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公开(公告)号：US20210193890A1
公开(公告)日：2021-06-24
申请号：US16768304
申请日：2018-11-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Ki Seok KIM
Abstract: A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.
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公开(公告)号：US20200335675A1
公开(公告)日：2020-10-22
申请号：US16760702
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Jung KIM , Ki Seok KIM , June O SONG , Chang Man LIM
Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
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公开(公告)号：US20200279982A1
公开(公告)日：2020-09-03
申请号：US16646660
申请日：2018-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Sung Min KONG , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device disposed on the first and second frames; a first resin disposed between the body and the light emitting device, wherein each of the first and second frames includes a through hole, the through hole overlaps the light emitting device in a vertical direction, and the body includes a recess recessed toward a lower surface of the body between the first and second frames, and the recess overlaps the light emitting device in the vertical direction, the first resin is disposed in the recess, and a length of the recess is smaller than a width of the light emitting device.
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公开(公告)号：US20200227373A1
公开(公告)日：2020-07-16
申请号：US16646623
申请日：2018-09-14
Applicant: LG INNOTEK CO., LTD.
Inventor： June O SONG , Ki Seok KIM , Chang Man LIM
Abstract: A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening. According to the embodiment, the upper surface of the first package body may be coupled to the lower surface of the second package body, the first package body may include a recess recessed from the upper surface of the first package body to the lower surface of the first package body, the first resin may be disposed in the recess, the first resin and the second resin include materials different from each other, and the first resin may be in contact with the light emitting device and the second resin.
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公开(公告)号：US20190088837A1
公开(公告)日：2019-03-21
申请号：US15766444
申请日：2017-09-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , June O SONG , Chang Man LIM
CPC classification number: H01L33/56 , F21V23/007 , H01L24/16 , H01L33/40 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16257 , H01L2224/26175 , H01L2224/73204
Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.
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Patent Agency Ranking
公开(公告)号：US20210013376A1
公开(公告)日：2021-01-14
申请号：US16646884
申请日：2018-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Won Jung KIM , June O SONG , Chang Man LIM
Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
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公开(公告)号：US20200350474A1
公开(公告)日：2020-11-05
申请号：US16643099
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Shin KIM , June O SONG , Chang Man LIM , Won Jung KIM , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.
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公开(公告)号：US20200303596A1
公开(公告)日：2020-09-24
申请号：US16649452
申请日：2018-09-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM , Hyoung Jin KIM , Hwan Hee JEONG
Abstract: The light-emitting device package disclosed in the embodiment includes first and second frames; a body supporting the first and second frames; and a light emitting device on the second frame, and the body may include a lower surface, a first side, and a second side facing the first side. The first frame includes a first recess that is concave in a second side direction from a first side portion adjacent to the first side, and the second frame includes a second recess that is concave in a first side direction from a second side portion adjacent to the second side. The first side portion of the first frame includes plurality of protrusions exposed to the first side of the body, the first recess is disposed between the protrusions of the first side portion, the second side portion of the second frame includes plurality of protrusions exposed to the second side of the body, and the second recess is disposed between the protrusions of the second side portion. A first length in the second direction of the first and second recesses is longer than a width in the first direction, and the first length may be larger than the second length in the second direction, which is an interval between the protrusions disposed in each of the first and second frames.
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公开(公告)号：US20200287107A1
公开(公告)日：2020-09-10
申请号：US16649553
申请日：2018-09-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM
Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
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公开(公告)号：US20200212276A1
公开(公告)日：2020-07-02
申请号：US16643279
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Ki Seok KIM , Won Jung KIM , June O SONG
IPC: H01L33/60 , H01L25/075 , H01L25/16 , H01L29/866 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62
Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess. The first light emitting device has a first bonding portion and a second bonding portion, and may be arranged on the first resin part and electrically connected to the first frame and the third frame. The second light emitting device has a third bonding portion and a fourth bonding portion, and may be arranged on the second resin part and electrically connected to the second frame and the third frame.
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