LED device
    2.
    发明授权

    公开(公告)号:US10069047B1

    公开(公告)日:2018-09-04

    申请号:US15892358

    申请日:2018-02-08

    摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    Lighting apparatus
    3.
    发明授权

    公开(公告)号:US11873979B1

    公开(公告)日:2024-01-16

    申请号:US17978123

    申请日:2022-10-31

    IPC分类号: F21V23/04 F21S8/04 F21Y115/10

    摘要: A lighting apparatus includes a base plate, a driver module, a light source, a mechanical switch, a main housing, and a manual switch. The driver module is disposed on a top surface of the base plate. The light source is also disposed on the top surface of the base plate. The mechanical switch is disposed on the base plate. The mechanical switch has multiple states to be selected. The driver reads a selected state to control the light source. The main housing encloses the base plate. The manual switch is disposed on the main housing. An operating part of the manual switch is exposed outside the main housing to be operated by a user. When a user moves the operating part of the manual switch, the connecting part of the manual switch carries the mechanical switch to change the selected state.

    LED LIGHT TUBE
    4.
    发明申请
    LED LIGHT TUBE 审中-公开

    公开(公告)号:US20200161511A1

    公开(公告)日:2020-05-21

    申请号:US16749387

    申请日:2020-01-22

    摘要: A LED light tube includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    Lighting apparatus
    8.
    发明授权

    公开(公告)号:US11021653B2

    公开(公告)日:2021-06-01

    申请号:US16570666

    申请日:2019-09-13

    摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    LED device
    9.
    发明授权

    公开(公告)号:US11018282B2

    公开(公告)日:2021-05-25

    申请号:US16266414

    申请日:2019-02-04

    摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    LIGHTING APPARATUS
    10.
    发明申请
    LIGHTING APPARATUS 审中-公开

    公开(公告)号:US20200002606A1

    公开(公告)日:2020-01-02

    申请号:US16570666

    申请日:2019-09-13

    摘要: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.