Thermosetting oligomer or polymer, thermosetting resin composition including the oligomer or polymer, and printed circuit board using the composition
    9.
    发明授权
    Thermosetting oligomer or polymer, thermosetting resin composition including the oligomer or polymer, and printed circuit board using the composition 有权
    包括低聚物或聚合物的热固性低聚物或聚合物,热固性树脂组合物,以及使用该组合物的印刷电路板

    公开(公告)号:US08986846B2

    公开(公告)日:2015-03-24

    申请号:US12489881

    申请日:2009-06-23

    摘要: A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.

    摘要翻译: 提供了一种热固性低聚物或热固性聚合物。 热固性低聚物或热固性聚合物含有重复单元,每个重复单元在侧链中具有至少一个热固性官能团,由式1表示:其中重复单元包括X1,A1和Y1亚基,侧链单元包括连接单元L和 热固性官能团Z,n为1至4的整数。热固性低聚物或热固性聚合物具有低的热膨胀系数,高玻璃化转变温度,刚度,加工性,耐热性和机械性能。 热固性低聚物或热固性聚合物是高度可溶的,可湿润的和尺寸稳定的并且适用于薄膜,预浸料和印刷电路板。 还提供了包含热固性低聚物或热固性聚合物的热固性树脂组合物和使用该组合物的印刷电路板。