摘要:
A polyurethane foam composition includes a polyol, a polyisocyanate, a catalyst, a foam stabilizer, a blowing agent and a fluorinated carbonate wherein the fluorinated carbonate is a compound represented by Formula 1: a compound represented by Formula 2: or a mixture thereof. Also disclosed is a polyurethane foam derived from the composition.
摘要:
A composition for a rigid polyurethane foam with reduced cell sizes contains a polyol, water, a catalyst, a blowing agent; and an ionic liquid. The rigid polyurethane foam is produced by adding an ionic liquid as an eco-friendly additive to a polyol composition so as to improve insulation efficiency thereof.
摘要:
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
摘要:
A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z1—(R1)m—(R2)n—Z2 (1), wherein R1 is represented by Formula 2: —X1—Ar1—Y1— (2), wherein X1 and Y1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C20 alkyl group, and a substituted or unsubstituted C6-C30 aryl group, and Ar1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:
摘要:
Disclosed herein is a cyclic dispersant having a rigid block which has a high affinity for carbon nanotubes, and a flexible block which has a high affinity for a solvent, with a linkage created therebetween. Having a structure that is advantageous with respect to adsorption to carbon nanotubes, the dispersant, even if used in a small amount, can disperse a large amount of carbon nanotubes.
摘要:
Disclosed herein are an aromatic imide-based dispersant for CNTs and a carbon nanotube composition comprising the same. Having an aromatic ring structure advantageously realizing adsorption on carbon nanotubes, the dispersant, even if used in a small amount, can disperse a large quantity of carbon nanotubes.
摘要:
Disclosed herein are an aromatic imide-based dispersant for CNTs and a carbon nanotube composition comprising the same. Having an aromatic ring structure advantageously realizing adsorption on carbon nanotubes, the dispersant, even if used in a small amount, can disperse a large quantity of carbon nanotubes.
摘要:
Provided are a device for adjusting an ultrasonic resonance frequency and a method of controlling the same. A device according to an embodiment of the present disclosure includes a circuit board configured to determine and output a resonance frequency. In addition, the device includes a frequency adjustor connected to at least one of a plurality of circuits mounted on the circuit board.
摘要:
A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.