公开(公告)号：US10160151B2

公开(公告)日：2018-12-25

申请号：US15397829

申请日：2017-01-04

Applicant: LEXMARK INTERNATIONAL, INC.

Inventor： Keith Bryan Hardin ,  Zachary Charles Nathan Kratzer ,  Qing Zhang

IPC: H05K3/30 ,  B29C47/00 ,  H05K1/18 ,  H01G4/33 ,  H01G4/35 ,  B28B3/20 ,  B28B11/16 ,  H05K1/02 ,  H05K3/40 ,  B29L31/34

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

公开(公告)号：US20150173207A1

公开(公告)日：2015-06-18

申请号：US14631192

申请日：2015-02-25

Applicant: Lexmark International, Inc.

Inventor： Keith Bryan Hardin ,  Paul Kevin Hall ,  Qing Zhang ,  John Thomas Fessler

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Abstract translation: 根据一个示例的用于形成用于插入到印刷电路板的安装孔中的Z定向部件的方法包括用主体材料填充具有锥形表面的第一腔体。 约束材料的第一层设置在第一空腔的顶部上，并具有第二腔，其宽度小于第一空腔。 第二个空腔充满了主体材料。 约束材料的连续层设置在约束材料的第一层的顶部上。 约束材料的连续层的空腔至少选择性填充主体材料，以形成Z向分量的主体部分的层。 消融约束材料以将约束材料释放Z定向的成分，并且对Z指向的元件进行烧制。

公开(公告)号：US20150101742A1

公开(公告)日：2015-04-16

申请号：US14574903

申请日：2014-12-18

Applicant: Lexmark International, Inc.

Inventor： Keith Bryan Hardin ,  Zachary Charles Nathan Kratzer ,  Qing Zhang

IPC: H01G4/33 ,  H05K3/30 ,  H01G4/35

CPC classification number: B29C47/0066 ,  B28B3/20 ,  B28B11/16 ,  B29C47/0004 ,  B29C47/0035 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3425 ,  H01G4/33 ,  H01G4/35 ,  H05K1/0221 ,  H05K1/0231 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

Abstract translation: 根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括根据Z定向部件的结构同时挤压多种材料以形成挤出物体并形成 来自挤压物体的Z向分量。 在一个实施例中，将挤出的物体分成单独的Z向分量。 在一个实施例中，改变其中一个材料的预定部分之间的挤压定时，以便交错挤出物体中的部分。

公开(公告)号：US20140237816A1

公开(公告)日：2014-08-28

申请号：US14268265

申请日：2014-05-02

Applicant: LEXMARK INTERNATIONAL, INC.

Inventor： Paul Kevin Hall ,  Keith Bryan Hardin ,  Zachary Charles Nathan Kratzer ,  Qing Zhang

IPC: H05K3/10

CPC classification number: H05K3/108 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/09645 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49204

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

Abstract translation: 根据一个示例实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括根据Z指向部件的形状挤出基底材料。 然后将导电材料选择性地施加到挤出的基底材料上，并且由挤出的基底材料形成Z指向的部件。

公开(公告)号：US09814145B2

公开(公告)日：2017-11-07

申请号：US14631192

申请日：2015-02-25

Applicant: Lexmark International, Inc.

Inventor： Keith Bryan Hardin ,  Paul Kevin Hall ,  Qing Zhang ,  John Thomas Fessler

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

公开(公告)号：US09564272B2

公开(公告)日：2017-02-07

申请号：US14574903

申请日：2014-12-18

Applicant: Lexmark International, Inc.

Inventor： Keith Bryan Hardin ,  Zachary Charles Nathan Kratzer ,  Qing Zhang

IPC: H05K3/30 ,  H01G4/33 ,  H05K1/18 ,  H01G4/35 ,  H05K1/02 ,  H05K3/40

CPC classification number: B29C47/0066 ,  B28B3/20 ,  B28B11/16 ,  B29C47/0004 ,  B29C47/0035 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3425 ,  H01G4/33 ,  H01G4/35 ,  H05K1/0221 ,  H05K1/0231 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

Abstract translation: 根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括根据Z定向部件的结构同时挤压多种材料以形成挤出物体并形成 来自挤压物体的Z向分量。 在一个实施例中，将挤出的物体分成单独的Z向分量。 在一个实施例中，改变其中一个材料的预定部分之间的挤压定时，以便交错挤出物体中的部分。