摘要:
A circuit includes a resistance-capacitance (RC) structure connected to a first set of transistors and a second set of transistors that perform the same logical function as the first set of transistors. The first set of transistors have thinner gate oxides than the second set of transistors. The RC structure drains an electric field from the first set of transistors, such that the first set of transistors are on only during initial transistor switching. In other words, the RC structure turns off the first set of transistors after transistor switching is completed. Also, the first set of transistors and the second set of transistors share common inputs and outputs. The first set of transistors exhibit higher tunneling currents than the second set of transistors. The thinner gate oxides of the first set of transistors cause the first set of transistors to exhibit higher device currents than the second set of transistors. The RC structure includes a capacitor connected to a gate of the first set of transistors and a resistor connected to the capacitor and to ground.
摘要:
A differential logic circuit (20, 120, 220, 320, 420 and 520) designed to ensure stability of the output of the circuit. The logic circuit includes a differential load structure (22, 122, 222, 322, 422) that is connected to evaluate transistors (50, 52, 54, 56). In several embodiments, the outputs of the load transistors (30, 32) in the differential load structure are connected to the bodies of the evaluate transistors. In the other embodiments, the outputs of the load transistors in the differential structure are connected to one of the gates of a double-gated evaluate transistors. Level-shifting output buffers (160, 178) are used in connection with the embodiments of the invention that do not include double-gated evaluate transistors.
摘要:
A radiation detector formed using silicon-on-insulator technology. The radiation detector includes a silicon layer formed on an insulating substrate, wherein the silicon layer includes a PNPN structure, and a gate layer formed over the PNPN structure, wherein the gate layer includes a PN gate. Latch-up occurs in the radiation detector only in response to incident radiation.
摘要:
A semiconductor memory device comprising: an SOI substrate having a thin silicon layer on top of a buried insulator; and an SRAM comprising four NFETs and two PFETs located in the thin silicon layer, each the NFET and PFET having a body region between a source region and a drain region, wherein the bodies of two of the NFETs are electrically connected to ground. Additionally, the bodies of the two PFETs are electrically connected to VDD.
摘要:
A semiconductor memory device comprising: an SOI substrate having a thin silicon layer on top of a buried insulator; and an SRAM comprising four NFETs and two PFETs located in the thin silicon layer, each the NFET and PFET having a body region between a source region and a drain region, wherein the bodies of two of the NFETs are electrically connected to ground. Additionally, the bodies of the two PFETs are electrically connected to VDD.
摘要:
A body contact structure utilizing an insulating structure between the body contact portion of the active area and the transistor portion of the active area is disclosed. In one embodiment, the present invention substitutes an insulator for at least a portion of the gate layer in the regions between the transistor and the body contact. In another embodiment, a portion of the gate layer is removed and replaced with an insulative layer in regions between the transistor and the body contact. In still another embodiment, the insulative structure is formed by forming multiple layers of gate dielectric between the gate and the body in regions between the transistor and the body contact. The body contact produced by these methods adds no significant gate capacitance to the gate.
摘要:
A body contact structure utilizing an insulating structure between the body contact portion of the active area and the transistor portion of the active area is disclosed. In one embodiment, the present invention substitutes an insulator for at least a portion of the gate layer in the regions between the transistor and the body contact. In another embodiment, a portion of the gate layer is removed and replaced with an insulative layer in regions between the transistor and the body contact. In still another embodiment, the insulative structure is formed by forming multiple layers of gate dielectric between the gate and the body in regions between the transistor and the body contact. The body contact produced by these methods adds no significant gate capacitance to the gate.
摘要:
A simple process is provided for making a planar CMOS structure wherein isolation regions required by bulk CMOS structures are first formed, an N channel device field region is self-aligned to an N well region in a semiconductor substrate and a refractory material is twice defined for forming P and N channels, the first definition masking P channel source and drain regions while defining the N channel and the second definition defining the P channel while using a photoresist layer to mask the N channel. In the process, a technique which uses a single mask level defines the well region and self-aligns the necessary field doping to the well region to provide closely spaced N and P channel devices.
摘要:
This teaches that by measuring the rate of change in gate current of an insulating gate field effect transistor, under normal operating conditions, the time required to achieve a predetermined change in source-to-drain current in the transistor can be found. Because changes in gate current depends more on sensitivity on charge trapping in the oxide than do changes in channel current, and since the gate current occurs only in the small region of electron emission, the effects on gate current are more quickly developed than the secondary effect of reduced channel current due to the charge in gate oxide caused by the presence of trapped electrons.
摘要:
A very simple process is provided, with reduced processing time, for making a CMOS structure using a single polysilicon, or other refractory metal, layer which includes forming a thin gate oxide on both N and P type semiconductor layers of a common substrate, forming a gate electrode simultaneously on the N type and on the P type layers and selectively implanting an N type impurity to form N+ source and drain regions in the P type layer. The semiconductor layers are then oxidized to form substantially thicker oxide, such a silicon dioxide, adjacent to the sides of the gate electrode over the P type layer than the thickness of the oxide adjacent to the sides of the gate electrode over the N type layer. Without using a mask, a P type impurity is implanted into the N type layer to form P+ source and drain regions.