摘要:
Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure.
摘要:
Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure.
摘要:
This positive photoresist composition is a positive photoresist composition for exposing to light having one or more wavelengths selected from g-rays, h-rays and i-rays, comprising: (A) a compound which generates an acid under irradiation with active rays or radiation, and (B) a resin whose solubility in an alkali is enhanced by an action of an acid, wherein the component (A) contains an onium salt (A1) having a naphthalene ring in the cation moiety.
摘要:
To provide a resin composition capable of forming a thin film layer so as to cause tenting over concave portions by conventional coating processes without depending on dry films, and also a coating method so as to cause tenting of the resin composition. A resin composition, which, by spin coating, causes tenting over concave portions formed on a substrate, the resin composition including a resin component (a) and a solvent (b) and has a viscosity of at least 200 cP, and tenting can be achieved by using the resin composition, allowing the resin composition to fall drop wise onto a substrate on which concave portions are formed, and spin coating the substrate at a rotating speed of 300 to 4000 rpm.
摘要:
To provide a resin composition capable of forming a thin film layer so as to cause tenting over concave portions by conventional coating processes without depending on dry films, and also a coating method so as to cause tenting of the resin composition. A resin composition, which, by spin coating, causes tenting over concave portions formed on a substrate, the resin composition including a resin component (a) and a solvent (b) and has a viscosity of at least 200 cP, and tenting can be achieved by using the resin composition, allowing the resin composition to fall drop wise onto a substrate on which concave portions are formed, and spin coating the substrate at a rotating speed of 300 to 4000 rpm.
摘要:
There are provided a stable chemically amplified photoresist composition that undergoes no change in alkali solubility prior to irradiation, a photoresist laminated product produced by laminating the photoresist composition onto a support, and a manufacturing method for a photoresist pattern and a manufacturing method for a connection terminal that use the photoresist composition and the laminated product. A chemically amplified photoresist composition is provided comprising (a) a resin that undergoes a change in alkali solubility under the action of acid, (b) a compound that generates acid on irradiation, and (c) a corrosion inhibitor.
摘要:
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.
摘要:
To provide a developer composition for resists, capable of improving dimensional controllability of a resist pattern. The developer composition for resists comprises an organic quaternary ammonium base as a main component, said developer composition further comprising an anionic surfactant represented by the following general formula (I), and SO42−, the content of S42− being from 0.01 to 1% by mass. In the formula, at least one of R1 and R2 represents an alkyl or alkoxy group having 5 to 18 carbon atoms and the other one represents a hydrogen atom, or an alkyl or alkoxy group having 5 to 18 carbon atoms, and at least one of R3, R4 and R5 represents an ammonium sulfonate group or a sulfonic acid-substituted ammonium group and the others represent a hydrogen atom, an ammonium sulfonate group or a sulfonic acid-substituted ammonium group.
摘要:
A developer composition for resists which has a high dissolution rate (high developing sensitivity). The developer composition for resists comprises an organic quaternary ammonium base as a main component and a surfactant containing an anionic surfactant represented by formula (I).
摘要:
There are provided a stable chemically amplified photoresist composition that undergoes no change in alkali solubility prior to irradiation, a photoresist laminated product produced by laminating the photoresist composition onto a support, and a manufacturing method for a photoresist pattern and a manufacturing method for a connection terminal that use the photoresist composition and the laminated product. A chemically amplified photoresist composition is provided comprising (a) a resin that undergoes a change in alkali solubility under the action of acid, (b) a compound that generates acid on irradiation, and (c) a corrosion inhibitor.