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    Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means
    2.
    发明授权
    Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means 失效
    电子部件包装装置，以及使用电子部件包装机构供给电子部件的供给机构和方法

    公开(公告)号：US5368193A

    公开(公告)日：1994-11-29

    申请号：US993734

    申请日：1992-12-17

    申请人： Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

    发明人： Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

    IPC分类号： H05K13/00 ,  H05K13/04 ,  B65G59/00

    CPC分类号： H05K13/0434 ,  H05K13/0084 ,  Y10T29/53261

    摘要： Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at an upper position when the case is supported on the base, the outlet being faced upward, above which outlet the mounting head is adapted to wait. Also, an electronic component supply mechanism for and a method of supplying electronic components to the mounting head by using the packaging case are disclosed.

    摘要翻译： 电子部件包装盒包括基本上为板状的主体，该主体具有形成在其内部的基本螺旋形通道，形成在其中的线性通道，作为所述黑色通道的最外圆形部分的延续部，其中形成为所述直线通道 与身体的外部连通，在螺旋通道中一排地容纳的多个电子部件，以及用于促进电子部件沿着螺旋通道转移到出口的多个进气口，进气口为 在壳体内以螺旋形通道的各圆形部分和壳体外部连通的方式形成在壳体内，该壳体适于支撑在电子部件供应机构的基座上，其身体站在基座上， 该壳体用作电子部件供应源，该出口形成在壳体的一部分 当壳体被支撑在基座上时位于上部位置的主体，出口面向上方，安装头的出口适于在其上方等待。 此外，公开了一种电子部件供给机构，以及通过使用包装盒向安装头供给电子部件的方法。

    Chip packaging means and supply mechanism for supplying chips by using the chip packaging means
    3.
    发明授权
    Chip packaging means and supply mechanism for supplying chips by using the chip packaging means 失效
    用于通过使用芯片封装装置供应芯片的芯片封装装置和供电机构

    公开(公告)号：US5143253A

    公开(公告)日：1992-09-01

    申请号：US402041

    申请日：1989-09-01

    申请人： Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

    发明人： Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

    IPC分类号： B65G51/03 ,  H05K13/02

    CPC分类号： H05K13/027 ,  B65G51/03

    摘要： A chip packaging casing for packing chips and also serving as a chip supply source comprises a substantially plate-like body having a spiral passageway formed in its interior, and a plurality of chips received in a row in the spiral passageway of the body. The plate-like body further has a chip-outlet formed therein as a continuation of the spiral passageway to communicate with the exterior of the body and at least one air-intake formed therein to communicate between the passageway and the exterior of the body. The air-intake is adapted to be connected to an air supply source and serves to facilitate the forwarding of the chips along the passageway toward the outlet to discharge the chips form the outlet. A chip supply mechanism is provided for supplying chips to a mounting head of an automatic chip mounting apparatus by using the chip packaging casing.

    摘要翻译： 用于包装芯片并且还用作芯片供应源的芯片封装壳体包括在其内部形成有螺旋形通道的基本上板状的主体，以及在主体的螺旋通道中并排接收的多个芯片。 板状体还具有形成在其中作为螺旋通道的延续部分的芯片出口，其与主体的外部连通并且形成在其中的至少一个进气口在主体的通道和外部之间连通。 进气口适于连接到空气供应源，并且用于促进沿着通道朝向出口排出切屑以从出口排出芯片。 提供了一种芯片供给机构，用于通过使用芯片封装壳体将芯片供应到自动芯片安装装置的安装头。

    Electronic component feed system
    4.
    发明授权
    Electronic component feed system 失效
    电子元件供料系统

    公开(公告)号：US5319846A

    公开(公告)日：1994-06-14

    申请号：US909311

    申请日：1992-07-06

    申请人： Tetsuo Takahashi ,  Shinichi Araya ,  Kunio Mogi ,  Kuniaki Takahashi ,  Kouji Kudou ,  Takeshi Itou

    发明人： Tetsuo Takahashi ,  Shinichi Araya ,  Kunio Mogi ,  Kuniaki Takahashi ,  Kouji Kudou ,  Takeshi Itou

    IPC分类号： H05K13/02 ,  H05K13/04 ,  B23P19/00

    CPC分类号： H05K13/0452 ,  H05K13/0084 ,  H05K13/02 ,  Y10T29/53178

    摘要： An electronic component feed system capable of feeding an electronic component mounting apparatus with a variety of electronic components such as chips, lead-type electronic components and the like in various forms. A plurality of feeder modules corresponding to sorts of electronic components to be mounted on printed circuit boards are stored in a storage kit and transferred through the storage kit to an electronic component feed section of the mounting apparatus on which a printed circuit board is held. Then, the electronic components are mounted on the printed circuit board by means of a mounting head.

    摘要翻译： 一种电子部件供给系统，其能够以各种形式向电子部件安装装置供给各种电子部件，例如芯片，引线型电子部件等。 对应于要安装在印刷电路板上的各种电子元件的多个馈线模块被存储在存储套件中并通过存储套件传送到安装设备的电子元件供给部分，在其上保持印刷电路板。 然后，电子部件通过安装头安装在印刷电路板上。

    Semiconductor device and method for fabricating the same
    6.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US08994141B2

    公开(公告)日：2015-03-31

    申请号：US12685180

    申请日：2010-01-11

    申请人： Tetsuo Takahashi ,  Takami Otsuki

    发明人： Tetsuo Takahashi ,  Takami Otsuki

    IPC分类号： H01L29/66 ,  H01L29/40 ,  H01L29/739 ,  H01L29/78 ,  H01L29/06

    CPC分类号： H01L29/063 ,  H01L29/0615 ,  H01L29/0638 ,  H01L29/404 ,  H01L29/407 ,  H01L29/66333 ,  H01L29/7395 ,  H01L29/7811

    摘要： A semiconductor includes an N-type impurity region provided in a substrate. A P-type RESURF layer is provided at a top face of the substrate in the N-type impurity region. A P-well has an impurity concentration higher than that of the P-type RESURF layer, and makes contact with the P-type RESURF layer at the top face of the substrate in the N-type impurity region. A first high-voltage-side plate is electrically connected to the N-type impurity region, and a low-voltage-side plate is electrically connected to a P-type impurity region. A lower field plate is capable of generating a lower capacitive coupling with the substrate. An upper field plate is located at a position farther from the substrate than the lower field plate, and is capable of generating an upper capacitive coupling with the lower field plate whose capacitance is greater than the capacitance of the lower capacitive coupling.

    摘要翻译： 半导体包括设置在基板中的N型杂质区。 P型RESURF层设置在N型杂质区的衬底顶面。 P阱的杂质浓度比P型RESURF层高，与N型杂质区的衬底顶面的P型RESURF层接触。 第一高电压侧板与N型杂质区电连接，低压侧板与P型杂质区电连接。 下场板能够产生与衬底的较低的电容耦合。 上场板位于比下场板更远离衬底的位置处，并且能够产生与电容大于低容性耦合的电容的下场板的上电容耦合。

    6,12-dinaphthylchrysene derivative and organic light-emitting device using the derivative
    7.
    发明授权
    6,12-dinaphthylchrysene derivative and organic light-emitting device using the derivative 有权
    6,12-二萘基衍生物和使用该衍生物的有机发光装置

    公开(公告)号：US08790795B2

    公开(公告)日：2014-07-29

    申请号：US13480608

    申请日：2012-05-25

    申请人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    发明人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    IPC分类号： H01L51/54 ,  C07D235/18 ,  C07D498/04

    CPC分类号： H01L51/0054 ,  H01L51/0058 ,  H01L51/0072 ,  H01L51/5072 ,  H01L51/5096

    摘要： Provided are an organic compound having high heat stability suitable for use in an organic light-emitting device, and an organic light-emitting device using the organic compound. The organic light-emitting device is an organic light-emitting device, including: an anode; a cathode; and an organic compound layer disposed between the anode and the cathode, in which at least one layer of the organic compound layer has a 6,12-dinaphthylchrysene derivative represented by one of the following general formulae (1) and (2): in the formulae (1) and (2), Z represents a naphthyl group, and Q represents an electron-withdrawing substituent selected from the group consisting of the following general formulae (3) to (5): in the formula (5), R1 represents a hydrogen atom or a methyl group.

    摘要翻译： 提供了适用于有机发光装置的具有高热稳定性的有机化合物和使用该有机化合物的有机发光装置。 有机发光器件是有机发光器件，包括：阳极; 阴极 和设置在阳极和阴极之间的有机化合物层，其中至少一层有机化合物层具有由以下通式（1）和（2）之一表示的6,12-二萘基衍生物：在 式（1）和（2）中，Z表示萘基，Q表示选自下述通式（3）〜（5）的吸电子取代基：式（5）中，R 1表示 氢原子或甲基。

    6,12-DINAPHTHYLCHRYSENE DERIVATIVE AND ORGANIC LIGHT-EMITTING DEVICE USING THE DERIVATIVE
    9.
    发明申请
    6,12-DINAPHTHYLCHRYSENE DERIVATIVE AND ORGANIC LIGHT-EMITTING DEVICE USING THE DERIVATIVE 有权
    6,12-十六烷基衍生物和有机发光装置，使用衍生物

    公开(公告)号：US20120313083A1

    公开(公告)日：2012-12-13

    申请号：US13480608

    申请日：2012-05-25

    申请人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    发明人： Hironobu Iwawaki ,  Hiroki Ohrui ,  Yuko Chishina ,  Masanori Muratsubaki ,  Tetsuo Takahashi

    IPC分类号： H01L51/54 ,  C07D235/18 ,  C07D498/04

    CPC分类号： H01L51/0054 ,  H01L51/0058 ,  H01L51/0072 ,  H01L51/5072 ,  H01L51/5096

    摘要： Provided are an organic compound having high heat stability suitable for use in an organic light-emitting device, and an organic light-emitting device using the organic compound. The organic light-emitting device is an organic light-emitting device, including: an anode; a cathode; and an organic compound layer disposed between the anode and the cathode, in which at least one layer of the organic compound layer has a 6,12-dinaphthylchrysene derivative represented by one of the following general formulae (1) and (2): in the formulae (1) and (2), Z represents a naphthyl group, and Q represents an electron-withdrawing substituent selected from the group consisting of the following general formulae (3) to (5): in the formula (5), R1 represents a hydrogen atom or a methyl group.

    摘要翻译： 提供了适用于有机发光装置的具有高热稳定性的有机化合物和使用该有机化合物的有机发光装置。 有机发光器件是有机发光器件，包括：阳极; 阴极 和设置在阳极和阴极之间的有机化合物层，其中至少一层有机化合物层具有由以下通式（1）和（2）之一表示的6,12-二萘基衍生物：在 式（1）和（2）中，Z表示萘基，Q表示选自下述通式（3）〜（5）的吸电子取代基：式（5）中，R 1表示 氢原子或甲基。

    Capacity variable link apparatus and capacity variable link setting method
    10.
    发明授权
    Capacity variable link apparatus and capacity variable link setting method 失效
    容量变量链接装置和容量变量链接设置方法

    公开(公告)号：US07912087B2

    公开(公告)日：2011-03-22

    申请号：US10347339

    申请日：2003-01-21

    申请人： Yukio Tsukishima ,  Tetsuo Takahashi ,  Atsushi Watanabe ,  Yasutaka Okazaki

    发明人： Yukio Tsukishima ,  Tetsuo Takahashi ,  Atsushi Watanabe ,  Yasutaka Okazaki

    IPC分类号： H04J3/16 ,  H04J3/24 ,  H04J3/04 ,  G01R31/08

    CPC分类号： H04L47/10 ,  H04J3/1682 ,  H04L47/11 ,  H04L47/13

    摘要： A capacity variable link apparatus including a main signal system and a control signal system is provided. The main signal system includes: an upper layer signal accommodation part; a lower layer path termination part; and a signal switching part for dividing the upper layer signal to lower layer signals in a lower layer path group having a capacity that is determined according to an amount of traffic of the upper layer signal. The control system includes: a traffic amount measuring part for measuring the amount of traffic of the upper layer and for determining whether the capacity of the lower layer path group is to be increased or decreased according to the amount; and a signal switching management part for controlling the signal switching part according to the result of the determination.

    摘要翻译： 提供一种包括主信号系统和控制信号系统的容量可变链路装置。 主信号系统包括：上层信号容纳部分; 下层路径终端部分; 以及信号切换部分，用于将上层信号划分为具有根据上层信号的业务量确定的容量的下层路径组中的较低层信号。 控制系统包括：用于测量上层的业务量的流量测量部分，用于根据该量确定下层路径组的容量是否增加或减少; 以及信号切换管理部，根据判定结果控制信号切换部。