Abstract:
The invention is related to a fixture device for motherboard module by placing two fixing plates on the locational surface of a major control device. A Π-shaped slide way with the same width as the motherboard module is formed on the base plate below the fixing plate. Additionally, a locating button in front of the opening of the slide way is used to secure the motherboard module into the slide way. Through this approach, the motherboard module can be easily installed/disassembled by pressing the locating button without using any tools or test fixtures.
Abstract:
The present invention relates to an adjustable height apparatus applied to a horizontal projector and comprises a shield assembly, a supporting means, a compression link and a lever. When adjusting the projection elevation, an external force is applied on an adjusting button of the top wall of the projector. The compression link, connecting with the button, makes a vertical movement according to the external force and pushes the detent of the lever to depart from contact with the axial height-positioning component. The sleeve extends toward the outside of said shell by the elasticity of a first elastic component for adjusting a suitable height of the bottom base of the supporting means of the projector.
Abstract:
A light convergence module with a heat dissipation function is revealed. It comprises a substrate, an assembling unit, a light convergence lampshade, and a heat sink, wherein the assembling unit with a first surface assembling to the substrate and a second surface assembling to the light convergence lampshade comprises a locating block and a plurality of position limiting blocks for respectively engaging with a locating slot and a plurality of position limiting slots of the substrate, and two buckles for correspondingly clasping two concave slots of the substrate to limit the substrate in position, and wherein the heat sink comprises a plurality of interspaces formed between every two adjacent heat dissipation fins for securing the buckles of the assembling unit and allowing the heat sink to closely dispose on the substrate.
Abstract:
The present invention relates to a light-emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
Abstract:
The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.
Abstract:
The present invention is related to a light emitting device with an insulating layer, which comprises a transparent substrate, a first light emitting unit, a second light emitting unit, an insulating layer and a conducting layer. The first light emitting unit and the second light emitting unit are set up on the transparent substrate, wherein the second light emitting unit has an appearance of a stair structure. The insulating layer is set between the first and the second light emitting units. The conducting layer is on the insulating layer in order to conduct the first and the second light emitting units. Because of the appearance of the stair structure of the second light emitting unit, improving the cladding efficiency of the insulating layer, further improving the insulating efficiency of the insulating layer and avoiding the insulating layer loosing and the leakage between the first and the second light emitting units.
Abstract:
A multiple-function power supply adapter includes a supporting base with an interior thereof hollowed out, a power-supplying sleeve provided on the supporting base, and a transforming unit provided in the supporting base. The power-supplying sleeve is an automobile power-supplying socket. The transforming unit is electrically connected between a power supply line and the power-supplying sleeve. The power supply line extends from the inside of the supporting base to the outside thereof. The distal end of the power supply line is provided with a power supply plug. With the automobile power-supplying sleeve, the power supply adapter can be applied to various electrical appliances.
Abstract:
A cooling apparatus for a light valve of the present invention includes a control box disposed on the back of the light valve to actuate the light valve, followed by a heat pipe and a heat-conducting component pasted upon the inner surface of the control box. The heat-conducting component is connected to a heat-collecting end of the heat pipe and one of its surface contacts with the light valve. The heat of the light valve is conducted to the second part of the control box through the heat-conducting component, and then the heat is conducted to the second part of the control box via the heat pipe pasted upon it. Thus, the heat of the light valve can be removed through the large area of the second part of control box, so as to increase the cooling efficiency and simplify the cooling apparatus.
Abstract:
A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer. Therefore, both LED brightness and efficiency are improved. Moreover, adhesion between the conductive layer and the p-type semiconductor layer is improved so that metal peel-off problem during manufacturing processes can be improved.