-
公开(公告)号：US20050083665A1
公开(公告)日：2005-04-21
申请号：US10502609
申请日：2003-12-05
CPC分类号： H05K1/181 , H02M7/003 , H05K1/053 , H05K1/056 , H05K1/141 , H05K1/144 , H05K3/202 , H05K2201/0397 , H05K2201/1003 , H05K2201/10166 , Y02P70/611
摘要： In a power conversion module device of the present invention, transformer (11), primary power element (14), and secondary power element (15) are mounted on printed wiring board (16) in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reduction in impedance and loss in the wiring, this constitution improves the voltage waveform of primary power element (14). Thus, noise reduction can be achieved. Further, because heat can be transferred to printed wiring board (16), heat generated from transformer (11), primary power element (14), and secondary power element (15) can be reduced. The size of the transformer can also be reduced.
摘要翻译： 在本发明的电力变换模块装置中，变压器（11），一次电力元件（14）和二次电力元件（15）以与表面接触的方式安装在印刷电路板（16）上，没有 控制电路安装在其上。 除了减少布线中的阻抗和损耗之外，这种结构提高了主要功率元件（14）的电压波形。 因此，可以实现降噪。 此外，由于可以将热传递到印刷布线板（16），所以可以减少从变压器（11），主功率元件（14）和次级功率元件（15）产生的热量。 变压器的尺寸也可以减小。
-
公开(公告)号：US07262973B2
公开(公告)日：2007-08-28
申请号：US10502609
申请日：2003-12-05
CPC分类号： H05K1/181 , H02M7/003 , H05K1/053 , H05K1/056 , H05K1/141 , H05K1/144 , H05K3/202 , H05K2201/0397 , H05K2201/1003 , H05K2201/10166 , Y02P70/611
摘要： In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reducing impedance and loss in the wiring, this constitution improves the voltage waveform of the primary power element. Thus, noise reduction can be achieved. Further, because heat can be transferred to the printed wiring board, heat generated from the transformer, the primary power element and the secondary power element can be reduced. The size of the transformer can also be reduced.
摘要翻译： 在本发明的电力转换模块装置中，变压器，一次电源元件和二次电源元件以与表面接触的方式安装在印刷电路板上，并且没有安装控制电路。 除了减少布线中的阻抗和损耗之外，这种结构提高了主功率元件的电压波形。 因此，可以实现降噪。 此外，由于可以将热传递到印刷线路板，因此可以减少从变压器，主功率元件和次级功率元件产生的热量。 变压器的尺寸也可以减小。
-
公开(公告)号：US5917712A
公开(公告)日：1999-06-29
申请号：US952123
申请日：1998-01-26
申请人： Hideki Okura , Makoto Ono , Etsuo Tsujimoto , Fumiaki Hashimoto
发明人： Hideki Okura , Makoto Ono , Etsuo Tsujimoto , Fumiaki Hashimoto
CPC分类号： H02M1/34 , H02M3/33507 , H02M3/33523 , H02M3/338 , H02M3/3385 , H02M2001/0032 , H02M2001/0045 , H02M2001/344 , Y02B70/16
摘要： An inexpensive highly reliable power supply for small-sized electronic devices, in which any high-withstand-voltage diode which has been used conventionally is not used and reverse leak currents are prevented. A series circuit of a primary-side coil (34) of a switching transformer and a switching element (35) is connected between both ends of an input power source (31) and a series circuit composed of a resistor (32) and a capacitor (33) is also connected between both ends of the power source (31). The connecting point between the resistor (32) and capacitor (33) is connected to one end of the control winding (37) of the switching transformer and the other end of the winding (37) of the transformer is connected to the control terminal of the switching element (35). A discharge circuit (40) which is driven by signals from the control winding (37) of the transformer is used as a means for discharging the capacitor (33).
摘要翻译： PCT No.PCT / JP96 / 01233 Sec。 371日期1998年1月26日 102（e）1998年1月26日PCT PCT 1996年5月9日PCT公布。 公开号WO96 / 36102 日期1996年11月14日对于小型电子设备来说，廉价高可靠性的电源，其中不使用常规使用的任何高耐压二极管，并且防止反向泄漏电流。 开关变压器的初级侧线圈（34）和开关元件（35）的串联电路连接在输入电源（31）的两端和由电阻（32）和电容器 （33）也连接在电源（31）的两端之间。 电阻器（32）和电容器（33）之间的连接点连接到开关变压器的控制绕组（37）的一端，变压器的绕组（37）的另一端连接到 开关元件（35）。 用来自变压器的控制绕组（37）的信号驱动的放电电路（40）用作放电电容器（33）的装置。
-
公开(公告)号：US08008756B2
公开(公告)日：2011-08-30
申请号：US12300184
申请日：2007-06-13
IPC分类号： H01L23/495
CPC分类号： H05K3/202 , H01L23/3737 , H01L23/49861 , H01L24/81 , H01L2924/12042 , H01L2924/15747 , H05K1/0373 , H05K1/056 , H05K3/027 , H05K3/06 , H05K2201/0209 , H05K2201/0376 , H05K2201/09118 , H05K2201/098 , H05K2201/09881 , H05K2201/10106 , H05K2203/0369 , H05K2203/1476 , H01L2924/00
摘要： A heat dissipating wiring board includes a metal wiring plate with a circuit pattern formed therein, a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed, and a heat dissipating plate arranged on an under surface of the filler containing resin layer. The circuit pattern is formed of a through groove provided in the metal wiring plate. The through groove includes a fine groove that opens at the top surface of the metal wiring plate and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to dust or the like in a space of the through groove.
摘要翻译： 一种散热布线板包括其中形成有电路图案的金属布线板，嵌入有金属布线板的填料容纳树脂层，以使金属布线板的上表面露出;以及布置在下面的散热板 填料含树脂层的表面。 电路图案由设置在金属布线板中的贯通槽形成。 贯通槽包括在金属配线板的上表面开口的细槽，以及从金属配线板的下表面向微细槽的下端扩展的扩径槽。 散热布线板能够提高通过沟槽的空间中的灰尘等导致的电绝缘性的可靠性。
-
公开(公告)号：US20090141462A1
公开(公告)日：2009-06-04
申请号：US12063795
申请日：2006-08-08
IPC分类号： H05K7/00
CPC分类号： H05K1/141 , H05K1/148 , H05K3/0061 , H05K7/20972 , H05K2201/10477
摘要： A PDP (600) is attached to an electrically conductive board (31) with a heat dissipation sheet (60) sandwiched therebetween. A first driving circuit board (32) is fixed on the electrically conductive board (31) by a plurality of electrically conductive supports (34). On one surface, which faces the electrically conductive board (31), of the first driving circuit board (32), one or plurality of electronic components are mounted while a second driving circuit board (40) is fixed. A plurality of support terminals (43b) of the second driving circuit board (40) are connected to the first driving circuit board (32), and the first driving circuit board (32) is attached to the electrically conductive board (31) by the electrically conductive supports (34). Thus, one surface of the second driving circuit board (40) is in contact with the electrically conductive board (31). One or plurality of surface mount components (36) are mounted on the other surface of the second driving circuit board (40) that faces the first driving circuit board (32).
摘要翻译： PDP（600）被附着在导电板（31）上，散热片（60）夹在其间。 第一驱动电路板（32）通过多个导电支撑件（34）固定在导电板（31）上。 在第一驱动电路板（32）的面向导电板（31）的一个表面上，一个或多个电子部件被安装在第二驱动电路板（40）上。 第二驱动电路板（40）的多个支撑端子（43b）与第一驱动电路基板（32）连接，第一驱动电路基板（32）通过 导电支撑件（34）。 因此，第二驱动电路板（40）的一个表面与导电板（31）接触。 一个或多个表面安装部件（36）安装在面对第一驱动电路板（32）的第二驱动电路板（40）的另一个表面上。
-
6.发明申请公开(公告)号：US20090266584A1
公开(公告)日：2009-10-29
申请号：US12065915
申请日：2006-09-25
CPC分类号： H01L23/3735 , H01L23/142 , H01L23/145 , H01L23/49861 , H01L33/642 , H01L33/647 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/09736 , H05K2201/10106 , Y10T29/49128 , Y10T29/49162 , H01L2924/00
摘要： It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.
摘要翻译： 本发明的目的是改进传统的点，即将诸如LED的高电流和热辐射的电子部件与其他通用电子部件一起安装在同一板上是困难的。 为了实现该目的，使用部分具有不同厚度的不同厚度的引线框架。 在不同厚度的引线框架的厚部分上，安装了需要高电流和热辐射的特殊电子部件，例如LED。 此外，不同厚度的引线框架的薄部分以细间距形成，并且通常的电子部件以高密度安装在薄部分上。 因此，需要高电流和热辐射的电子部件的组合或模块化成为可能。
-
公开(公告)号：US07944712B2
公开(公告)日：2011-05-17
申请号：US12063795
申请日：2006-08-08
CPC分类号： H05K1/141 , H05K1/148 , H05K3/0061 , H05K7/20972 , H05K2201/10477
摘要： A PDP (plasma display panel) is attached to an electrically conductive board with a heat dissipation sheet sandwiched therebetween. A first driving circuit board is fixed on the electrically conductive board by a plurality of electrically conductive supports. On one surface, which faces the electrically conductive board, of the first driving circuit board, one or a plurality of electronic components are mounted, while a second driving circuit board is fixed. A plurality of support terminals of the second driving circuit board are connected to the first driving circuit board, and the first driving circuit board is attached to the electrically conductive board by the electrically conductive supports. Thus, one surface of the second driving circuit board is in contact with the electrically conductive board. One or a plurality of surface mount components are mounted on the other surface of the second driving circuit board that faces the first driving circuit board.
摘要翻译： PDP（等离子体显示面板）安装在导电板上，散热片夹在其间。 第一驱动电路板通过多个导电支撑件固定在导电板上。 在第一驱动电路板的面对导电板的一个表面上，安装有一个或多个电子部件，同时固定第二驱动电路板。 第二驱动电路板的多个支撑端子连接到第一驱动电路板，并且第一驱动电路板通过导电支撑件附接到导电板。 因此，第二驱动电路板的一个表面与导电板接触。 一个或多个表面安装部件安装在第二驱动电路板的面对第一驱动电路板的另一表面上。
-
8.发明授权公开(公告)号：US08263870B2
公开(公告)日：2012-09-11
申请号：US12065915
申请日：2006-09-25
CPC分类号： H01L23/3735 , H01L23/142 , H01L23/145 , H01L23/49861 , H01L33/642 , H01L33/647 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/09736 , H05K2201/10106 , Y10T29/49128 , Y10T29/49162 , H01L2924/00
摘要： It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.
摘要翻译： 本发明的目的是改进传统的点，即将诸如LED的高电流和热辐射的电子部件与其他通用电子部件一起安装在同一板上是困难的。 为了实现该目的，使用部分具有不同厚度的不同厚度的引线框架。 在不同厚度的引线框架的厚部分上，安装了需要高电流和热辐射的特殊电子部件，例如LED。 此外，不同厚度的引线框架的薄部分以细间距形成，并且通常的电子部件以高密度安装在薄部分上。 因此，需要高电流和热辐射的电子部件的组合或模块化成为可能。
-
公开(公告)号：US20090178828A1
公开(公告)日：2009-07-16
申请号：US12300184
申请日：2007-06-13
CPC分类号： H05K3/202 , H01L23/3737 , H01L23/49861 , H01L24/81 , H01L2924/12042 , H01L2924/15747 , H05K1/0373 , H05K1/056 , H05K3/027 , H05K3/06 , H05K2201/0209 , H05K2201/0376 , H05K2201/09118 , H05K2201/098 , H05K2201/09881 , H05K2201/10106 , H05K2203/0369 , H05K2203/1476 , H01L2924/00
摘要： A heat dissipating wiring board comprises: a metal wiring plate with a circuit pattern formed therein: a filler-containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed; and a heat dissipating plate arranged on an under surface of the filler-containing resin layer, wherein the circuit pattern is formed of a through groove provided in the metal wiring plate, and this through groove comprises: a fine groove that opens at the top surface of the metal wiring plate; and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to a dust or the like in a space of the through groove.
摘要翻译： 散热布线板包括：金属布线板，其中形成有电路图案;一个含有填料的树脂层，嵌入金属布线板，使得金属布线板的顶表面露出; 以及布置在所述含填料的树脂层的下表面上的散热板，其中所述电路图案由设置在所述金属布线板中的通孔形成，并且所述通孔包括：在顶表面开口的细槽 的金属布线板; 以及从所述细槽的下端朝向所述金属配线板的下表面扩展的扩径槽。 散热布线板能够提高通过沟槽的空间中的灰尘等的电绝缘性的可靠性。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.021 秒)
