公开(公告)号：US20110262029A1

公开(公告)日：2011-10-27

申请号：US13064801

申请日：2011-04-15

申请人： Klaus-Peter Galuschki ,  Yi Hua Gong ,  Yu Hu ,  Ming Shen

发明人： Klaus-Peter Galuschki ,  Yi Hua Gong ,  Yu Hu ,  Ming Shen

IPC分类号： G06K9/00 ,  G01N33/00

CPC分类号： G01N21/95684

摘要： A system and a method detect solder paste printing. The system includes a detecting device for detecting solder paste when a scraping blade pushes the solder paste to spread over a template to obtain information associated with the rolling speed of the solder paste, and a state-indicating device for generating a printing-state indication based on the information associated with the rolling speed of the solder paste. The method includes detecting the solder paste during rolling to obtain the information associated with the rolling speed of the solder paste, and generating a printing-state indication based on said information associated with the rolling speed of the solder paste. By detecting the solder paste during rolling to obtain the printing state, it is possible to monitor the printing state in real time, discover an abnormal condition in time, and reduce costs to the maximum extent.

摘要翻译： 一种系统和方法检测锡膏印刷。 该系统包括：检测装置，用于当刮刀将焊膏推到模板上时检测焊膏，以获得与焊膏的轧制速度相关的信息，以及用于产生印刷状态指示的状态指示装置 关于与焊膏的轧制速度相关的信息。 该方法包括在轧制期间检测焊膏以获得与焊膏的轧制速度相关的信息，并且基于与焊膏的轧制速度相关联的所述信息产生印刷状态指示。 通过在轧制期间检测焊膏以获得打印状态，可以实时监控打印状态，及时发现异常状况，并最大程度地降低成本。

公开(公告)号：US20050028362A1

公开(公告)日：2005-02-10

申请号：US10937418

申请日：2004-09-09

申请人： Hans-Jurgen Hacke ,  Klaus-Peter Galuschki

发明人： Hans-Jurgen Hacke ,  Klaus-Peter Galuschki

IPC分类号： H01L23/485 ,  H05K3/32 ,  H05K3/34 ,  H05K3/00 ,  H01L27/10

CPC分类号： H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

摘要： A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

公开(公告)号：US06653743B2

公开(公告)日：2003-11-25

申请号：US10219515

申请日：2002-08-15

申请人： Klaus-Peter Galuschki ,  Heinz Pilz

发明人： Klaus-Peter Galuschki ,  Heinz Pilz

IPC分类号： H01L2328

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/18301 ,  H05K3/305 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

摘要： A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.

摘要翻译： 一种用流体填充物填充安装在平坦基板上的电子部件的方法，其中以紧密配合方式施加到安装在基板上的电子部件的流体填料。 然后将由基板和电子部件组成的布置加热。 在施加填料之前，基板在电子部件的区域中设置有至少一个通孔。 填充物被施加在贯穿孔的端部处，远离电子部件。

公开(公告)号：US06445074B1

公开(公告)日：2002-09-03

申请号：US09516605

申请日：2000-04-03

申请人： Klaus-Peter Galuschki ,  Heinz Pilz

发明人： Klaus-Peter Galuschki ,  Heinz Pilz

IPC分类号： H01L2328

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/18301 ,  H05K3/305 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

摘要： A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted n the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.

摘要翻译： 一种用流体填充物填充安装在平坦基板上的电子部件的方法，其中以紧密配合的方式施加到安装在基板上的电子部件的流体填料。 然后将由基板和电子部件组成的布置加热。 在施加填料之前，基板在电子部件的区域中设置有至少一个通孔。 填充物被施加在贯穿孔的端部处，远离电子部件。

公开(公告)号：US06973717B2

公开(公告)日：2005-12-13

申请号：US10937418

申请日：2004-09-09

申请人： Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

发明人： Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

IPC分类号： H01L23/485 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

摘要： A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

摘要翻译： 描述了具有芯片的半导体器件，其芯片具有至少一个第一绝缘层和不含绝缘层的电连接焊盘。 在第一绝缘层上，互连从电连接焊盘延伸到外部连接元件的基极区域。 进一步施加的绝缘层设置有从外部连接到外部连接元件的基部区域的开口。 在开口中有导电粘合剂，至少在外部放置金属的小球。 半导体元件还可以在开口中包含焊膏代替导电粘合剂，并且将金属化的小塑料球放置在焊膏上。 本发明还涉及所述半导体器件的制造方法。

公开(公告)号：US6057178A

公开(公告)日：2000-05-02

申请号：US160889

申请日：1998-09-25

申请人： Klaus-Peter Galuschki ,  Heinz Pilz

发明人： Klaus-Peter Galuschki ,  Heinz Pilz

IPC分类号： H01L21/56 ,  H05K3/30 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/28 ,  H05K3/305 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/18301 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613

摘要： A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.

摘要翻译： 一种用流体填充物填充安装在平坦基板上的电子部件的方法，其中以紧密配合方式施加到安装在基板上的电子部件的流体填料。 然后将由基板和电子部件组成的布置加热。 在施加填料之前，基板在电子部件的区域中设置有至少一个通孔。 填充物被施加在贯穿孔的端部处，远离电子部件。

公开(公告)号：US06818090B2

公开(公告)日：2004-11-16

申请号：US09761594

申请日：2001-01-16

申请人： Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

发明人： Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

IPC分类号： H01L23538

CPC分类号： H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

摘要： A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

摘要翻译： 描述了具有芯片的半导体器件，其芯片具有至少一个第一绝缘层和不含绝缘层的电连接焊盘。 在第一绝缘层上，互连从电连接焊盘延伸到外部连接元件的基极区域。 进一步施加的绝缘层设置有从外部连接到外部连接元件的基部区域的开口。 在开口中有导电粘合剂，至少在外部放置金属的小球。 半导体元件还可以在开口中包含焊膏代替导电粘合剂，并且将金属化的小塑料球放置在焊膏上。 本发明还涉及所述半导体器件的制造方法。