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公开(公告)号:US20190221723A1
公开(公告)日:2019-07-18
申请号:US16055778
申请日:2018-08-06
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/62 , H01L33/48
CPC分类号: H01L33/504 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US10069047B1
公开(公告)日:2018-09-04
申请号:US15892358
申请日:2018-02-08
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/48 , H01L33/62
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US11873979B1
公开(公告)日:2024-01-16
申请号:US17978123
申请日:2022-10-31
发明人: Yizhen Chen , Yongzhe Dong , Shuxing Gao , Zhenyu Tang , Huiwu Chen , Bihong Zheng , Weize Lin , Zhiwei Su
IPC分类号: F21V23/04 , F21S8/04 , F21Y115/10
CPC分类号: F21V23/04 , F21S8/043 , F21Y2115/10
摘要: A lighting apparatus includes a base plate, a driver module, a light source, a mechanical switch, a main housing, and a manual switch. The driver module is disposed on a top surface of the base plate. The light source is also disposed on the top surface of the base plate. The mechanical switch is disposed on the base plate. The mechanical switch has multiple states to be selected. The driver reads a selected state to control the light source. The main housing encloses the base plate. The manual switch is disposed on the main housing. An operating part of the manual switch is exposed outside the main housing to be operated by a user. When a user moves the operating part of the manual switch, the connecting part of the manual switch carries the mechanical switch to change the selected state.
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公开(公告)号:US20200161511A1
公开(公告)日:2020-05-21
申请号:US16749387
申请日:2020-01-22
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: H01L33/50 , H01L33/62 , H01L33/48 , H01L33/60 , H01L25/075
摘要: A LED light tube includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US20190221726A1
公开(公告)日:2019-07-18
申请号:US16285936
申请日:2019-02-26
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: H01L33/50 , H01L33/62 , H01L25/075 , H01L33/60 , H01L33/48
CPC分类号: H01L33/504 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L33/60 , H01L33/62
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US20190218454A1
公开(公告)日:2019-07-18
申请号:US16279154
申请日:2019-02-19
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
CPC分类号: C09K11/0883 , C08K3/34 , C09K11/59 , F21K9/64 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/504 , H01L33/505 , H01L33/52 , H01L2933/0041
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US11871491B1
公开(公告)日:2024-01-09
申请号:US17978152
申请日:2022-10-31
发明人: Yizhen Chen , Yongzhe Dong , Shuxing Gao , Zhenyu Tang , Huiwu Chen , Bihong Zheng , Weize Lin , Zhiwei Su
IPC分类号: H05B45/30 , F21V21/04 , F21V7/10 , F21V29/502 , F21Y115/10
CPC分类号: H05B45/30 , F21V7/10 , F21V21/04 , F21V29/502 , F21Y2115/10
摘要: A lighting apparatus includes a base plate, a driver module, a light source, a mechanical switch, a main housing, and a manual switch. The driver module is disposed on a top surface of the base plate. The light source is also disposed on the top surface of the base plate. The mechanical switch is disposed on the base plate. The mechanical switch has multiple states to be selected. The driver reads a selected state to control the light source. The main housing encloses the base plate. The manual switch is disposed on the main housing. An operating part of the manual switch is exposed outside the main housing to be operated by a user. When a user moves the operating part of the manual switch, the connecting part of the manual switch carries the mechanical switch to change the selected state.
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公开(公告)号:US11021653B2
公开(公告)日:2021-06-01
申请号:US16570666
申请日:2019-09-13
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: C09K11/08 , H01L33/50 , F21K9/64 , C08K3/34 , H01L33/52 , C09K11/59 , H01L33/48 , H01L25/075
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US11018282B2
公开(公告)日:2021-05-25
申请号:US16266414
申请日:2019-02-04
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
IPC分类号: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/48 , H01L33/62
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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公开(公告)号:US20200002606A1
公开(公告)日:2020-01-02
申请号:US16570666
申请日:2019-09-13
发明人: Yanbiao Chen , Liangliang Cao , Huiwu Chen , Qiyuan Wang
摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
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