摘要:
The internal power-supply potential generating circuit includes a reference potential generating circuit having small dependency on an external power-supply potential and on a temperature, an MOS transistor for pull up, a level shifter producing a potential lower than a reference potential by a prescribed voltage to a first node and producing a potential lower than an internal power-supply potential by a voltage of the sum of the prescribed potential and an offset potential to a second node, and a differential amplifier bringing an MOS transistor out of conduction in response to the potential of the second node reaching the potential of the first node. Thus, the reference potential may be set lower by the offset voltage, allowing stable reference potential and internal power-supply potential to be obtained even if the external power-supply potential is lowered.
摘要:
A semiconductor memory device includes four memory cell arrays, four output pads formed in a linear manner at the center of a semiconductor substrate, four output control circuits for generating readout data signals and control signals, four signal generation circuits responsive to the readout data signals for generating complementary pairs of data signals, and responsive to the control signals, four signal line groups including four signal lines connected between the output control circuits and the signal generation circuits, four output drivers responsive to pairs of data signals for supplying data to the output pads, and four signal line pairs connected between the signal generation circuits and output drivers. Signal generation circuits of great size are arranged at the center of the semiconductor substrate where the layout margin is great, and only the output driver is arranged in the proximity of the output pad where the layout margin is small. Therefore, the chip area is reduced. Access is speeded since the signal lines forming the signal line group are shorter in length, though greater in number, than the signal lines forming the signal line pair.
摘要:
When an external RAS and external CAS are input to a RAS buffer and a CAS buffer, an internal RAS and an internal CAS are generated. The internal RAS is input to a clock generating circuit and a CBR mode determination circuit and the internal CAS is input to the CBR mode determination circuit. The clock generating circuit outputs a pump clock to first and second WL pumps upon input of internal RAS, and the first WL pump supplies charge to a Vpp power supply. If CAS is input prior to RAS during refresh operation, CBR mode determination circuit inputs a CBR mode signal to the second WL pump which supplies charge to Vpp power supply together with the first WL pump when the pump clock and the CBR mode signal is input thereto.
摘要翻译:当外部+ E,ovs RAS + EE和外部+ E,ovs CAS + EE输入到RAS缓冲区,CAS缓冲区,内部+ E,ovs RAS + EE和内部+ E,ovs CAS + EE 生成。 内部+ E,ovs RAS + EE输入到时钟发生电路和CBR模式确定电路,内部+ E,ovs CAS + EE输入到CBR模式确定电路。 时钟发生电路在内部+ E,RAS + EE输入时向第一和第二WL泵输出泵时钟,第一WL泵为Vpp电源供电。 如果+ E,则在+ E之前输入ovs CAS + EE,在刷新操作期间输入ovs RAS + EE,CBR模式确定电路将CBR模式信号输入到与第一WL泵一起向Vpp电源提供电荷的第二WL泵 当泵时钟和CBR模式信号被输入时。
摘要:
A semiconductor memory device of the present invention is provided with a plurality of memory cell arrays distributed and thus arranged and having the same function, and a main control circuit and local control circuits that are structured hierarchically. Each memory cell array has its operation controlled directly by any of the local control circuits, wherein the main control circuit including a command producing circuit which responds to an externally applied signal to produce a control signal corresponding to a predetermined mode of operation, and a global control circuit which responds to a control command to generate a control signal for operating the entire semiconductor memory device consistently. The local control circuits receive the control signal from the global control circuit to cause memory cell arrays to perform a predetermined operation.
摘要:
When an external RAS and external CAS are input to a RAS buffer and a CAS buffer, an internal RAS and an internal CAS are generated. The internal RAS is input to a clock generating circuit and a CBR mode determination circuit and the internal CAS is input to the CBR mode determination circuit. The clock generating circuit outputs a pump clock to first and second WL pumps upon input of internal RAS, and the first WL pump supplies charge to a Vpp power supply. If CAS is input prior to RAS during refresh operation, CBR mode determination circuit inputs a CBR mode signal to the second WL pump which supplies charge to Vpp power supply together with the first WL pump when the pump clock and the CBR mode signal is input thereto.
摘要翻译:当外部+ E,ovs RAS + EE和外部+ E,ovs CAS + EE输入到RAS缓冲区,CAS缓冲区,内部+ E,ovs RAS + EE和内部+ E,ovs CAS + EE 生成。 内部+ E,ovs RAS + EE输入到时钟发生电路和CBR模式确定电路,内部+ E,ovs CAS + EE输入到CBR模式确定电路。 时钟发生电路在内部+ E,RAS + EE输入时向第一和第二WL泵输出泵时钟,第一WL泵为Vpp电源供电。 如果+ E,则在+ E之前输入ovs CAS + EE,在刷新操作期间输入ovs RAS + EE,CBR模式确定电路将CBR模式信号输入到与第一WL泵一起向Vpp电源提供电荷的第二WL泵 当泵时钟和CBR模式信号被输入时。
摘要:
When an inputted column address CA and a defect address are compared with each other, an preset defect address and a defect conversion address obtained by inverse conversion of the defect address are both inputted to a comparison circuit. In the comparison circuit, coincidence determination operations are performed being switched between when address conversion is applied to the column address CA and when no address conversion is applied thereto, thereby coincidence comparison can be effected without using the column address CA after an address conversion operation; therefore, a delay in a determination operation accompanying a conversion operation is canceled to perform high speed data reading.
摘要:
A clock generation circuit includes a clock input circuit receiving complementary external clocks to generate an internal clock, a variable delay circuit delaying the internal clock to generate an internal operation clock, a replica circuit further delaying the internal operation clock by a predetermined time to generate a return clock, a phase comparator directly comparing the phase where potential levels of external clocks cross with the phase of the return clock, and a delay control circuit adjusting the delay amount of the variable delay circuit according to a phase comparison result of the phase comparator.
摘要:
The semiconductor memory device has a formal mode and a test mode as operating modes. The program circuit includes a fuse element in which an address using a spare memory cell instead of a defective memory cell is programmed. The program circuit confirms a disconnection state of a fuse in a condition severer in the test mode than that in the normal mode. An anomaly is notified to outside by a detection circuit in a case where results are different between the test mode and the normal mode. In a case where a fuse is not completely blown, such a fuse can also be detected in the test mode to exclude a defective chip.
摘要:
A control circuit & mode register outputs a signal responsive to each command to a VDC control circuit. The VDC control circuit outputs a signal PWRUP changing the quantity of a through current Ic of a comparator stored in a VDC in response to the command. The VDC control circuit internally generates a signal of which pulse width corresponds to a prescribed delay time, in response to input of the command. Therefore, activation of each bank may not be monitored but current consumption can be reduced by preferably controlling a power supply current while minimizing the number of delay circuits and wires.
摘要:
I/O lines in an I/O gate-sense amplifier portion are arranged in the order of IOA, /IOB, IOB, and /IOA. As a result, the potentials of adjacent I/O lines are necessarily different at the time of writing/reading the same data to/from a plurality of memory cells during a multi-bit test. Therefore, a short-circuit fault caused between adjacent I/O lines can be detected at the same time.