公开(公告)号：US07883266B2

公开(公告)日：2011-02-08

申请号：US12053762

申请日：2008-03-24

申请人： Levi A. Campbell ,  Michael J. Domitrovits ,  Michael J. Ellsworth, Jr. ,  Prabjit Singh

发明人： Levi A. Campbell ,  Michael J. Domitrovits ,  Michael J. Ellsworth, Jr. ,  Prabjit Singh

IPC分类号： G01N25/72 ,  G01N3/00 ,  G01J5/00

CPC分类号： H05K7/20772 ,  G01N25/72 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20836

摘要： Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

摘要翻译： 提供了用于检测冷板中的缺陷的方法和装置，用于冷却电子部件。 该方法包括：建立通过冷板的第一流体流，第一流体流处于第一温度; 将第二流体流冲击到界面表面上，第二流体流处于第二温度，第一温度和第二温度是不同的温度; 当所述第一流体流过所述冷板并且所述第二流体流入所述界面时，获得所述冷板的界面的等温线映射; 并使用等温线映射来确定冷板是否有缺陷。 在一个实施例中，使用红外透明歧管将第二流体流注入界面表面，并且通过红外透明歧管获得界面表面的等温线映射。

公开(公告)号：US08857057B2

公开(公告)日：2014-10-14

申请号：US13447421

申请日：2012-04-16

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00 ,  H05K7/20

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供一种用于便利液体冷却电子机架的维修的装置。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US08387249B2

公开(公告)日：2013-03-05

申请号：US11942221

申请日：2007-11-19

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供了一种便于维护液冷电子机架的设备和方法。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US07301770B2

公开(公告)日：2007-11-27

申请号：US11009935

申请日：2004-12-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

公开(公告)号：US08743545B2

公开(公告)日：2014-06-03

申请号：US13271268

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K5/00

CPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2023/4087 ,  H01L2224/16 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49353

摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

摘要翻译： 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。

公开(公告)号：US08867209B2

公开(公告)日：2014-10-21

申请号：US13187556

申请日：2011-07-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/02 ,  H01L23/473 ,  H01L23/427 ,  H05K13/00 ,  F28D21/00

CPC分类号： H05K13/00 ,  F28D15/02 ,  F28D2021/0028 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/49002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。 此外，冷却装置包括设置在隔室内的流体和去离子结构。 电子部件至少部分地浸没在流体内，并且流体是水基流体。 去离子结构包括去离子材料，其确保隔室内的流体的去离子。 去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。 随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

公开(公告)号：US08985847B2

公开(公告)日：2015-03-24

申请号：US13300803

申请日：2011-11-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G01N3/60 ,  G01N17/00 ,  G01N25/16 ,  G01N25/00 ,  H05K7/20

CPC分类号： H05K7/20836

摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

公开(公告)号：US08922998B2

公开(公告)日：2014-12-30

申请号：US13281495

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Eric J. McKeever ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Eric J. McKeever ,  Robert E. Simons

IPC分类号： G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  F28D7/10 ,  F28D7/12 ,  F28D7/02 ,  F28F3/12 ,  F28F1/10 ,  F28F1/00

CPC分类号： H05K7/20272 ,  H05K7/2079 ,  Y10T29/4935 ,  Y10T29/49389

摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

摘要翻译： 提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。

公开(公告)号：US08789385B2

公开(公告)日：2014-07-29

申请号：US13451668

申请日：2012-04-20

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： F25B21/02 ,  F25B40/00 ,  H05K7/20836

摘要： A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了一种便于冷却电子部件的方法。 该方法包括：提供构造成制冷剂流过环路的制冷剂回路; 联接压缩机与环路流体连通，其中环路的第一部分位于压缩机的制冷剂入口的上游，第二部分位于下游; 并配置可控热电阵列与制冷剂回路热连通。 热电阵列设置成与制冷剂回路的第一部分至少部分地与阵列的第一侧热接触，并且环的第二部分至少部分地与阵列的第二侧热接触。 控制阵列以确保进入压缩机的制冷剂回路中的制冷剂处于过热的热力学状态。

公开(公告)号：US08713955B2

公开(公告)日：2014-05-06

申请号：US13271290

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： F25B43/003 ,  F25B2400/01 ,  H05K7/20327 ,  H05K7/20809

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸汽压缩式制冷系统包括膨胀部件，蒸发器，压缩机以及通过制冷剂流动路径流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通地联接的污染物提取器。 提取器包括制冷剂沸腾过滤器和加热器。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂沸腾过滤器，并且加热器向制冷剂沸腾过滤器提供热量以沸腾通过过滤器的制冷剂。 通过沸腾通过过滤器的制冷剂，污染物从制冷剂中排出，并沉积在制冷剂沸腾过滤器中。