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公开(公告)号：US08016184B2
公开(公告)日：2011-09-13
申请号：US12887542
申请日：2010-09-22
申请人： Koichi Kanryo , Akio Katsube , Akira Tanaka
发明人： Koichi Kanryo , Akio Katsube , Akira Tanaka
CPC分类号： H05K1/0218 , H01L23/552 , H01L24/97 , H01L25/165 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/15159 , H01L2924/19105 , H05K3/0052 , H05K3/284 , H05K2201/098 , H05K2203/1316 , H01L2224/81
摘要： A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut.
摘要翻译： 执行电子部件模块的制造方法，使得可以形成屏蔽层作为薄膜，并且可以有效地屏蔽电子部件。 包括多个电子部件的多个电子部件模块的集合基板用树脂进行间歇式密封。 切割部从密封树脂的顶表面形成到在电子部件模块的边界部分到达布置在基板中的接地电极的位置，以露出接地电极。 在侧表面和顶表面上施加导电膏。 然后，通过旋涂形成导电性薄膜，切断电子部件模块。
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公开(公告)号：US08982537B2
公开(公告)日：2015-03-17
申请号：US13597810
申请日：2012-08-29
申请人： Hiroki Kitayama , Akio Katsube
发明人： Hiroki Kitayama , Akio Katsube
CPC分类号： H01G9/012 , H01G9/14 , H01G9/15 , Y10T29/435
摘要： In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc−Ta|/Tc×100≦10[%].
摘要翻译： 在固体电解电容器中，进行电阻焊接以将阀金属基板和间隔件粘合在一起，同时控制焊接电流，使得只有设置在间隔件中并具有较低熔点的接合材料熔化。 设置在间隔件中的接合材料的至少一部分穿过阀金属基板的蚀刻部分，并且位于阀金属基板的正电极部分的芯部的厚度Ta和位于阀芯金属基板的芯部的厚度Tc 负极部分满足| Tc-Ta | / Tc×100＆nlE; 10 [％]的要求。
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公开(公告)号：US20130100586A1
公开(公告)日：2013-04-25
申请号：US13597810
申请日：2012-08-29
申请人： Hiroki Kitayama , Akio Katsube
发明人： Hiroki Kitayama , Akio Katsube
CPC分类号： H01G9/012 , H01G9/14 , H01G9/15 , Y10T29/435
摘要： In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc−Ta|/Tc×100≦10 [%].
摘要翻译： 在固体电解电容器中，进行电阻焊接以将阀金属基板和间隔件粘合在一起，同时控制焊接电流，使得只有设置在间隔件中并具有较低熔点的接合材料熔化。 设置在间隔件中的接合材料的至少一部分穿过阀金属基板的蚀刻部分，并且位于阀金属基板的正电极部分的芯部的厚度Ta和位于阀芯金属基板的芯部的厚度Tc 负极部分满足| Tc-Ta | / Tc×100 @ 10 [％]的要求。
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公开(公告)号：US20100018041A1
公开(公告)日：2010-01-28
申请号：US12574537
申请日：2009-10-06
申请人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
发明人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
IPC分类号： B23P19/04
CPC分类号： H01L24/83 , H01L23/142 , H01L23/3735 , H01L24/29 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/451 , H01L2224/48091 , H01L2224/73265 , H01L2224/78301 , H01L2224/8319 , H01L2224/838 , H01L2224/85181 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , Y10T29/4913 , Y10T29/49998 , Y10T29/53265 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。
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公开(公告)号：US07624492B1
公开(公告)日：2009-12-01
申请号：US09689774
申请日：2000-10-13
申请人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
发明人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
CPC分类号： H01L24/83 , H01L23/142 , H01L23/3735 , H01L24/29 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/451 , H01L2224/48091 , H01L2224/73265 , H01L2224/78301 , H01L2224/8319 , H01L2224/838 , H01L2224/85181 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , Y10T29/4913 , Y10T29/49998 , Y10T29/53265 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。
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公开(公告)号：US08726494B2
公开(公告)日：2014-05-20
申请号：US12574537
申请日：2009-10-06
申请人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
发明人： Akio Katsube , Hideo Nakagoshi , Hidemasa Kawai
IPC分类号： B23P19/00
CPC分类号： H01L24/83 , H01L23/142 , H01L23/3735 , H01L24/29 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/451 , H01L2224/48091 , H01L2224/73265 , H01L2224/78301 , H01L2224/8319 , H01L2224/838 , H01L2224/85181 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , Y10T29/4913 , Y10T29/49998 , Y10T29/53265 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。
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