Microfluidic chip and method of fabricating the same
    1.
    发明授权
    Microfluidic chip and method of fabricating the same 有权
    微流控芯片及其制造方法

    公开(公告)号:US08153085B2

    公开(公告)日:2012-04-10

    申请号:US12949981

    申请日:2010-11-19

    IPC分类号: B01L3/00

    摘要: Provided are a microfluidic chip and a method of fabricating the same. The microfluidic chip includes: a lower substrate; an upper substrate formed of a silicone resin, wherein the lower substrate and the upper substrate, bonded together, provide a channel through which a fluid can flow and a chamber to receive the fluid; and an organic thin film formed on the upper surface of the lower substrate except for portions on which the lower substrate and the upper substrate are attached to each other.

    摘要翻译: 提供了一种微流控芯片及其制造方法。 微流体芯片包括:下基板; 由硅树脂形成的上基板,其中所述下基板和所述上基板接合在一起,提供流体可以流过的通道和容纳所述流体的室; 以及形成在下基板的上表面上的有机薄膜,除了下基板和上基板彼此附接的部分之外。

    MICROFLUIDIC CHIP AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    MICROFLUIDIC CHIP AND METHOD OF FABRICATING THE SAME 有权
    微流控芯片及其制造方法

    公开(公告)号:US20080305011A1

    公开(公告)日:2008-12-11

    申请号:US11934811

    申请日:2007-11-05

    IPC分类号: B44C1/22 B01L3/00 G03C5/00

    摘要: Provided are a microfluidic chip and a method of fabricating the same. The microfluidic chip includes: a lower substrate; an upper substrate formed of a silicone resin, wherein the lower substrate and the upper substrate, bonded together, provide a channel through which a fluid can flow and a chamber to receive the fluid; and an organic thin film formed on the upper surface of the lower substrate except for portions on which the lower substrate and the upper substrate are attached to each other.

    摘要翻译: 提供了一种微流控芯片及其制造方法。 微流体芯片包括:下基板; 由硅树脂形成的上基板,其中所述下基板和所述上基板接合在一起,提供流体可以流过的通道和容纳所述流体的室; 以及形成在下基板的上表面上的有机薄膜,除了下基板和上基板彼此附接的部分之外。

    Microfluidic chip and method of fabricating the same
    4.
    发明授权
    Microfluidic chip and method of fabricating the same 有权
    微流控芯片及其制造方法

    公开(公告)号:US07858042B2

    公开(公告)日:2010-12-28

    申请号:US11934811

    申请日:2007-11-05

    IPC分类号: B01N3/00

    摘要: Provided are a microfluidic chip and a method of fabricating the same. The microfluidic chip includes: a lower substrate; an upper substrate formed of a silicone resin, wherein the lower substrate and the upper substrate, bonded together, provide a channel through which a fluid can flow and a chamber to receive the fluid; and an organic thin film formed on the upper surface of the lower substrate except for portions on which the lower substrate and the upper substrate are attached to each other.

    摘要翻译: 提供了一种微流控芯片及其制造方法。 微流体芯片包括:下基板; 由硅树脂形成的上基板,其中所述下基板和所述上基板接合在一起,提供流体可以流过的通道和容纳所述流体的室; 以及形成在下基板的上表面上的有机薄膜,除了下基板和上基板彼此附接的部分之外。