摘要:
An RFID tag includes: an antenna receiving an RF signal from a reader; an AFE (analog front end) generating voltage using the RF signal; and one or more switches interposed between the antenna and the AFE and controlling the connection between the antenna and the AFE through the switch operation.
摘要:
Provided is a radio frequency identification (RFID) tag whose data can be stably read at a long distance on the basis of a passive RFID tag. The RFID tag includes a rechargeable unit charged to a predetermined voltage, and a power source including a direct current (DC) power source including a rectifier for converting an RF signal into DC power and a regulator for supplying a predetermined DC voltage, an interceptor disposed between the rechargeable unit and the DC power source to connecting or disconnecting the power to the rechargeable unit, and an overvoltage preventor connected to an output terminal of the DC power source in parallel.
摘要:
An organic light emitting diode (OLED) and a method for manufacturing the same are provided. In the OLED, patterned metal electrodes are positioned on one or more of upper and lower portions of a light emission layer to allow light generated from the light emission layer to emit to an area between the patterned metal electrodes.
摘要:
Provided are a polarizer and a liquid crystal display (LCD) in which wire grid polarizers are formed on a thin film transistor substrate and a color filter substrate, respectively, so that it is possible to reduce fabrication cost and the number of processes and decrease the thickness of the LCD. An LCD includes a thin film transistor substrate, a color filter substrate opposite to the thin film transistor substrate, and a liquid crystal layer positioned between the thin film transistor substrate and the color filter substrate. In the LCD, wire grid polarizing patterns are formed on the thin film transistor substrate and the color filter substrate, respectively.
摘要:
A via forming method is provided. The via forming method includes: forming via-holes in a substrate; putting the substrate having the via-holes in a first solution to fill the via-holes with the first solution; sinking the metal particles into the via-holes by supplying a second solution containing metal particles to the first solution, in which there is the substrate; and performing a first curing process of heat-treating the substrate having the via-holes filled with the metal particles so as to form vias in the via-holes. Further, a method of manufacturing a multi-chip package using the via forming method is provided.
摘要:
A via forming method that includes forming via-holes in a substrate is provided. The method includes putting the substrate, having the via-holes, in a first solution to fill the via-holes with the first solution. Metal particles are sunk into the via-holes by supplying a second solution containing the metal particles to the first solution. A first curing process of heat-treating the substrate is performed so as to form vias in the via-holes. A multi-chip package that includes the substrate having the vias is also provided.
摘要:
Disclosed are a printing plate and a mirror thereof, the printing plate including: printing portions for transferring an immersed solution, the printing portions being formed flat and arranged at regular intervals on one side of an upper part of the printing plate; and non-printing portions corresponding to a remaining area other than the printing portions, the non-printing portions being formed with at least two concavities and convexities respectively and arranged at regular intervals on the other side of the upper part of the printing plate.
摘要:
Disclosed are a printing plate and a mirror thereof, the printing plate including: printing portions for transferring an immersed solution, the printing portions being formed flat and arranged at regular intervals on one side of an upper part of the printing plate; and non-printing portions corresponding to a remaining area other than the printing portions, the non-printing portions being formed with at least two concavities and convexities respectively and arranged at regular intervals on the other side of the upper part of the printing plate.
摘要:
An organic light emitting diode (OLED) device is provided. The OLED device includes: a substrate; an anode formed on the substrate; a first organic thin layer formed on the anode; an organic emission layer formed on the first organic thin layer; a second organic thin layer formed on the organic emission layer; and a cathode formed on the second organic thin layer, wherein the first and second organic thin layers are formed in a single layer or a multi-layer, and at least a part of the first or second organic thin layer is doped with or formed of an insulator. The OLED device provides excellent durability, long life-time, and increased luminous efficiency by balanced charge injection caused by doping or stacking the insulator into or on the organic thin layer.
摘要:
Provided is a method for fabricating a polarizer. The method includes forming an unevenness structure pattern on a substrate, coating conductive nano-particles on an entire surface of the unevenness structure pattern, and planarizing an entire surface of the resultant substrate after the conductive nano-particles are coated on the unevenness structure pattern.