公开(公告)号：US07883266B2

公开(公告)日：2011-02-08

申请号：US12053762

申请日：2008-03-24

申请人： Levi A. Campbell ,  Michael J. Domitrovits ,  Michael J. Ellsworth, Jr. ,  Prabjit Singh

发明人： Levi A. Campbell ,  Michael J. Domitrovits ,  Michael J. Ellsworth, Jr. ,  Prabjit Singh

IPC分类号： G01N25/72 ,  G01N3/00 ,  G01J5/00

CPC分类号： H05K7/20772 ,  G01N25/72 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20836

摘要： Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

摘要翻译： 提供了用于检测冷板中的缺陷的方法和装置，用于冷却电子部件。 该方法包括：建立通过冷板的第一流体流，第一流体流处于第一温度; 将第二流体流冲击到界面表面上，第二流体流处于第二温度，第一温度和第二温度是不同的温度; 当所述第一流体流过所述冷板并且所述第二流体流入所述界面时，获得所述冷板的界面的等温线映射; 并使用等温线映射来确定冷板是否有缺陷。 在一个实施例中，使用红外透明歧管将第二流体流注入界面表面，并且通过红外透明歧管获得界面表面的等温线映射。

公开(公告)号：US08857057B2

公开(公告)日：2014-10-14

申请号：US13447421

申请日：2012-04-16

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00 ,  H05K7/20

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供一种用于便利液体冷却电子机架的维修的装置。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US08387249B2

公开(公告)日：2013-03-05

申请号：US11942221

申请日：2007-11-19

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供了一种便于维护液冷电子机架的设备和方法。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US07301770B2

公开(公告)日：2007-11-27

申请号：US11009935

申请日：2004-12-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

公开(公告)号：US08743545B2

公开(公告)日：2014-06-03

申请号：US13271268

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K5/00

CPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2023/4087 ,  H01L2224/16 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49353

摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

摘要翻译： 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。

公开(公告)号：US08867209B2

公开(公告)日：2014-10-21

申请号：US13187556

申请日：2011-07-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/02 ,  H01L23/473 ,  H01L23/427 ,  H05K13/00 ,  F28D21/00

CPC分类号： H05K13/00 ,  F28D15/02 ,  F28D2021/0028 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/49002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。 此外，冷却装置包括设置在隔室内的流体和去离子结构。 电子部件至少部分地浸没在流体内，并且流体是水基流体。 去离子结构包括去离子材料，其确保隔室内的流体的去离子。 去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。 随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

公开(公告)号：US06684501B2

公开(公告)日：2004-02-03

申请号：US10105698

申请日：2002-03-25

申请人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： H05K720

CPC分类号： F28F21/02 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

摘要翻译： 一种用于制造包括翅片体的箔散热器的设计和方法，其中所述鳍体包括多个散热鳍片，散热鳍片具有翅片头和鳍脚，并且其中所述多个散热鳍片以平行方式设置， 以在所述多个散热鳍片之间形成多个水平通道，翅片支撑件，其中所述翅片支撑件包括设置在所述多个散热鳍片之间的多个翅片支撑结构，以分离所述多个散热鳍片，并且其中 所述多个翅片支撑结构设置成与所述翅片头相邻，以便在所述多个散热鳍片之间形成多个垂直通道，以及翅片基座，其中所述翅片基座包括多个翅片间隔件， 散热翅片以分离多个散热鳍片，并且其中所述多个翅片间隔件设置成与鳍脚相邻。

公开(公告)号：US07222423B2

公开(公告)日：2007-05-29

申请号：US11130755

申请日：2005-05-17

申请人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Prabjit Singh

发明人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Prabjit Singh

IPC分类号： B21D53/02

CPC分类号： H01L23/3737 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10S165/905 ,  Y10T29/4935 ,  Y10T29/49366 ,  H01L2924/00

摘要： A method of manufacturing a finned heat sink included obtaining a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material. A fin cover is secured to the fin core using one of heat and pressure to define a heat sink fin, wherein the fin cover is constructed of a foil material.

摘要翻译： 制造翅片式散热器的方法包括获得翅片芯，其中散热片芯由导电结构石墨 - 环氧树脂材料构成。 翅片盖使用热和压力之一固定到翅片芯以限定散热片，其中翅片盖由箔材料构成。

公开(公告)号：US06918438B2

公开(公告)日：2005-07-19

申请号：US10161792

申请日：2002-06-04

申请人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Prabjit Singh

发明人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Prabjit Singh

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  F28F7/00

CPC分类号： H01L23/3737 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10S165/905 ,  Y10T29/4935 ,  Y10T29/49366 ,  H01L2924/00

摘要： A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

摘要翻译： 一种散热鳍片散热片，其包括多个散热鳍片，其中，所述多个散热鳍片中的每一个均包括翅片盖和翅片芯，其中所述翅片芯由导电结构石墨环氧树脂材料构成， 由铝箔材料制成，并且相对于散热片芯布置以包围散热片芯和散热器底座，其中散热器基座设置成与多个散热鳍片热连通。

公开(公告)号：US08985847B2

公开(公告)日：2015-03-24

申请号：US13300803

申请日：2011-11-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G01N3/60 ,  G01N17/00 ,  G01N25/16 ,  G01N25/00 ,  H05K7/20

CPC分类号： H05K7/20836

摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。