摘要:
A material for use in the production of an alloy having excellent corrosion resistance and abrasion resistance is provided. The material includes a cored wire formed from at least a pipe of matrix metal, which is at least one member selected from an Fe-base alloy, a Co-base alloy, and a Ni-base alloy. A VC powder having a particle diameter of 10 .mu.m or less is filled into the pipe. Also provided is a material for use in the production of an alloy having excellent corrosion resistance and abrasion resistance. The material includes a powder mixture containing at least a matrix metal, which is at least one member selected from an Fe-base alloy, a Co-based alloy and a Ni-base alloy, and a VC powder having a particle diameter of 10 .mu.m or less.
摘要:
An alloy having excellent corrosion resistance and abrasion resistance, is provided comprising a matrix metal phase comprised of at least one member selected from an Fe-base alloy, a Co-base alloy and a Ni-base alloy and, present in the matrix metal phase, 10 to 65%, in terms of the area, of a substantially homogeneously crystallized and/or precipitated VC particle phase having a particle diameter of 5 .mu.m or less.A surface-modified metallic member, is also provided comprising a metallic member and the above-described alloy, the alloy being integrally coated on the surface of the metallic member at its desired portion.
摘要:
A process for preparing an alloy having excellent corrosion resistance and abrasion resistance is provided. The alloy is prepared by providing a powder mixture or VC-powder-containing wire having a matrix metal, including a VC powder having a particle diameter of 10 .mu.m or less, and at least one member selected from the group consisting of an Fe-base alloy, a Co-base alloy and a Ni-base alloy. The powder mixture or VC-powder-containing wire is melted with a heat source having a high energy density. The resultant melt is then cooled to homogeneously crystallize and/or precipitate VC, such that the particle diameter of the VC is reduced to 5 .mu.m or less in the matrix metal phase. Also disclosed is a process for preparing a surface-modified metallic member from a metallic member and an alloy prepared from the aforementioned process.
摘要:
The image-capturing device according to the present invention includes a solid-state imaging element, an infrared LED which emits infrared light, a light-emission controlling unit which causes the infrared LED to emit infrared pulsed light on a per frame time basis, and a signal processing unit which extracts, from the solid-state imaging element, a color visible-light image signal in synchronization with a non-emitting period and an infrared image signal in synchronization with an emitting period of the infrared LED. The solid-state imaging element includes an image-capturing region in which unit-arrays are two-dimensionally arranged, and each of the unit-arrays has a pixel for receiving green visible light and infrared light, a pixel for receiving red visible light and infrared light, a pixel for receiving blue visible light and infrared light, and a pixel for receiving infrared light.
摘要:
A fan apparatus includes a casing and a fan unit. The casing is a hollow member having an inlet and an outlet. The fan unit has an inlet and an outlet, and includes a plurality of axial fans. The fan unit is disposed on the inside of the casing, and the inlet of the fan unit is disposed in the vicinity of the inlet of the casing. The position of the fan unit within the casing can be varied in order to alter the air flow and static pressure of the air discharged by the fan apparatus.
摘要:
A memory cell includes a memory element including a MFSFET having a gate insulating film made of a ferroelectric film, and a selection switching element including a MISFET having a gate insulating film made of a paraelectric film. A load element for a read operation is connected in series to the memory cell. The ferroelectric film and the paraelectric film are stacked with a semiconductor film being interposed therebetween. The semiconductor film forms a common channel shared by the MFSFET and the MISFET. The load element includes a MISFET having a channel made of the semiconductor film or a resistance element having a resistor made of the semiconductor film.
摘要:
Provided is a solid-state imaging device having pixel units that are two-dimensionally arranged, and including: a photodiode that generates an optical signal charge corresponding to an intensity and an exposure time of light; a MOS transistor that transfers the optical signal charge; an accumulating unit that generates a voltage corresponding to the signal charge through the MOS transistor; a storing unit that stores a voltage corresponding to an optical signal charge in the accumulating unit; and a voltage setting unit that sets a value of a voltage in the accumulating unit to a value corresponding to the voltage in the storing unit.
摘要:
A semiconductor memory includes a conducting film formed on a substrate; a ferroelectric film formed above or below the conducting film; a source electrode and a drain electrode disposed in positions opposing the conducting film with the ferroelectric film sandwiched therebetween and spaced from each other; and an insulating film formed between the source electrode and the drain electrode.
摘要:
A memory cell includes a memory element including a MFSFET having a gate insulating film made of a ferroelectric film, and a selection switching element including a MISFET having a gate insulating film made of a paraelectric film. A load element for a read operation is connected in series to the memory cell. The ferroelectric film and the paraelectric film are stacked with a semiconductor film being interposed therebetween. The semiconductor film forms a common channel shared by the MFSFET and the MISFET. The load element includes a MISFET having a channel made of the semiconductor film or a resistance element having a resistor made of the semiconductor film.
摘要:
A memory device includes memory cells each having a capacitor including a lower electrode, a ferroelectric film and an upper electrode which are formed in this order over a substrate made of silicon. The ferroelectric film is selectively grown on the lower electrode. Such selective formation of the ferroelectric film on the lower electrode having a desired shape prevents a damaged portion from occurring in the ferroelectric film, thus making it possible to downsize the memory cells.