摘要:
I/O lines in an I/O gate-sense amplifier portion are arranged in the order of IOA, /IOB, IOB, and /IOA. As a result, the potentials of adjacent I/O lines are necessarily different at the time of writing/reading the same data to/from a plurality of memory cells during a multi-bit test. Therefore, a short-circuit fault caused between adjacent I/O lines can be detected at the same time.
摘要:
A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.
摘要:
In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.
摘要:
A semiconductor device according to the present invention includes on the main surface of a p substrate a storing circuit region and peripheral circuit regions. An n well surrounds a p well including the storing circuit region and a p well including the peripheral circuit regions. As a result, a capacitance element is formed in the semiconductor substrate. It is possible to miniaturize the semiconductor device, and to improve reliability of connection between elements.
摘要:
In a set of memory cells selected by one column select line, a memory cell of at least 1 bit is connected to an internal data line that is different from the internal data line to which another memory cell in the same set is connected. An internal data line pair is connected to a data terminal. Thus, data having different logic levels can be written into adjacent memory cells even in an IO compression test mode.
摘要:
The semiconductor circuit device includes a first column decoder for decoding an internal column address and generating a column select signal which selects one column, and a second column decoder for simultaneously selecting a plurality of successively adjacent columns from a memory cell array in accordance with the column select signal. The second column decoder selects the same column in a duplicated way in response to different column select signals. Since the same column is selected in a duplicate way by the different column select signals, it will be possible to simultaneously select a desired combination of a plurality of columns. A combination of a plurality of columns simultaneously selected can be arbitrarily set and a desired combination of columns can be selected with a simplified circuit structure at high speed. It will be possible to repair a column containing a defective bit without providing a redundant column by providing an input/output control circuit for further selecting a column from the columns simultaneously selected in accordance with the column select signal.
摘要:
Disclosed is a semiconductor memory device including a normal memory array and preliminary memory array enabling a mutual data transfer. Word lines in the normal memory array and those in the preliminary memory array are controlled by separate row decoders and separate word drivers. Bit lines and sense amplifiers are provided commonly to the normal memory array and the preliminary memory array. When test data is written in a predetermined pattern into the normal memory array, data corresponding to the predetermined pattern is written in advance for each memory cell in the preliminary memory array. Then, after the row decoder and word driver for the preliminary memory array are enabled so that the word lines in the preliminary memory array are activated, the row decoder and word driver for the normal memory array are enabled so that the word lines in the preliminary memory array are activated. Thus, data signals read from memory cells of one row in the normal memory array are simultaneously amplified by the sense amplifiers via the bit lines and then transferred via the bit lines to memory cells of one row in the preliminary memory array. In this result, the test data are written at one time into the memory cells of one row in the normal memory array.
摘要:
A semiconductor device having amplifying circuits provided near corresponding bonding pads receiving external signals, and positioned between the bonding pads and internal circuits to which such external signals are to be applied. The device includes a control signal generating circuit for the amplifying circuits which is not provided in conventional semiconductor devices. In response to external control signals, the control signal generating circuit generates internal control signals for controlling electric paths between a power supply and ground in the amplifying circuits. During the standby period of the semiconductor device, the paths between the power supply and ground are cut regardless of the potential of the corresponding bonding pads, preventing flow of a through current.
摘要:
A dynamic RAM provided on a semiconductor substrate comprises: a memory cell including a capacitor for storing electric charges as information, the capacitor having a storage gate electrode to which a potential other than a ground potential is applied during normal operation of the dynamic RAM; a peripheral circuit including a CMOS circuit; and grounding means for applying the ground potential to the storage gate electrode only in a predetermined period immediately after a start of application of a power supply voltage to the dynamic RAM.
摘要:
A dummy pattern that is inserted to stabilize the form of a transistor active region is implanted with an impurity of the same conductivity type as a well, and the impurity-doped region of the dummy pattern is supplied with a potential through a metal interconnection. Hence, fluctuation of a well potential due to noise hardly occurs, and a semiconductor device enduring latch up, for example, to a greater extent can be provided.