公开(公告)号：US07472678B2

公开(公告)日：2009-01-06

申请号：US11629707

申请日：2005-05-25

申请人： Keiichi Tsujimoto ,  Shunji Hamaoka

发明人： Keiichi Tsujimoto ,  Shunji Hamaoka

IPC分类号： F02B23/02 ,  F02B23/06 ,  F02F3/26

CPC分类号： F02B23/0696 ,  F02B23/0651 ,  F02B23/0669 ,  Y02T10/125

摘要： An object of the present invention is to provide a combustion chamber shape of a direct injection type diesel engine in which a black smoke generation amount can be suppressed during no-load operation while suppressing NOx and fuel consumption. The combustion chamber 5 is formed in a recessed shape in a piston top wall 3 and injecting fuel at a predetermined nozzle hole angle α into the combustion chamber 5 from a nozzle hole 20 of a fuel injection valve having a nozzle hole center O1 substantially on a cylinder center line. A wall face of the combustion chamber 5 includes: a conical mountain portion 12 formed at a central portion in the combustion chamber and having such a slope angle and skirt end diameter D2 that fuel spray does not collide with the mountain portion; a slope portion 14 that inclines downward and outward from a skirt end of the mountain portion 12 at a smaller angle than the slope angle of the mountain portion 12 and with which the fuel spray collides; and a saucer portion 15 which rises in an arc shape from an outer peripheral end of the slope portion 14 to reach an outer peripheral end of the combustion chamber and with which the fuel spray collides.

摘要翻译： 本发明的目的是提供一种直喷式柴油发动机的燃烧室形状，其中在空载运转期间可以抑制黑烟发生量同时抑制NOx和燃料消耗。 燃烧室5在活塞顶壁3中形成为凹形，并且从具有喷嘴孔中心O1的燃料喷射阀的喷嘴孔20将喷射孔角度α的燃料喷射到燃烧室5中， 气缸中心线。 燃烧室5的壁面包括：形成在燃烧室的中心部分并具有倾斜角度和裙部端部直径D2的锥形山部12，燃料喷雾不与山部相撞; 斜坡部分14以比山部部分12的倾斜角度更小的角度从山部分12的裙边向下和向外倾斜并与燃料喷雾器相撞; 以及从斜面部分14的外周端以弧形形状到达燃烧室的外周端并与燃料喷雾相撞的碟形部分15。

公开(公告)号：US20070272191A1

公开(公告)日：2007-11-29

申请号：US11629707

申请日：2005-05-25

申请人： Keiichi Tsujimoto ,  Shunji Hamaoka

发明人： Keiichi Tsujimoto ,  Shunji Hamaoka

IPC分类号： F02F1/24

CPC分类号： F02B23/0696 ,  F02B23/0651 ,  F02B23/0669 ,  Y02T10/125

摘要： An object of the present invention is to provide a combustion chamber shape of a direct injection type diesel engine in which a black smoke generation amount can be suppressed during no-load operation while suppressing NOx and fuel consumption. The combustion chamber 5 is formed in a recessed shape in a piston top wall 3 and injecting fuel at a predetermined nozzle hole angle α into the combustion chamber 5 from a nozzle hole 20 of a fuel injection valve having a nozzle hole center O1 substantially on a cylinder center line. A wall face of the combustion chamber 5 includes: a conical mountain portion 12 formed at a central portion in the combustion chamber and having such a slope angle and skirt end diameter D2 that fuel spray does not collide with the mountain portion; a slope portion 14 that inclines downward and outward from a skirt end of the mountain portion 12 at a smaller angle than the slope angle of the mountain portion 12 and with which the fuel spray collides; and a saucer portion 15 which rises in an arc shape from an outer peripheral end of the slope portion 14 to reach an outer peripheral end of the combustion chamber and with which the fuel spray collides.

摘要翻译： 本发明的目的是提供一种直喷式柴油发动机的燃烧室形状，其中在空载运转期间可以抑制黑烟发生量同时抑制NOx和燃料消耗。 燃烧室5在活塞顶壁3中形成为凹形，并且从具有喷嘴孔中心O 1的燃料喷射阀的喷嘴孔20将燃料以预定喷嘴孔角α喷射到燃烧室5中，喷嘴孔20基本上在 气缸中心线。 燃烧室5的壁面包括：形成在燃烧室的中心部分并且具有倾斜角度和裙部端部直径D 2的锥形山部12，燃料喷雾不与山部相撞; 斜坡部分14以比山部部分12的倾斜角度更小的角度从山部分12的裙边向下和向外倾斜并与燃料喷雾器相撞; 以及从斜面部分14的外周端以弧形形状到达燃烧室的外周端并与燃料喷雾相撞的碟形部分15。

公开(公告)号：US20070079608A1

公开(公告)日：2007-04-12

申请号：US10579493

申请日：2004-11-12

申请人： Hiroshi Omote ,  Shunji Hamaoka ,  Keiichi Tsujimoto

发明人： Hiroshi Omote ,  Shunji Hamaoka ,  Keiichi Tsujimoto

IPC分类号： F01N5/02 ,  F01N7/00

CPC分类号： F02F1/4264 ,  F01N13/10

摘要： The present invention relates to an exhaust manifold for a supercharger-equipped internal combustion engine having multiple cylinders capable of preventing an increase in the fuel consumption and of reducing load application time. The engine satisfies at least one of the following expressions, where D is the diameter of a main tube of the exhaust manifold, d is the diameter of a branch tube, D1 is the diameter of a passage of a connection connecting the branch tube to the main tube, R is the radius in the outer peripheral side of the connection smoothly connecting the branch tube to the main tube of the exhaust manifold, and r is the radius in the inner circumference side. 1.2≦(D/d)2 ≦2.5, 0.8≦(d/de)2≦1.2, 0.7≦(D/D1)2≦1.4, 1.7≦R/r≦2.1.

摘要翻译： 本发明涉及一种具有多个气缸的增压器内燃机的排气歧管，能够防止燃料消耗的增加和减少负荷施加时间。 发动机满足以下表达式中的至少一个，其中D是排气歧管的主管的直径，d是分支管的直径，D 1是通道的直径 连接分支管与主管的连接，R是连接的外周侧的半径，平滑地将分支管连接到排气歧管的主管，r是内周侧的半径。 1.2 <=（D / D）2 <= 2.5,0.8 <=（D / DE）2 <= 1.2,0.7 <=（D / D> 1 2 <= 1.4，1.7 <= R / r <= 2.1。

公开(公告)号：US20050120995A1

公开(公告)日：2005-06-09

申请号：US10502343

申请日：2002-12-24

申请人： Keiichi Tsujimoto ,  Shunji Hamaoka ,  Shusuke Okada

发明人： Keiichi Tsujimoto ,  Shunji Hamaoka ,  Shusuke Okada

IPC分类号： F02B3/06 ,  F02B23/06 ,  F02M61/14 ,  F02M61/18 ,  F02B3/00

CPC分类号： F02M61/182 ,  F02B3/06 ,  F02B23/0621 ,  F02B23/0669 ,  F02B23/0696 ,  F02B2275/14 ,  F02M61/14 ,  F02M61/145 ,  F02M61/1826 ,  Y02T10/123 ,  Y02T10/125

摘要： A diesel engine including a shallow-dish type combustion chamber on the top face of a piston. A fuel injection valve projects toward the combustion chamber, where a plurality of first nozzle holes are arranged in the same circumference of the fuel injection valve. A plurality of second nozzle holes having a diameter smaller than that of the first nozzle holes are provided in a circular side wall of the fuel injection valve, the circular side wall locating opposite to the tip part of the valve with respect to the first nozzle holes. The first nozzle holes and the second nozzle holes are staggered so that the sprays of the fuel ejected from the first nozzle holes and the second nozzle holes do no cross one another.

摘要翻译： 一种柴油发动机，其包括活塞顶面上的浅盘型燃烧室。 燃料喷射阀朝向燃烧室突出，其中多个第一喷嘴孔布置在燃料喷射阀的同一圆周上。 在燃料喷射阀的圆形侧壁中设置有直径小于第一喷嘴孔直径的多个第二喷嘴孔，与第一喷嘴孔的顶端部相对的圆形侧壁 。 第一喷嘴孔和第二喷嘴孔交错，使得从第一喷嘴孔和第二喷嘴孔喷出的燃料喷雾不互相交叉。

公开(公告)号：US5545922A

公开(公告)日：1996-08-13

申请号：US404534

申请日：1995-03-15

申请人： Suresh V. Golwalkar ,  Richard Foehringer ,  Michael Wentling ,  Ryo Takatsuki ,  Shigeo Kawashima ,  Keiichi Tsujimoto ,  Nobuaki Sato

发明人： Suresh V. Golwalkar ,  Richard Foehringer ,  Michael Wentling ,  Ryo Takatsuki ,  Shigeo Kawashima ,  Keiichi Tsujimoto ,  Nobuaki Sato

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121

摘要： A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

摘要翻译： 公开了一种用于将双面芯片封装构造到引线框上的方法，所述引线框具有管芯焊盘和对应于管芯焊盘的引线组。 集成电路管芯设置在管芯焊盘的每一侧上，而引线框由具有容纳集成电路管芯的空腔的支撑块支撑，并且支撑每个引线指，并为先前形成的引线接合的针脚接合提供间隙。 此后，在包括双集成电路管芯，管芯焊盘和引线接合的每个组件周围形成一步塑料模具。

公开(公告)号：US06809409B2

公开(公告)日：2004-10-26

申请号：US10324892

申请日：2002-12-20

申请人： Atsushi Fukui ,  Keiichi Tsujimoto

发明人： Atsushi Fukui ,  Keiichi Tsujimoto

IPC分类号： H01L23495

CPC分类号： H01L21/6836 ,  H01L23/3114 ,  H01L23/49805 ,  H01L24/48 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.

摘要翻译： 一种引线框架，具有主体，所述主体具有分别朝向第一和第二方向并且位于第一和第二基本平行的参考平面中的相对面对的基本上平面的第一和第二表面。 主体限定了用于半导体芯片和多个引线的支撑。 支撑体具有面向可以安装半导体芯片的第一方向的第三表面和面向第二方向的第四表面。 第四表面的至少一部分与第二参考平面朝向第一参考平面间隔开。

公开(公告)号：US5527740A

公开(公告)日：1996-06-18

申请号：US267878

申请日：1994-06-28

申请人： Suresh V. Golwalkar ,  Richard Foehringer ,  Michael Wentling ,  Ryo Takatsuki ,  Shigeo Kawashima ,  Keiichi Tsujimoto ,  Nobuaki Sato

发明人： Suresh V. Golwalkar ,  Richard Foehringer ,  Michael Wentling ,  Ryo Takatsuki ,  Shigeo Kawashima ,  Keiichi Tsujimoto ,  Nobuaki Sato

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121

摘要： A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

摘要翻译： 公开了一种用于将双面芯片封装构造到引线框上的方法，所述引线框具有管芯焊盘和对应于管芯焊盘的引线组。 集成电路管芯设置在管芯焊盘的每一侧上，而引线框由具有容纳集成电路管芯的空腔的支撑块支撑，并且支撑每个引线指，并为先前形成的引线接合的针脚接合提供间隙。 此后，在包括双集成电路管芯，管芯焊盘和引线接合的每个组件周围形成一步塑料模具。