

    公开(公告)号：US20060037997A1

    公开(公告)日：2006-02-23

    申请号：US11136433

    申请日：2005-05-25

    申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    IPC分类号： B23K31/02

    CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/75 ,  H05K3/3489 ,  H05K2203/0285

    摘要： The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.

    摘要翻译： 接合装置包括用于保持电子部件的吸嘴，用于保持与电子部件相对的电路板的板台，以及放置在定位的电子部件和电路板之间的照射位置处的准分子紫外线灯。 在这样的接合装置中，由准分子紫外线灯同时进行对电子部件的Au凸块的紫外线照射和电路基板的电极板的紫外线照射，进行两个金属部的清洗处理。 此后，对这两个金属部分施加超声波振动，同时使这些金属部分彼此保持接触，由此满足两个金属部分之间的金属接合。

    Joining apparatus with UV cleaning
    2.
    发明授权
    Joining apparatus with UV cleaning 有权
    带紫外线清洗的接头装置

    公开(公告)号：US08240539B2

    公开(公告)日：2012-08-14

    申请号：US11136433

    申请日：2005-05-25

    申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    IPC分类号： B23K1/06 ,  B23K1/00 ,  B23K37/00 ,  B23K37/04

    CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/75 ,  H05K3/3489 ,  H05K2203/0285

    摘要： The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute a cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.

    摘要翻译： 接合装置包括用于保持电子部件的吸嘴，用于保持与电子部件相对的电路板的板台，以及放置在定位的电子部件和电路板之间的照射位置处的准分子紫外线灯。 在这种接合装置中，由准分子紫外线灯同时进行对电子部件的Au凸块的紫外线照射和电路基板的电极板的紫外线照射，以进行两个金属部的清洗处理。 此后，对这两个金属部分施加超声波振动，同时使这些金属部分彼此保持接触，由此满足两个金属部分之间的金属接合。

    Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device
    4.
    发明授权
    Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device 有权
    半导体发光元件及其制造方法和安装方法以及发光装置

    公开(公告)号：US07554126B2

    公开(公告)日：2009-06-30

    申请号：US11662547

    申请日：2005-09-22

    申请人： Kazushi Higashi ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Shinji Ishitani

    IPC分类号： H01L33/00

    CPC分类号： H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2933/0016

    摘要： An LED chip of the present invention has a structure in which an n-type semiconductor layer and a p-type semiconductor layer are successively formed on the lower face of an element substrate, with the p-type semiconductor layer being formed on an area except for an area for an n-electrode. A first n-electrode is formed on the area for the n-electrode and a first p-electrode is formed on the p-type semiconductor layer. A first insulating layer having openings and is formed on the first n-electrode and the first p-electrode, and a second n-electrode and a second p-electrode having virtually the same size are formed on the first insulating layer. With this arrangement, the electrode on the n-type semiconductor layer can be made larger, thereby a mounting process of LED chips onto a circuit board can be executed by using solder at low costs.

    摘要翻译： 本发明的LED芯片具有在元件基板的下表面上依次形成n型半导体层和p型半导体层的结构，p型半导体层形成在除了 用于n电极的区域。 在n电极的区域上形成第一n电极，在p型半导体层上形成第一p电极。 具有开口并形成在第一n电极和第一p电极上的第一绝缘层，以及具有实际相同尺寸的第二n电极和第二p电极形成在第一绝缘层上。 通过这种布置，可以使n型半导体层上的电极更大，从而可以通过以低成本使用焊料来执行LED芯片到电路板上的安装过程。

    ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    电子元件包装及其制造方法

    公开(公告)号：US20080137270A1

    公开(公告)日：2008-06-12

    申请号：US11952173

    申请日：2007-12-07

    申请人： Kazushi Higashi ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Shinji Ishitani

    IPC分类号： H05K7/14 ,  B23P17/04

    CPC分类号： G01P1/023 ,  B81B7/007 ,  B81B2201/025 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

    摘要翻译： 电子元件封装包括其上形成有检测器的板状传感器基板，以及板状第一盖基板和板状第二盖基板，其分别直接或间接地连接到上表面和下表面 传感器基板，使得传感器基板位于第一和第二盖基板之间，传感器基板包括经由空间围绕检测器的框架，将检测器连接到框架的梁和设置在框架上的电极，并电连接到 所述检测器，所述第一覆盖基板和所述第二盖板基板中的一个具有与电极接触的通孔。 电子元件封装能够减小厚度并提供改进的可靠性。

    Semiconductor Light-Emitting Element, Manufacturing Method and Mounting Method of the Same and Light-Emitting Device
    6.
    发明申请
    Semiconductor Light-Emitting Element, Manufacturing Method and Mounting Method of the Same and Light-Emitting Device 有权
    半导体发光元件及其制造方法及其安装方法及发光装置

    公开(公告)号：US20070262338A1

    公开(公告)日：2007-11-15

    申请号：US11662547

    申请日：2005-09-22

    申请人： Kazushi Higashi ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Shinji Ishitani

    IPC分类号： H01L33/00

    CPC分类号： H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2933/0016

    摘要： An LED chip of the present invention has a structure in which an n-type semiconductor layer and a p-type semiconductor layer are successively formed on the lower face of an element substrate, with the p-type semiconductor layer being formed on an area except for an area for an n-electrode. A first n-electrode is formed on the area for the n-electrode and a first p-electrode is formed on the p-type semiconductor layer. A first insulating layer having openings and is formed on the first n-electrode and the first p-electrode, and a second n-electrode and a second p-electrode having virtually the same size are formed on the first insulating layer. With this arrangement, the electrode on the n-type semiconductor layer can be made larger, thereby a mounting process of LED chips onto a circuit board can be executed by using solder at low costs.

    摘要翻译： 本发明的LED芯片具有在元件基板的下表面上依次形成n型半导体层和p型半导体层的结构，p型半导体层形成在除了 用于n电极的区域。 在n电极的区域上形成第一n电极，在p型半导体层上形成第一p电极。 具有开口并形成在第一n电极和第一p电极上的第一绝缘层，以及具有实际相同尺寸的第二n电极和第二p电极形成在第一绝缘层上。 通过这种布置，可以使n型半导体层上的电极更大，从而可以通过以低成本使用焊料来执行LED芯片到电路板上的安装过程。

    Electronic element package and method of manufacturing the same
    8.
    发明授权
    Electronic element package and method of manufacturing the same 有权
    电子元件封装及其制造方法

    公开(公告)号：US08077447B2

    公开(公告)日：2011-12-13

    申请号：US11952173

    申请日：2007-12-07

    申请人： Kazushi Higashi ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Shinji Ishitani

    IPC分类号： H05K5/00

    CPC分类号： G01P1/023 ,  B81B7/007 ,  B81B2201/025 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

    摘要翻译： 电子元件封装包括其上形成有检测器的板状传感器基板，以及板状第一盖基板和板状第二盖基板，其分别直接或间接地连接到上表面和下表面 传感器基板，使得传感器基板位于第一和第二盖基板之间，传感器基板包括经由空间围绕检测器的框架，将检测器连接到框架的梁和设置在框架上的电极，并电连接到 所述检测器，所述第一覆盖基板和所述第二盖板基板中的一个具有与电极接触的通孔。 电子元件封装能够减小厚度并提供改进的可靠性。