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20 条记录 (耗时 0.018 秒)

    LED LIGHT TUBE
    1.
    发明申请
    LED LIGHT TUBE 审中-公开

    公开(公告)号：US20200161511A1

    公开(公告)日：2020-05-21

    申请号：US16749387

    申请日：2020-01-22

    申请人： LEEDARSON LIGHTING CO. LTD.

    发明人： Yanbiao Chen ,  Liangliang Cao ,  Huiwu Chen ,  Qiyuan Wang

    IPC分类号： H01L33/50 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L25/075

    摘要： A LED light tube includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    Lighting apparatus
    4.
    发明授权
    Lighting apparatus 有权

    公开(公告)号：US11021653B2

    公开(公告)日：2021-06-01

    申请号：US16570666

    申请日：2019-09-13

    申请人： LEEDARSON LIGHTING CO. LTD.

    发明人： Yanbiao Chen ,  Liangliang Cao ,  Huiwu Chen ,  Qiyuan Wang

    IPC分类号： C09K11/08 ,  H01L33/50 ,  F21K9/64 ,  C08K3/34 ,  H01L33/52 ,  C09K11/59 ,  H01L33/48 ,  H01L25/075

    摘要： A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    LIGHTING APPARATUS
    5.
    发明申请
    LIGHTING APPARATUS 有权

    公开(公告)号：US20210144825A1

    公开(公告)日：2021-05-13

    申请号：US17093106

    申请日：2020-11-09

    申请人： XIAMEN LEEDARSON LIGHTING CO.,LTD

    发明人： Yanbiao Chen ,  Liping Lin

    IPC分类号： H05B45/30 ,  H01L33/50 ,  F21K9/64 ,  H01L33/62 ,  H05B45/10

    摘要： A lighting apparatus includes a LED module and a driver. The LED module includes a first LED chip, a second LED chip, a first fluorescent layer, a second fluorescent layer and a package frame. The first LED chip and the second chip are respectively disposed at a first area and a second area of the package frame. The first fluorescent layer covers the first area. The second fluorescent layer covers the second LED chip. The first fluorescent layer and the second fluorescent layer have different types of fluorescent materials. The driver generates a driving current supplied to the LED module so that the LED module emits a first light above the first area and a second light above the second area for generating a mixed light by the first light and the second light.

    LIGHTING APPARATUS
    6.
    发明申请
    LIGHTING APPARATUS 有权

    公开(公告)号：US20210100080A1

    公开(公告)日：2021-04-01

    申请号：US17017694

    申请日：2020-09-11

    申请人： XIAMEN LEEDARSON LIGHTING CO.,LTD

    发明人： Yanbiao Chen ,  Hongkui Jiang

    IPC分类号： H05B45/20 ,  H01L25/16 ,  H05B45/325 ,  H05B47/19 ,  F21K9/238 ,  F21K9/64 ,  F21K9/68 ,  G08C23/04

    摘要： A lighting apparatus includes a first LED module, a second LED module, a third LED module, and a light source plate. The first LED module includes a first package frame disposing a first LED chip and a second LED chip. It is similar to arrange the second LED module and the third LED module. A total number of red color type among the first LED chip, the second LED chip, the third LED chip, the fourth LED chip, the fifth LED chip and the sixth LED chip is more than a total number of green color type among the first LED chip, the second LED chip, the third LED chip, the fourth LED chip, the fifth LED chip and the sixth LED chip.

    LIGHTING APPARATUS
    7.
    发明申请
    LIGHTING APPARATUS 有权

    公开(公告)号：US20210095823A1

    公开(公告)日：2021-04-01

    申请号：US17017698

    申请日：2020-09-11

    申请人： XIAMEN LEEDARSON LIGHTING CO.,LTD

    发明人： Yanbiao Chen ,  Hongkui Jiang

    IPC分类号： F21K9/64 ,  H01L33/50 ,  F21S2/00 ,  F21V23/00 ,  F21Y115/10

    摘要： A lighting apparatus includes a first LED module, a second LED module, a third LED module, and a light source plate. The first LED module includes a first package frame disposing a first LED chip and a second LED chip. It is similar to arrange the second LED module and the third LED module. The LED chips are configured to arrange a high color temperature LED chip, a green LED chip, a red LED chip, a blue LED chip, and a low color temperature LED chip together with an antenna module.

    LED device
    9.
    发明授权
    LED device 有权

    公开(公告)号：US10069047B1

    公开(公告)日：2018-09-04

    申请号：US15892358

    申请日：2018-02-08

    申请人： LEEDARSON LIGHTING CO. LTD.

    发明人： Yanbiao Chen ,  Liangliang Cao ,  Huiwu Chen ,  Qiyuan Wang

    IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62

    摘要： A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

    LED light tube
    10.
    发明授权
    LED light tube 有权

    公开(公告)号：US11024780B2

    公开(公告)日：2021-06-01

    申请号：US16749387

    申请日：2020-01-22

    申请人： LEEDARSON LIGHTING CO. LTD.

    发明人： Yanbiao Chen ,  Liangliang Cao ,  Huiwu Chen ,  Qiyuan Wang

    IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62

    摘要： A LED light tube includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.