公开(公告)号：US20120252914A1

公开(公告)日：2012-10-04

申请号：US13515962

申请日：2010-12-13

申请人： Klaus Hahn ,  Olaf Kriha ,  Ingo Bellin ,  Frank Braun ,  Patrick Spies ,  Jan Kurt Walter Sandler ,  Geert Janssens ,  Jürgen Fischer ,  Christoph Fleckenstein ,  Hartmut Denecke ,  Sabine Fuchs ,  Peter Merkel ,  Manfred Pawlowski ,  Holger Ruckdäschel ,  Klemens Massonne

发明人： Klaus Hahn ,  Olaf Kriha ,  Ingo Bellin ,  Frank Braun ,  Patrick Spies ,  Jan Kurt Walter Sandler ,  Geert Janssens ,  Jürgen Fischer ,  Christoph Fleckenstein ,  Hartmut Denecke ,  Sabine Fuchs ,  Peter Merkel ,  Manfred Pawlowski ,  Holger Ruckdäschel ,  Klemens Massonne

IPC分类号： C08L25/18 ,  C08K3/04 ,  C08J9/14 ,  B29B9/02 ,  C08J9/228

CPC分类号： C08J9/18 ,  C08J9/0019 ,  C08J9/0061 ,  C08J9/20 ,  C08J2325/04 ,  C08J2425/00 ,  C08J2453/00 ,  C08J2463/00 ,  C08K5/136 ,  C08L25/04 ,  C08L2205/02 ,  C08L25/18 ,  C08L53/025

摘要： Flame-retardant polymer foams which comprise, as flame retardant, at least one halogenated polymer, for example brominated polystyrene or styrene-butadiene block copolymer having bromine content in the range from 40 to 80% by weight, or tetrabromobisphenol A compounds (TBBPA), processes for producing these, and also flame-retardant expandable styrene polymers.

摘要翻译： 包含作为阻燃剂的至少一种卤化聚合物的阻燃聚合物泡沫，例如溴含量在40至80重量％的溴化聚苯乙烯或苯乙烯 - 丁二烯嵌段共聚物，或四溴双酚A化合物（TBBPA）， 制造这些的方法，以及阻燃的可发性苯乙烯聚合物。

公开(公告)号：US09856546B2

公开(公告)日：2018-01-02

申请号：US12441938

申请日：2007-09-21

申请人： Jürgen Fischer ,  Aloys Eiling ,  Frank Schrumpf ,  Stefan Zimmermann ,  Peter Thienel ,  Roland Scholl

发明人： Jürgen Fischer ,  Aloys Eiling ,  Frank Schrumpf ,  Stefan Zimmermann ,  Peter Thienel ,  Roland Scholl

IPC分类号： B23B9/00 ,  C22C29/02 ,  C23C4/06

CPC分类号： C22C29/02 ,  B22F2998/00 ,  C22C2204/00 ,  C23C4/06 ,  C22C1/1084

摘要： The invention provides for a cermet powder containing 75-90% by weight of at least one hard material powder, from 10 to 25% by weight of one or more matrix metal powders and up to 3% by weight of at least one modifier, wherein the matrix metal powder or powders contain from 0 to 38% by weight of cobalt, from 0 to 38% by weight of nickel, from 0 to 20% by weight of aluminum, from 0 to 90% by weight of iron and from 10 to 35% by weight of chromium and the sum of the contents of iron and chromium is in the range from 10 to 95% by weight and the sum of the contents of cobalt, nickel and iron is in the range from 65 to 95% by weight. The invention also relates to a cermet and a process to make the cermet containing the cermet powder and shaped article coated with the cermet powder and a process to make the shaped article.

公开(公告)号：US06719205B1

公开(公告)日：2004-04-13

申请号：US09333322

申请日：1999-06-15

申请人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

发明人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

IPC分类号： G06K1906

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

摘要翻译： 用于半导体芯片的载体元件，特别是用于并入智能卡。 载体元件具有保护半导体芯片的封装组合物。 载体元件连接仅沿两个相对的边缘设置在封装组合物的一个主表面上。 它们由导电材料制成，并且在彼此面对的端部处具有减小的厚度，该截面仅在一侧具有台阶。 半导体芯片设置在厚度较小部分的区域中的连接处并机械连接到连接。

公开(公告)号：US09232817B2

公开(公告)日：2016-01-12

申请号：US12648067

申请日：2009-12-28

申请人： Rainer Perren ,  Jürgen Fischer

发明人： Rainer Perren ,  Jürgen Fischer

IPC分类号： A23L1/00 ,  A23L3/16 ,  A23B9/02 ,  A23L3/015

CPC分类号： A23L3/165 ,  A23B9/025 ,  A23L3/0155

摘要： A process for surface pasteurization/sterilization of particulate food products. Water uptake and qualitative changes of food products are minimized and pasteurization or sterilization conditions are optimized when food products are used preheated, wherein product temperature is selected a few degrees below the evaporation temperature of the pasteurization/sterilization system, in that the preheating temperature of food products is selected lower than the saturated steam temperature, preferably a few degrees below the saturated steam temperature at a predetermined pressure, in that treatment is performed in a moist, air-free atmosphere, wherein pasteurization occurs at temperatures between 55 and 99° C. at a low pasteurization pressure, or sterilization occurs at temperatures between 100° C. and 140° C. at a higher sterilization pressure, in that heat treatment occurs for 1 to 30 mins, and in that the water of condensation is removed from the surface of food products by a subsequent vacuum drying at a further reduced pressure.

摘要翻译： 颗粒状食品的表面巴氏消毒/灭菌方法。 食品的吸收和质量变化最小化，当食品被预热使用时，巴氏消毒或灭菌条件得到最佳化，其中产品温度选择在巴氏消毒/灭菌系统的蒸发温度以下几度，食品预热温度 选择低于饱和蒸汽温度的产物，优选在预定压力下比饱和蒸汽温度低几度，因为处理在潮湿的无空气气氛中进行，其中巴氏杀菌在55至99℃的温度下进行。 在低巴氏杀菌压力下，或者在更高的灭菌压力下在100℃至140℃的温度下进行灭菌，因为热处理发生1至30分钟，并且冷凝水从表面除去 的食品通过随后的真空干燥进一步减压。

公开(公告)号：US20090223875A1

公开(公告)日：2009-09-10

申请号：US11916802

申请日：2006-06-27

申请人： Wolfgang Asal ,  Jürgen Fischer

发明人： Wolfgang Asal ,  Jürgen Fischer

IPC分类号： B04C5/13 ,  B04C9/00

CPC分类号： B04C5/13 ,  B04C9/00

摘要： In an extraction device comprising a suction apparatus (16) with an electric motor (32) and an centrifugal separator (14) exhibiting an inlet cylinder (22), a vertically arranged dip pipe (30) and a lateral suction nozzle (24) through which a laden gas stream enters the inlet cylinder (22), it is provided with a view to creating a low-cost and easy-to-handle extraction device of a compact design, having a centrifugal separator, that the electric motor (32) is arranged inside the dip pipe (30).

摘要翻译： 在包括具有电动机（32）的抽吸装置（16）和呈现进气筒（22）的离心分离器（14）的抽取装置中，垂直设置的浸入管（30）和横向吸入喷嘴（24）通过 其中负载气流进入进气筒（22），其设置有产生具有离心分离器的紧凑型设计的低成本且易于处理的提取装置，电动机（32） 布置在浸入管（30）的内​​部。

公开(公告)号：US06557769B2

公开(公告)日：2003-05-06

申请号：US10083039

申请日：2002-02-26

申请人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

发明人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

IPC分类号： G06K1906

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

摘要： Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

公开(公告)号：US20120013263A1

公开(公告)日：2012-01-19

申请号：US13159382

申请日：2011-06-13

申请人： Jürgen Fischer ,  Walter Limmer ,  Maximilian Schmidl ,  Hannes Wagner

发明人： Jürgen Fischer ,  Walter Limmer ,  Maximilian Schmidl ,  Hannes Wagner

IPC分类号： H05B41/36

CPC分类号： H05B41/2886 ,  Y02B20/202

摘要： An electronic operating device for a gas discharge lamp having a voltage transformer which converts an input voltage into an intermediate circuit voltage, and an inverter with a lamp inductor and a bridge circuit with at least two switches which converts the intermediate circuit voltage into a lamp voltage, the operating device being designed to adjust the intermediate circuit voltage present between the DC voltage transformer and the inverter to a predetermined value which is dependent on the lamp state. Also disclosed is a method for operating an operating device.

摘要翻译： 一种用于气体放电灯的电子操作装置，其具有将输入电压转换为中间电路电压的电压互感器，以及具有灯电感器的逆变器和具有至少两个开关的逆变器，所述开关将中间电路电压转换为灯电压 该操作装置被设计成将直流变压器和逆变器之间存在的中间电路电压调整到取决于灯状态的预定值。 还公开了一种操作操作装置的方法。

公开(公告)号：US06588223B2

公开(公告)日：2003-07-08

申请号：US10217784

申请日：2002-08-13

申请人： Bernd Dienhart ,  Hans-Joachim Krauss ,  Hagen Mittelstrass ,  Karl-Heinz Staffa ,  Christoph Walter ,  Jürgen Fischer ,  Michael Katzenberger ,  Karl Lochmahr

发明人： Bernd Dienhart ,  Hans-Joachim Krauss ,  Hagen Mittelstrass ,  Karl-Heinz Staffa ,  Christoph Walter ,  Jürgen Fischer ,  Michael Katzenberger ,  Karl Lochmahr

IPC分类号： F25B100

CPC分类号： B60H1/3205 ,  B60H1/3208 ,  B60H1/3211 ,  B60H2001/325 ,  B60H2001/3261 ,  B60H2001/327 ,  B60H2001/3272 ,  B60H2001/3275 ,  B60H2001/3291 ,  F25B9/008 ,  F25B40/00 ,  F25B2309/061 ,  F25B2341/0661 ,  F25B2600/02 ,  F25B2600/17 ,  F25B2700/1933 ,  F25B2700/21173

摘要： An optimized CO2 air-conditioning system for a vehicle has individual components designed and/or matched to one another in such a way that if the high pressures in the high-pressure section deviate by up to ±30% from the optimum high pressures, the associated optimum performance figures are reduced by no more than 20%. The individual components include a controllable compressor, a gas cooler, an internal heat exchanger, an evaporator and an accumulator. As a result, a fixed throttle expansion member can be used between the high-pressure and low-pressure sections of the system.

公开(公告)号：US06472250B1

公开(公告)日：2002-10-29

申请号：US09494776

申请日：2000-01-31

申请人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

发明人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

IPC分类号： H01L2144

CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2924/18301 ,  H01L2924/00014

摘要： A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

摘要翻译： 一种芯片模块的制造方法包括冲压芯片载体以形成芯片载体固定部分和芯片载体接触部分，该芯片载体接触部分通过限定给定距离的狭缝与芯片载体固定部分间隔开。 给定距离随后被减小到通过至少在靠近槽的区域中进行的模锻操作来防止密封块流过的尺寸。

公开(公告)号：US09179704B2

公开(公告)日：2015-11-10

申请号：US12648023

申请日：2009-12-28

申请人： Rainer Perren ,  Jürgen Fischer

发明人： Rainer Perren ,  Jürgen Fischer

IPC分类号： A23L3/16 ,  A23N12/08 ,  A23B9/02 ,  A23L1/01 ,  A23L1/36

CPC分类号： A23N12/08 ,  A23B9/02 ,  A23L3/16 ,  A23L5/13 ,  A23L5/15 ,  A23L25/25

摘要： The disclosure relates to a process for roasting and surface pasteurization of particulate food products. The roasting and surface pasteurization can be combined and united to form one process wherein a treatment is carried out in a moist atmosphere at temperatures

摘要翻译： 本公开内容涉及颗粒状食品的焙烧和表面巴氏灭菌的方法。 焙烧和表面巴氏灭菌可以组合并结合在一起，其中在温度<100℃的潮湿环境中进行处理，在焙烧操作期间在焙烧系统中进行巴氏杀菌处理， 巴氏灭菌阶段将产品表面的温度保持在建立的大气的露点温度以下几度，巴氏消毒进行1-30分钟，并且通过进行或继续焙烧冷凝水 食品的表面被去除并且其吸收水被最小化。