Electric power supply system for LED lighting unit
    1.
    发明授权
    Electric power supply system for LED lighting unit 失效
    LED照明单元电源系统

    公开(公告)号:US06897623B2

    公开(公告)日:2005-05-24

    申请号:US10686234

    申请日:2003-10-15

    IPC分类号: H05B33/08 H05B37/00

    CPC分类号: H05B33/0848

    摘要: An electric power supply system is provided to recognize a type or a desired operating condition of a connected LED lighting unit automatically and to supply electric power corresponding to the type or the operating condition.An electric power supply system for LED lighting unit comprises an LED lighting unit 1 that has an LED conducting circuit including at least an LED 2 and a resistor 4 having resistance R corresponding to a specification or a characteristics of use of the LED conducting circuit and an electric power supply unit 5 consisting of a constant current supply that can be connected with both ends of the LED conducting circuit in order to supply electric power to the LED conducting circuit and is so arranged that a type identify portion 9 consisting of a resistor measuring circuit that can be connected with both ends of the resistor and a constant current control portion 8 that supplies a control current in an arbitrary range not over the maximum allowable current of the LED conducting circuit set based on the resistance of the resistor measured by the type identify portion 9 to the LED conducting circuit.

    摘要翻译: 提供电力供应系统以自动识别连接的LED照明单元的类型或期望的操作条件,并提供与类型或操作条件相对应的电力。 一种用于LED照明单元的电力供应系统包括具有LED导通电路的LED照明单元1,所述LED导通电路至少包括LED 2和具有对应于LED导通电路的使用的特性或特性的电阻R,以及 电源单元5,其由可以与LED导通电路的两端连接的恒流源组成,以便向LED导电电路提供电力,并且被布置成使得由电阻测量电路 可以与电阻器的两端连接,恒定电流控制部8以不同于LED导通电路组的最大允许电流的任意范围内提供控制电流,该电流控制部8基于由型号识别 部分9连接到LED导电电路。

    LED light source device
    7.
    发明授权
    LED light source device 失效
    LED光源装置

    公开(公告)号:US08591063B2

    公开(公告)日:2013-11-26

    申请号:US13266354

    申请日:2010-12-27

    申请人: Kenji Yoneda

    发明人: Kenji Yoneda

    IPC分类号: F21S4/00 F21V21/00

    摘要: The present invention is intended to thermally isolate an LED and a control part from each other to make it difficult to thermally influence each other, and also to optimize fin shapes suitable for allowable temperatures of the both respectively, and is provided with: a first housing that contains an LED board; a second housing that contains an LED control part; a connecting member that connects the first housing and the second housing to each other; a fan mechanism that is provided between the first housing and the second housing; heat dissipation fins that are provided around the fan mechanism in the first housing; and an air path of which one end opening is formed at a position facing to an air inlet side of the fan mechanism in the second housing, and the other opening is formed on a surface different from an opposed surface of the second housing.

    摘要翻译: 本发明旨在将LED和控制部件彼此热隔离,使得难以彼此热影响,并且还优选分别适合于两者的允许温度的翅片形状,并且设置有:第一壳体 包含一个LED板; 第二壳体,其包含LED控制部件; 连接构件,其将所述第一壳体和所述第二壳体彼此连接; 风扇机构,其设置在所述第一壳体和所述第二壳体之间; 设置在第一壳体中的风扇机构周围的散热片; 在第二壳体的与风扇机构的空气入口侧相对的位置上形成有一个端部开口的空气路径,另一个开口形成在与第二壳体的相对表面不同的表面上。

    LIGHT IRRADIATING DEVICE
    8.
    发明申请
    LIGHT IRRADIATING DEVICE 审中-公开
    光照射装置

    公开(公告)号:US20120201023A1

    公开(公告)日:2012-08-09

    申请号:US13500468

    申请日:2010-09-15

    申请人: Kenji Yoneda

    发明人: Kenji Yoneda

    IPC分类号: F21V29/00 F21V7/00 F21V21/00

    摘要: In order to enable heat from luminous objects to be effectively radiated, and assembly to be simplified to facilitate downsizing and the like, a linear light irradiating device is configured such that a luminous object mounting board is contained in a bottom-equipped groove-like containing space in a body in a bending state of being elastically deformed, and also on the basis of an elastic restoring force of the board, a back surface of a luminous object mounting region in the board or vicinity of the back surface is pressed against and brought into close contact with a fore end surface of an intervening object that has thermal conductivity and is made to protrude from an inner circumferential surface of the containing space.

    摘要翻译: 为了使得发光体的热量得到有效辐射,并且组装简化以便于小型化等,线性光照射装置被构造成使得发光体安装板被包含在底部装有槽状的容纳 弹性变形的弯曲状态下的身体的空间,并且基于板的弹性恢复力,背面的板或附近的发光体安装区域的背面被按压并带动 与具有导热性并从容纳空间的内周面突出的中间物体的前端面紧密接触。

    Semiconductor manufacturing apparatus
    9.
    发明授权
    Semiconductor manufacturing apparatus 失效
    半导体制造装置

    公开(公告)号:US08058631B2

    公开(公告)日:2011-11-15

    申请号:US12637272

    申请日:2009-12-14

    IPC分类号: G01K1/08 H01J3/26

    摘要: A semiconductor manufacturing includes: an ion source and a beam line for introducing an ion beam into a target film which is formed over a wafer with an insulating film interposed therebetween; a flood gun for supplying the target film with electrons for neutralizing charges contained in the ion beam; a rotating disk for subjecting the target film to mechanical scanning of the ion beam in two directions composed of r-θ directions; a rear Faraday cage for measuring the current density produced by the ion beam; a disk-rotational-speed controller and a disk-scanning-speed controller for changing the scanning speed of the target film; and a beam current/current density measuring instrument for controlling, according to the current density, the scanning speed of the target film.

    摘要翻译: 半导体制造包括:离子源和用于将离子束引入到晶片之间的绝缘膜之间形成的靶膜的离子束; 用于向目标膜提供用于中和离子束中的电荷的电子的洪水枪; 旋转盘,用于对目标膜进行离子束的机械扫描,所述两个方向由r-和tt组成; 方向; 用于测量由离子束产生的电流密度的后法拉第笼; 盘转速控制器和用于改变目标膜的扫描速度的盘扫描速度控制器; 以及用于根据电流密度控制目标膜的扫描速度的束电流/电流密度测量仪器。