摘要:
A semiconductor integrated circuit device has, in one embodiment, a pair of signal transmission lines formed over and insulated from a semiconductor substrate, a first circuit formed in the semiconductor substrate and electrically connected with one end of the pair of signal transmission lines for sending an electric signal, and a second circuit formed in the semiconductor substrate and electrically connected with the other end of the pair of signal transmission lines for receiving the electric signal propagating over the transmission line pair. A control resistance is electrically connected between the pair of transmission lines at the above-mentioned other end for controlling a delay time of the signal propagating over the pair of signal transmission lines between the opposite ends of the pair of signal transmission lines.
摘要:
A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.
摘要:
A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising a thin film substrate including a signal wiring layer therein, a thick film substrate laminated together with the thin film substrate, and at least a part of signal wiring being formed as a signal wiring layer included in the thick film substrate.
摘要:
The present invention relates to a chip carrier, on which LSI chips are mounted and a chip carrier is disclosed, in which a region where power source throughholes are arranged and a region where signal throughholes are arranged are separated from each other and a coupling capacitor is formed only in the region where the power source throughholes are arranged with an intention to reduce noise.
摘要:
A semiconductor integrated circuit structure including a semiconductor substrate having a large area adapted for a large scale integration, a circuit formed in the substrate for generating a pair of complementary signals, a pair of common potential level layers with an electrically insulating layer interposed therebetween, the common potential level layers being formed above and being electrically insulated from the substrate, and a pair of electric conductor pattern layers formed in the insulating layer for conducting the pair of complementary signals. The electric conductor pattern layers are arranged so as to be overlapped with each other in a direction substantially perpendicular to the large area substrate and so as to be substantially parallel with the large area substrate. The overall length of the electric conductor pattern layers is such that when an electric signal is conducted through an electric conductor in an IC having a length equal to the above-mentioned overall length, attenuation of the signal thereby is not negligible.
摘要:
In a wake-up apparatus for waking up a sleeper by light stimulus, it wakes the sleeper comfortably without feeling glare. A lighting device has a first lighting unit at a position that a light emitting face cannot be observed directly by the sleeper, and a second lighting unit at a position that a light emitting face can be observed directly by the sleeper. A control device activates the lighting device a predetermined time before a preset wake-up time so as to vary illuminance of light emitted from the lighting device in an order of low illuminance, middle illuminance and high illuminance, to light only the first lighting unit in a low illuminance condition and a middle illuminance condition, and to light both of the first lighting unit and the second lighting unit in a high illuminance condition, and quickly varies from the middle illuminance condition to the high illuminance condition.
摘要:
A logic circuit determines the power consumption of a semiconductor integrated device by taking into consideration the variation of the rate of operation. A control signal (TEST) is applied to each control signal input port (Tin) of flip-flop circuits of flip-flop circuit groups and a logic gate circuit having a plurality of input ports A and B in a combined circuit group. If the control signal (TEST) is low, both the flip-flop circuits and the logic gate circuit operate normally. However, if the control signal (TEST) is high, each of them performs the power consumption test. Regardless of the value of input signals applied to input ports D1 and D2 of the flip-flop circuits, the flip-flop circuits are controlled to have a repetitive output signal of high and low levels at ports Q1 and Q2, in synchronism with a clock signal. Through this operation test, operational failure is reduced and the quality of semiconductor chip production is guaranteed, because it is possible to predict accurately the power consumption when designing the logic circuit due to the relationship between the rate of operation and the power consumption.
摘要:
A polymerization catalyst which exhibits a high activity and a good hydrogen response and thus is suitable for the production of an ethylene polymer having a wide molecular weight range can be obtained by a method using a chromium compound, an organic aluminum compound and a carrier and comprising the following steps (a) to (d): (a) contacting a chromium compound with a carrier in the presence or absence of a solvent; (b) adding an organic aluminum compound to said contacted substances at a temperature of not higher than 60° C. in an amount such that the mixing ratio of said organic aluminum compound to said chromium compound falls within the range of from 0.5/1 to 100/1 as calculated in terms of the ratio of aluminum atom/chromium atom (Al/Cr molar ratio) and that the following relationship (1) is satisfied: log10t≦0.33log10C+0.35 (1) wherein t represents the time (min) required until the organic aluminum compound is added to give an Al/Cr molar ratio of 10/1; and C represents the amount of the carrier used (Kg); (c) after the addition of the organic aluminum compound, stirring at a temperature of from 0° C. to 60° C. for 0.5 to 4 hours; and (d) removing the solvent used, unreacted matters and by-products at a temperature of not higher than 60° C. in such a manner that the following relationship (2) is satisfied: log10T≦0.23log10C+1.10 (2) wherein T represents the time required until the removal is completed; and C represents the amount of the carrier used (Kg).
摘要:
In transmitting and receiving signals between a plurality of units in a information processing system, signals can be transmitted and received between circuits operated by asynchronous clocks which are the same in period (frequency) but not necessarily to be the same in phase, thereby permitting the information processing system to operate with a shorter clock period. A delay circuit arranged in the communication path is so controllable that the data sent out in synchronism with the clock signal of a transmitting unit is correctly retrieved in synchronism with the clock signal of a receiving unit. Further, data having a predetermined simple pattern is sent out in synchronism with the clock signal of the transmitting unit, and it is decided whether the data has been correctly received by the receiving unit. The delay circuit is automatically controlled by use of the result of decision.
摘要:
A motor pump group has a plurality of centrifugal pumps of the same nominal port diameter including a plurality of impellers having stepwise greater outside diameters for stepwise higher pump heads, and a plurality of respective motors for actuating the pumps. The pump heads are classified into a low head section and a high head section. The low head section is handled by a single-stage impeller, and the high head section is handled by multi-stage impellers. The centrifugal pumps have respective pressed-sheet pump casings. The outside diameters of the impellers are not required to be increased in the high head section, and the outside diameters of the pump casings fall in a relatively small range.