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    Light emitting diode package and light emitting diode system having at least two heat sinks
    4.
    发明申请
    Light emitting diode package and light emitting diode system having at least two heat sinks 有权
    发光二极管封装和具有至少两个散热器的发光二极管系统

    公开(公告)号：US20070063321A1

    公开(公告)日：2007-03-22

    申请号：US10557820

    申请日：2004-05-14

    申请人： Kwan Han ,  Kwang Il Park ,  Jae Ho Cho ,  Jung Hoo Seo ,  Seong Ryu

    发明人： Kwan Han ,  Kwang Il Park ,  Jae Ho Cho ,  Jung Hoo Seo ,  Seong Ryu

    IPC分类号： H01L23/495

    CPC分类号： H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

    摘要： There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

    摘要翻译： 提供了具有至少两个散热器的发光二极管封装。 发光二极管封装包括主体，固定到主体的至少两个引线端子和至少两个导电和导热材料的散热片，散热片固定在主体上。 至少两个散热器彼此分离。 因此，可以获得将多个发光二极管管芯安装在一个LED封装中的高发光功率。 此外，可以实现在LED封装中安装发射不同波长的光的LED管的多色光。

    Multi-light emitting diode package
    8.
    发明授权
    Multi-light emitting diode package 有权
    多发光二极管封装

    公开(公告)号：US08860049B2

    公开(公告)日：2014-10-14

    申请号：US13090862

    申请日：2011-04-20

    申请人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    发明人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    IPC分类号： H01L33/62 ,  H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/64

    CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

    摘要翻译： 多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构 到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。 另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构 芯片和覆盖主LED芯片的至少一部分的荧光体。

    LED package having lead frames
    10.
    发明授权
    LED package having lead frames 有权
    LED封装具有引线框架

    公开(公告)号：US07705366B2

    公开(公告)日：2010-04-27

    申请号：US12059296

    申请日：2008-03-31

    申请人： Jung Hoo Seo ,  Suk Jin Kang

    发明人： Jung Hoo Seo ,  Suk Jin Kang

    IPC分类号： H01L29/22

    CPC分类号： H01L33/483 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00014

    摘要： The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.

    摘要翻译： 本发明涉及发光二极管（LED）封装。 本发明提供了一种LED封装，其中，用于限定LED芯片的周边的空腔和用于暴露引线框架所需的其它空腔分别形成在用于支撑引线框架的支撑构件中，并且限定LED芯片的圆周的空腔是 分别填充树脂，由此可以防止树脂部分之间的不规则界面，并且当形成为限制在LED芯片周围的树脂部分中含有荧光体时，可以减少颜色偏差 每个光方向角度，并防止不必要的磷光体浪费。