摘要:
The present invention relates to polyarylene sulfide, in which a ratio of a peak area of a polymer chain of a second polyarylene sulfide having a lower molecular weight than the maximum peak molecular weight to a peak area of a polymer chain of a first polyarylene sulfide having a higher molecular weight than the maximum peak molecular weight is 1.3 or less in the molecular weight distribution of the polyarylene sulfide, as measured by gel permeation chromatography using polystyrene as a standard, and a preparation method thereof. This polyarylene sulfide exhibits excellent processability and generates no burrs (flashes) or the like, and can satisfactorily mold a product requiring high molding precision.
摘要:
The present invention relates to polyarylene sulfide, in which a ratio of a peak area of a polymer chain of a second polyarylene sulfide having a lower molecular weight than the maximum peak molecular weight to a peak area of a polymer chain of a first polyarylene sulfide having a higher molecular weight than the maximum peak molecular weight is 1.3 or less in the molecular weight distribution of the polyarylene sulfide, as measured by gel permeation chromatography using polystyrene as a standard, and a preparation method thereof. This polyarylene sulfide exhibits excellent processability and generates no burrs (flashes) or the like, and can satisfactorily mold a product requiring high molding precision.
摘要:
This disclosure relates to polyarylene sulfide that may exhibit and maintain excellent properties and a method for preparing the same, wherein the polyarylene sulfide is in the form of pellet of 2 to 10 mm size immediately after melt polymerization, and has residual solvent content of 300 ppm or less, based on the total weight of resin.The polyarylene sulfide may exhibit and maintain excellent properties, particularly it does not generate foam in the product or stain on the surface, has excellent mechanical properties such as tensile strength, and the like, and thus, it may be usefully applied in the industrial field of preparing polyarylene sulfide and manufacturing a molded product using the same.
摘要:
This disclosure relates to polyarylene sulfide that may exhibit and maintain excellent properties and a method for preparing the same, wherein the polyarylene sulfide is in the form of pellet of 2 to 10 mm size immediately after melt polymerization, and has residual solvent content of 300 ppm or less, based on the total weight of resin.The polyarylene sulfide may exhibit and maintain excellent properties, particularly it does not generate foam in the product or stain on the surface, has excellent mechanical properties such as tensile strength, and the like, and thus, it may be usefully applied in the industrial field of preparing polyarylene sulfide and manufacturing a molded product using the same.
摘要:
A PRAM and method of forming the same are disclosed. In various embodiments, the PRAM includes a lower insulation layer formed on a semiconductor substrate, a phase change material pattern formed on the lower insulation layer and a heating electrode contacting the phase change material pattern. The heating electrode can be formed of a material having a positive temperature coefficient such that specific resistance of the material increases as a function of temperature.
摘要:
A phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a semiconductor substrate. The molding layer has a protrusion portion vertically extending from a top surface thereof. The device further includes a phase-changeable material pattern adjacent the protrusion portion and a lower electrode electrically connected to the phase-changeable material pattern.
摘要:
A phase change memory device includes a mold layer disposed on a substrate, a heating electrode, a filling insulation pattern and a phase change material pattern. The heating electrode is disposed in an opening exposing the substrate through the mold layer. The heating electrode is formed in a substantially cylindrical shape, having its sidewalls conformally disposed on the lower inner walls of the opening. The filling insulation pattern fills an empty region surrounded by the sidewalls of the heating electrode. The phase change material pattern is disposed on the mold layer and downwardly extended to fill the empty part of the opening. The phase change material pattern contacts the top surfaces of the sidewalls of the heating electrode.
摘要:
Disclosed is an all-optical variable optical attenuator. The all-optical variable optical attenuator includes a nonlinear optical fiber where a pair of long-period gratings is formed in a pre-determined pattern. Alternatively, the variable optical attenuator may include a pair of optical fibers where a long-period grating is formed in each optical fiber in a pre-determined pattern to form a pair of long-period gratings on the whole, and a nonlinear optical fiber fusion-spliced between one ends of the respective optical fibers. The core layer of the nonlinear optical fiber contains semiconductor particles having a size of nanometers, a metallic particle having a size of nanometers, or a rare-earth element.
摘要:
Integrated circuit devices are provided having a vertical diode therein. The devices include an integrated circuit substrate and an insulating layer on the integrated circuit substrate. A contact hole penetrates the insulating layer. A vertical diode is in a lower region of the contact hole and a bottom electrode in the contact hole has a bottom surface on a top surface of the vertical diode. The bottom electrode is self-aligned with the vertical diode. A top surface area of the bottom electrode is less than a horizontal section area of the contact hole. Methods of forming the integrated circuit devices and phase change memory cells are also provided.
摘要:
According to some embodiments of the present invention, there are provided PRAMS having a phase-change layer pattern interposed between a molding layer and a forming layer pattern, and methods of forming the same that include a node conductive layer pattern, a molding layer, a forming layer pattern and a protecting layer. The molding layer, the forming layer pattern and the protecting layer are formed to cover the planarized interlayer insulating layer and the node conductive layer pattern. A lower electrode is interposed between the molding layer and the planarized interlayer insulating layer. A phase-change layer pattern is formed on the planarized interlayer insulating layer. A spacer pattern is disposed between the phase-change layer pattern and the molding layer.