Thin Film Semiconductor Device and Method for Manufacturing the Same
    1.
    发明申请
    Thin Film Semiconductor Device and Method for Manufacturing the Same 审中-公开
    薄膜半导体器件及其制造方法

    公开(公告)号:US20080185667A1

    公开(公告)日:2008-08-07

    申请号:US11663057

    申请日:2004-09-17

    IPC分类号: H01L29/786 H01L21/28

    摘要: An Mo film (6) is formed on a SiO2 film (5) by particularly using the film thickness and the deposition temperature (ambient temperature in a sputtering chamber) as the primary parameters and adjusting the film thickness to be within the range from 100 nm to 500 nm (more preferably 100 nm to 300 nm) and the deposition temperature to be within the range from 25° C. to 300° C., so as to control residual stress to have a predetermined value of 300 MPa or greater and to be oriented to increase the in-plane lattice constant. There can be thus provided a reliable CMOSTFT in which desired strain is easily and reliably imparted to polysilicon thin films (4a and 4b) to improve the mobility therein without adding an extra step of imparting the strain to the silicon thin film.

    摘要翻译: 通过特别使用膜厚度和沉积温度(溅射室中的环境温度)作为主要参数,在SiO 2膜(5)上形成Mo膜(6)并调节膜厚度 为100nm〜500nm(更优选为100nm〜300nm),淀积温度为25℃〜300℃的范围,从而将残留应力控制为具有规定的 值为300MPa以上,并且取向为增加面内晶格常数。 因此可以提供可靠的CMOSTFT,其中期望的应变容易且可靠地赋予多晶硅薄膜(4a和4b),以提高其迁移率,而不增加赋予硅薄膜的应变的额外步骤。

    Polysilicon film forming method
    2.
    发明授权
    Polysilicon film forming method 有权
    多晶硅膜成型方法

    公开(公告)号:US06692999B2

    公开(公告)日:2004-02-17

    申请号:US10037492

    申请日:2002-01-03

    IPC分类号: H01L2100

    摘要: There is provided the step of forming a polysilicon film by scanning a laser irradiation region while irradiating a continuous wave laser onto an amorphous silicon film formed into an island or ribbon-like shape on a substrate. If a width of a rectangle in which the amorphous silicon film is inscribed is 30 &mgr;m or less, any one condition of (1) a top end shape of a pattern is a convex shape, (2) a top end shape is a concave shape and consists of straight lines and has three corner portions at a top end side, and both angles of the corner portions on both sides of the top end shape are set to 45 degree or more, (3) a top end shape is a concave shape and consists of curved lines, and (4) a width of a top end portion is 25 &mgr;m or less, is satisfied.

    摘要翻译: 提供了通过扫描激光照射区域同时将连续波激光照射到在基板上形成为岛状或带状形状的非晶硅膜上而形成多晶硅膜的步骤。 如果非晶硅膜内接的矩形的宽度为30μm以下,则(1)图案的顶端形状的任一条件为凸形,(2)顶端形状为凹形 并且由直线构成,并且在顶端侧具有三个角部,顶端形状的两侧的角部的两个角度被设定为45度以上,(3)顶端形状为凹形 并且由曲线构成,(4)顶端部的宽度为25μm以下。

    Method of manufacturing semiconductor device with polysilicon film
    3.
    发明授权
    Method of manufacturing semiconductor device with polysilicon film 有权
    制造具有多晶硅膜的半导体器件的方法

    公开(公告)号:US06677222B1

    公开(公告)日:2004-01-13

    申请号:US09637276

    申请日:2000-08-11

    IPC分类号: H01L2120

    摘要: A first layer made of polysilicon is formed on the surface of an underlying substrate. The surface of the first layer is exposed to an environment which etches silicon oxide. If the surface of the first layer is covered with a silicon oxide film, the silicon oxide film is removed. An energy is supplied to the first layer, the energy allowing silicon crystal to re-grow. Solid phase growth of silicon occurs in the first layer to planarize the surface thereof. A polysilicon film having small root mean square of roughness can be formed.

    摘要翻译: 在下面的衬底的表面上形成由多晶硅制成的第一层。 第一层的表面暴露于蚀刻氧化硅的环境中。 如果第一层的表面被氧化硅膜覆盖,则去除氧化硅膜。 能量被供应到第一层,能量允许硅晶体再生长。 在第一层中发生硅的固相生长以平坦化其表面。 可以形成具有小的粗糙度均方根的多晶硅膜。

    Semiconductor device
    8.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07795619B2

    公开(公告)日:2010-09-14

    申请号:US11138431

    申请日:2005-05-27

    申请人: Akito Hara

    发明人: Akito Hara

    IPC分类号: H01L31/036

    摘要: A method for manufacturing a semiconductor device, including the steps of: forming a shielding film 38 on a first insulating film 37; sequentially forming a second insulating film 39 and an amorphous semiconductor film 40 on the shielding film 38; melting the amorphous semiconductor film 40 at least in portions to be channels of thin-film transistors by irradiating an energy beam onto the amorphous semiconductor film 40, and converting the amorphous semiconductor film 40 into a polycrystalline semiconductor film 41; sequentially forming a gate insulating film 43a and a gate electrode 44a on the polycrystalline semiconductor film 41 on the channels; and forming source and drain regions 41a in the polycrystalline semiconductor film 41 on sides of the gate electrode 44a, and forming a TFT 60 by use of the source and drain regions 41a, the gate insulating film 43a, and the gate electrode 44a.

    摘要翻译: 一种制造半导体器件的方法,包括以下步骤:在第一绝缘膜37上形成屏蔽膜38; 在屏蔽膜38上依次形成第二绝缘膜39和非晶半导体膜40; 通过将能量束照射到非晶半导体膜40上,将非晶半导体膜40至少部分地熔融成为薄膜晶体管的沟道,并将非晶半导体膜40转换为多晶半导体膜41; 在通道上的多晶半导体膜41上依次形成栅极绝缘膜43a和栅电极44a; 以及在多晶半导体膜41中在栅电极44a的侧面上形成源极和漏极区域41a,并且通过使用源极和漏极区域41a,栅极绝缘膜43a和栅极电极44a形成TFT60。

    Semiconductor device with polysilicon layer of good crystallinity and
its manufacture method
    9.
    发明授权
    Semiconductor device with polysilicon layer of good crystallinity and its manufacture method 失效
    具有多晶硅层的半导体器件具有良好的结晶度及其制造方法

    公开(公告)号:US5970369A

    公开(公告)日:1999-10-19

    申请号:US976012

    申请日:1997-11-21

    CPC分类号: H01L21/2026

    摘要: A multilayer polysilicon semiconductor device having a first layer of amorphous semiconductor deposited on the surface of an underlying substrate. The first layer is polycrystallized by applying an energy beam to the first layer. A second layer is deposited on the surface of the polycrystallized first layer, the second layer being made of amorphous semiconductor having the same composition as the first layer or polycrystalline semiconductor. Crystallinity of the second layer is changed by applying an energy beam to the second layer. The substrate may be heated when the energy beam is applied to the second layer.

    摘要翻译: 一种多层多晶硅半导体器件,具有沉积在下面的衬底的表面上的第一非晶半导体层。 第一层通过向第一层施加能量束而多晶化。 第二层沉积在多结晶第一层的表面上,第二层由具有与第一层或多晶半导体相同组成的非晶半导体制成。 通过向第二层施加能量束来改变第二层的结晶度。 当能量束施加到第二层时,衬底可以被加热。

    Semiconductor device and manufacturing method thereof
    10.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08264012B2

    公开(公告)日:2012-09-11

    申请号:US12908231

    申请日:2010-10-20

    申请人: Akito Hara

    发明人: Akito Hara

    IPC分类号: H01L29/76

    摘要: A semiconductor device includes a field effect transistor and a strain generating layer to apply a stress to a channel region of the field effect transistor. The strain generating layer contains at least one of oxygen and nitrogen of 1.0×1018 cm−3 to 5.0×1019 cm−3, or alternatively, the strain generating layer contains self-interstitial atoms and/or vacancies of 1.0×1018 cm−3 to 5.0×1019 cm−3. In the latter case, at least a portion of the self-interstitial atoms and/or the vacancies exist as a cluster.

    摘要翻译: 半导体器件包括场效应晶体管和应力产生层,以向场效应晶体管的沟道区域施加应力。 应变产生层含有1.0×10 18 cm -3〜5.0×10 19 cm -3的氧和氮中的至少一种,或者,应变产生层含有1.0×10 18 cm -3的自间隙原子和/或空位 至5.0×1019cm-3。 在后一种情况下,至少一部分自间隙原子和/或空位作为簇存在。