摘要:
A transcription system (100) includes a computer (102), a monitor (104), and a microphone (110). Via the microphone, a user of the system provides input speech that is received and transcribed (204) by the system. The system monitors (205) the accuracy of the transcribed speech during transcription. The system also determines (210) whether the accuracy of the transcribed speech is sufficient and, if not, automatically activates (214) a speech recognition improvement tool and alerts (212) the user that the tool has been activated. This tool could also be manually activated (206) by the user. The type of recognition problem is identified (216) by the user or automatically by the system, and the system provides (218) possible solution steps for enabling the user to adjust (219) system parameters or modify user behavior in order to alleviate the recognition problem. The system also provides the user the ability to test (222) the transcription process in order to determine whether the solution has improved the recognition accuracy.
摘要:
A transcription system (100) includes a computer (102), a monitor (104), and a microphone (110). Via the microphone, a user of the system provides input speech that is received and transcribed (204) by the system. The system monitors (205) the accuracy of the transcribed speech during transcription. The system also determines (210) whether the accuracy of the transcribed speech is sufficient and, if not, automatically activates (214) a speech recognition improvement tool and alerts (212) the user that the tool has been activated.
摘要:
In a method for measuring a distance from a base area (5) to a cross section, with a predefined diameter (A), of a tapering area (1.1) of a body (1), which tapering area forms an elevation or depression and has a circular cross-sectional form, a measuring body (3) with a diameter (A) is arranged on the base area (5). The arrangement is effected in such a manner that a distance in the form of a gap (6, X) is formed between the cross-sectional area, with the diameter (A), of the body (1) and the measuring body (3). A fluid medium is pressed through the gap (6, X) and the pressure and/or the flow rate of the fluid medium is/are measured. The distance value is determined in an evaluation device (9) on the basis of the measured pressure and/or the flow rate.
摘要:
In a method for measuring a distance from a base area (5) to a cross section, with a predefined diameter (A), of a tapering area (1.1) of a body (1), which tapering area forms an elevation or depression and has a circular cross-sectional form, a measuring body (3) with a diameter (A) is arranged on the base area (5). The arrangement is effected in such a manner that a distance in the form of a gap (6, X) is formed between the cross-sectional area, with the diameter (A), of the body (1) and the measuring body (3). A fluid medium is pressed through the gap (6, X) and the pressure and/or the flow rate of the fluid medium is/are measured. The distance value is determined in an evaluation device (9) on the basis of the measured pressure and/or the flow rate.
摘要:
In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.
摘要:
On the production of wire connections (wire bonding) which start from a semiconductor chip and end on a substrate (2b) the capillary (12) guiding the wire (3) should be moved to an end section (s3) of its trajectory in a specific, programmed way in order to eliminate as far as possible reactions on the geometry of the wire bridge on bonding of the wire to the substrate and to produce flawless bond connections. The end section (s3) in which the capillary (12) moves slowly begins at a predetermined height (H) and ends on the substrate at the second connection point (5). In the end section (s3) the downward movement (vv) of the capillary is superimposed by a horizontal movement (vh) which is directed away from the already existing connection of the wire (3) to the chip and which continually decreases in relationship to the downward movement (vv).
摘要:
Laser pulses are generated by means of a gas laser in which a gas mixture containing carbon dioxide, nitrogen and helium is at every pulse exposed to an electrical discharge. To achieve a homogeneous discharge, the vapor of a metallocene is added to the gas mixture which prior to at least a first discharge is irradiated with a pulse of ultra-violet light.
摘要:
A linear motion guide for mounting and longitudinally guiding machine parts, in which a first guide element provided to be fixed to a machine part is guided by a plurality of rolling elements along a longitudinal movement axis with respect to a second guide element, likewise provided to be fixed to a machine part, for this purpose each guide element has a groove-like recess running parallel to the longitudinal movement axis, boundary surfaces of the recess in each guide element are provided as rolling surfaces for the rolling elements, the rolling elements are arranged one after another in one or more rows in at least one cage between the two guide elements, the cage is provided with at least one first positive guide, the cage with its first positive guide being guided by second positive guide fixed to the guide elements, each second positive guide being arranged only on one of the guide elements and being fixed in position relative to the latter. In order to provide this type of linear motion guide with accurate guidance and favourable fabrication and assembly properties, it is proposed that the second positive guide is fixed to the respective guide element (1, 2) outside the groove-like recesses (4, 5) and project between the two guide elements in order to guide the first positive guide and here are operatively connected to the first positive guide.
摘要:
In wire bonding a semiconductor chip to the lead frame or other substrate, increase of productivity is achieved by letting the capillary which guides the wire between the wiring points (4, 5) move faster along its trajectory in the two travel stages (s1, s2). The capillary's drives in the horizontal (x, y) and vertical (z) directions are programmed by presetting the speed (vH) of the horizontal component of the movement and then calculating the vertical speed (vV) as a dependent variable based on the given trajectory. In determining said horizontal speed (vH) to be preset, the maximum horizontal and/or vertical acceleration values (aH*, aV*) associated with the drive mechanism are taken into account. Further time can be saved by letting the horizontal travel begin during the first travel stage (s1) and, by simultaneous vertical and horizontal travel, producing a steady transition (point k') from the first stage (s1) to the second (s2).