公开(公告)号：US09060432B2

公开(公告)日：2015-06-16

申请号：US13001946

申请日：2009-06-25

Applicant: Koichi Hattori ,  Keiichi Kimura ,  Naoya Kuwasaki

Inventor： Koichi Hattori ,  Keiichi Kimura ,  Naoya Kuwasaki

IPC: H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  C22F1/08 ,  B21B1/40 ,  B21B3/00 ,  H05K1/03

CPC classification number: H05K1/028 ,  B21B1/40 ,  B21B2003/005 ,  C22F1/08 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2203/0143 ,  Y10T29/49155

Abstract: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes in a surface of the metal foil.

Abstract translation: 提供一种柔性电路板，其具有优异的弯曲性和对硬条件的耐久性，特别是在具有小曲率半径的重复弯曲部分中及其制造方法。 柔性电路板包括树脂层和由金属箔形成的布线，并且与设置有布线的至少一个位置的弯曲部一起使用。 金属箔由具有立方晶体结构的金属制成，并且从弯曲部的棱线在厚度方向上切断的布线的截面在（20l）的范围内的任一平面上形成主取向 （100）〜（110）的旋转方向为（1×20），将[001]设定为区域轴。 布线形成为金属箔由具有立方晶体结构的金属制成，并且弯曲部分中的脊线相对于基本晶轴<100之一具有2.9°至87.1°的范围内的角度 >在金属箔的表面。

公开(公告)号：US20110189501A1

公开(公告)日：2011-08-04

申请号：US13055375

申请日：2009-07-22

Applicant: Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

Inventor： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC: B32B15/08 ,  B32B15/088

CPC classification number: H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible cupper clad laminate.

Abstract translation: 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性的覆铜层压板。

公开(公告)号：US08557392B2

公开(公告)日：2013-10-15

申请号：US13055375

申请日：2009-07-22

Applicant: Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

Inventor： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC: B32B15/08 ,  H05K1/09

CPC classification number: H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.

Abstract translation: 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性覆铜层压板。

公开(公告)号：US20110315212A1

公开(公告)日：2011-12-29

申请号：US13148767

申请日：2010-03-04

Applicant: Shuzi Hayase ,  Naoya Kuwasaki ,  Mitsuru Kohno ,  Yoshihiro Yamaguchi

Inventor： Shuzi Hayase ,  Naoya Kuwasaki ,  Mitsuru Kohno ,  Yoshihiro Yamaguchi

IPC: H01L31/0216 ,  H01L31/18 ,  H01L31/0224

CPC classification number: H01G9/2031 ,  H01G9/2022 ,  H01G9/2059 ,  Y02E10/542 ,  Y02P70/521

Abstract: There are provided a dye-sensitized solar cell easy to manufacture, high in power extraction efficiency, and suitable for upsizing, and a method for manufacturing the dye-sensitized solar cell. The dye-sensitized solar cell 10 comprises a transparent substrate 12; a porous semiconductor layer 14 having a dye adsorbed thereto; a conductive metal film 16; and a substrate 20 provided with a conductive film 18 and arranged opposite to the transparent substrate 12. A large number of deep poriform through-holes 24 are irregularly formed in the conductive metal film 16. The dye-sensitized solar cell 10 includes a large number of porous semiconductor particles 25 one end of which is exposed to an electrolyte 22 through the conductive metal film 16 and the other end of which joins the porous semiconductor layer 14.

Abstract translation: 提供易于制造的染料敏化太阳能电池，功率提取效率高，适用于大型化，以及染料敏化太阳能电池的制造方法。 染料敏化太阳能电池10包括透明基板12; 具有吸附染料的多孔半导体层14; 导电金属膜16; 以及设置有与透明基板12相对配置的导电膜18的基板20.在导电性金属膜16中不规则地形成有大量深孔状的通孔24.染料敏化太阳能电池10包括大量 多孔半导体颗粒25的一端通过导电金属膜16暴露于电解质22，另一端连接多孔半导体层14。