利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.023 秒)

    Method for continuous particle separation using obstacle arrays asymmetrically aligned to fields
    2.
    发明申请
    Method for continuous particle separation using obstacle arrays asymmetrically aligned to fields 有权
    使用与场不对称的障碍物阵列进行连续粒子分离的方法

    公开(公告)号：US20070187250A1

    公开(公告)日：2007-08-16

    申请号：US11640111

    申请日：2006-12-15

    申请人： Lotien Huang ,  James Sturm

    发明人： Lotien Huang ,  James Sturm

    IPC分类号： G01N27/00

    CPC分类号： B07B1/00 ,  B01L3/5027 ,  G01N27/44704 ,  G01N27/44773 ,  G01N27/44791 ,  G01N30/0005 ,  G01N30/02 ,  G01N30/6095 ,  B01D15/34

    摘要： The present invention relates to methods and devices for separating particles according to size. More specifically, the present invention relates to a microfluidic method and device for the separation of particles according to size using an array comprising a network of gaps, wherein the field flux from each gap divides unequally into subsequent gaps. In one embodiment, the array comprises an ordered array of obstacles in a microfluidic channel, in which the obstacle array is asymmetric with respect to the direction of an applied field.

    摘要翻译： 本发明涉及根据尺寸分离颗粒的方法和装置。 更具体地说，本发明涉及一种用于使用包括间隙网络的阵列根据尺寸分离颗粒的微流体方法和装置，其中来自每个间隙的场磁通不均匀地分成随后的间隙。 在一个实施例中，阵列包括在微流体通道中的有序阵列的障碍物，其中障碍物阵列相对于施加场的方向是不对称的。

    System and method for interfacing large-area electronics with integrated circuit devices
    5.
    发明授权
    System and method for interfacing large-area electronics with integrated circuit devices 有权
    将大面积电子与集成电路器件连接的系统和方法

    公开(公告)号：US09391220B2

    公开(公告)日：2016-07-12

    申请号：US13367856

    申请日：2012-02-07

    申请人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    发明人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    IPC分类号： H01F38/14 ,  H02J4/00 ,  H01L31/0392

    CPC分类号： H01L31/03926 ,  Y02E10/50 ,  Y10T29/49124

    摘要： A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

    摘要翻译： 提供了一种用于将大面积电子器件与集成电路器件接口的系统和方法。 该系统可以在包括设置在基板上的大面积电子（LAE）装置的电子设备中实现。 集成电路IC设置在基板上。 非接触界面设置在衬底上并耦合在LAE器件和IC之间。 非接触接口被配置为提供LAE设备和IC之间的数据采集路径或控制路径中的至少一个。

    Forming closely spaced electrodes
    6.
    发明申请
    Forming closely spaced electrodes 有权
    形成紧密间隔的电极

    公开(公告)号：US20050014357A1

    公开(公告)日：2005-01-20

    申请号：US10803244

    申请日：2004-03-18

    申请人： Zhenan Bao ,  Jie Zheng ,  James Sturm ,  Troy Graves-Abe

    发明人： Zhenan Bao ,  Jie Zheng ,  James Sturm ,  Troy Graves-Abe

    IPC分类号： H01L51/40 ,  H01L21/336 ,  H01L21/44 ,  H01L21/4763

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  B82Y40/00 ,  H01L51/0021 ,  H01L51/0595 ,  Y10S977/858 ,  Y10S977/891 ,  Y10T428/26

    摘要： The present invention provides an apparatus and a method of fabricating the apparatus. The apparatus comprises a substrate having a planar surface and first and second electrodes located on the planar surface. The first electrode has a top surface and a lateral surface, and the lateral surface has an edge near or in contact with the substrate. An electrode insulating layer is located on the top surface and a self-assembled layer located on the lateral surface. The second electrode is in contact with both the self-assembled layer and the electrode insulating layer.

    摘要翻译： 本发明提供一种制造该装置的装置和方法。 该装置包括具有平坦表面的基底和位于平坦表面上的第一和第二电极。 第一电极具有顶表面和侧表面，并且侧表面具有与基底接近或接触的边缘。 电极绝缘层位于顶表面上，并且位于侧表面上的自组装层。 第二电极与自组装层和电极绝缘层接触。

    FORMING CLOSELY SPACED ELECTRODES
    7.
    发明申请
    FORMING CLOSELY SPACED ELECTRODES 有权
    形成密闭电极

    公开(公告)号：US20070069243A1

    公开(公告)日：2007-03-29

    申请号：US11424655

    申请日：2006-06-16

    申请人： Zhenan Bao ,  Jie Zheng ,  James Sturm ,  Troy Graves-Abe

    发明人： Zhenan Bao ,  Jie Zheng ,  James Sturm ,  Troy Graves-Abe

    IPC分类号： H01L29/76 ,  B32B1/00

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  B82Y40/00 ,  H01L51/0021 ,  H01L51/0595 ,  Y10S977/858 ,  Y10S977/891 ,  Y10T428/26

    摘要： The present invention provides an apparatus and a method of fabricating the apparatus. The apparatus comprises a substrate having a planar surface and first and second electrodes located on the planar surface. The first electrode has a top surface and a lateral surface, and the lateral surface has an edge near or in contact with the substrate. An electrode insulating layer is located on the top surface and a self-assembled layer located on the lateral surface. The second electrode is in contact with both the self-assembled layer and the electrode insulating layer.

    摘要翻译： 本发明提供一种制造该装置的装置和方法。 该装置包括具有平坦表面的基底和位于平坦表面上的第一和第二电极。 第一电极具有顶表面和侧表面，并且侧表面具有与基底接近或接触的边缘。 电极绝缘层位于顶表面上，并且位于侧表面上的自组装层。 第二电极与自组装层和电极绝缘层接触。

    SYSTEM AND METHOD FOR INTERFACING LARGE-AREA ELECTRONICS WITH INTEGRATED CIRCUIT DEVICES
    8.
    发明申请
    SYSTEM AND METHOD FOR INTERFACING LARGE-AREA ELECTRONICS WITH INTEGRATED CIRCUIT DEVICES 有权
    用于将大面积电子与集成电路器件接口的系统和方法

    公开(公告)号：US20120200168A1

    公开(公告)日：2012-08-09

    申请号：US13367856

    申请日：2012-02-07

    申请人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    发明人： Naveen Verma ,  Branko Glisic ,  James Sturm ,  Sigurd Wagner

    IPC分类号： H01F38/14 ,  H05K3/00 ,  H02J4/00

    CPC分类号： H01L31/03926 ,  Y02E10/50 ,  Y10T29/49124

    摘要： A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

    摘要翻译： 提供了一种用于将大面积电子器件与集成电路器件接口的系统和方法。 该系统可以在包括设置在基板上的大面积电子（LAE）装置的电子设备中实现。 集成电路IC设置在基板上。 非接触界面设置在衬底上并耦合在LAE器件和IC之间。 非接触接口被配置为提供LAE设备和IC之间的数据采集路径或控制路径中的至少一个。