STRUCTURE AND PROCESS FOR MICROELECTROMECHANICAL SYSTEM-BASED SENSOR
    1.
    发明申请
    STRUCTURE AND PROCESS FOR MICROELECTROMECHANICAL SYSTEM-BASED SENSOR 有权
    基于微电子系统的传感器的结构与工艺

    公开(公告)号:US20130099331A1

    公开(公告)日:2013-04-25

    申请号:US13327681

    申请日:2011-12-15

    IPC分类号: H01L29/66 H01L21/02

    摘要: A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

    摘要翻译: 提供了一种用于基于微机电系统(MEMS)的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上,桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上,与导电组件电连接。

    Structure and process for microelectromechanical system-based sensor
    2.
    发明授权
    Structure and process for microelectromechanical system-based sensor 有权
    微机电系统传感器的结构与工艺

    公开(公告)号:US08643125B2

    公开(公告)日:2014-02-04

    申请号:US13327681

    申请日:2011-12-15

    IPC分类号: H01L29/78

    摘要: A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

    摘要翻译: 提供了一种用于基于微机电系统(MEMS)的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上,桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上,与导电组件电连接。

    MIRCO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE
    3.
    发明申请
    MIRCO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE 有权
    微电子机械系统(MEMS)设备

    公开(公告)号:US20160131679A1

    公开(公告)日:2016-05-12

    申请号:US14535022

    申请日:2014-11-06

    IPC分类号: G01P15/08

    摘要: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

    摘要翻译: 本发明提供一种MEMS装置。 MEMS器件包括:衬底; 包括至少两个槽的检验质量块,每个槽包括内部空间和开口,所述内部空间比所述开口相对更靠近所述检验质量块的中心区域; 至少两个锚定件,位于相应的槽中并连接到基板上; 至少两个连杆位于相应的槽中并连接到相应的锚固件上; 以及用于辅助检测质量块的多维运动的多维弹簧结构,围绕证明物质的周边的多维弹簧结构,并且通过连接件和锚固件连接到基底。 该多维弹簧结构包括第一和第二弹簧,用于辅助防弹块的平面外移动和平面内移动。

    MIRCO-ELECTRO-MECHANICAL SYSTEM PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    MIRCO-ELECTRO-MECHANICAL SYSTEM PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开
    微电子机械系统压力传感器及其制造方法

    公开(公告)号:US20150260593A1

    公开(公告)日:2015-09-17

    申请号:US14329111

    申请日:2014-07-11

    IPC分类号: G01L9/00 B81B7/00 B81C1/00

    摘要: The invention provides a micro-electro-mechanical system pressure sensor. The micro-electro-mechanical system pressure sensor includes: a substrate, including at least one conductive wiring; a membrane disposed above the substrate to form a semi-open chamber between the membrane and the substrate, the semi-open chamber having an opening to receive an external pressure; and a cap, disposed above the membrane and forming an enclosed space with the membrane, the cap including a top electrode corresponding to the membrane and at least one portion of the membrane forming a bottom electrode, wherein the top and bottom electrodes form a sensing capacitor to sense the external pressure.

    摘要翻译: 本发明提供一种微机电系统压力传感器。 微电子机械系统压力传感器包括:基板,包括至少一个导电布线; 膜,设置在所述基板上方以在所述膜和所述基板之间形成半开放室,所述半开放室具有用于接收外部压力的开口; 以及帽,其设置在所述膜的上方并与所述膜形成封闭空间,所述盖包括对应于所述膜的顶部电极和形成底部电极的所述膜的至少一部分,其中所述顶部和底部电极形成感测电容器 感觉外部压力。

    MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH OSCILLATING ASSEMBLY
    5.
    发明申请
    MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH OSCILLATING ASSEMBLY 有权
    具有振荡装置的微电子机械系统装置

    公开(公告)号:US20130167635A1

    公开(公告)日:2013-07-04

    申请号:US13459270

    申请日:2012-04-30

    IPC分类号: G01C19/56

    CPC分类号: G01C19/5747

    摘要: A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.

    摘要翻译: 一种微电子机械系统(MEMS)装置,包括设置在第一框架中的两个检验质量块,使得具有振荡组件的MEMS装置分别感测两个轴中的角速度。 具有摆动组件的MEMS装置还包括杠杆结构和在杠杆结构的两个相对端处连接的两个摆动组件,使得摆动组件沿相反方向同步地移动。 具有振荡组件的MEMS装置还包括连接在检验质量块和可动电极之间的弹簧组件,限制了证明物质以驱动可移动电极仅沿特定方向移动。

    Micro-electro-mechanical system (MEMS) device with multi-dimensional spring structure and frame

    公开(公告)号:US09733269B2

    公开(公告)日:2017-08-15

    申请号:US14535022

    申请日:2014-11-06

    摘要: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

    CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME 有权
    晶体振荡器及其制造方法

    公开(公告)号:US20120154068A1

    公开(公告)日:2012-06-21

    申请号:US13115112

    申请日:2011-05-25

    IPC分类号: H03B5/32 H01L21/822

    CPC分类号: H03H9/0547 H03H3/02

    摘要: A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

    摘要翻译: 晶体振荡器包括盖,晶体空白和集成电路(IC)芯片。 盖具有表面,形成在表面中的空腔,多个导电触点和导电密封环。 导电触点设置在表面上,并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环,并与盖和导电密封环形成密封室。 晶体坯料位于密封室中,并与IC芯片电连接。 此外,还提供了一种用于制造晶体振荡器的方法。

    Micro-electro-mechanical-system device with oscillating assembly
    8.
    发明授权
    Micro-electro-mechanical-system device with oscillating assembly 有权
    具有摆动组件的微机电系统装置

    公开(公告)号:US09046367B2

    公开(公告)日:2015-06-02

    申请号:US13459270

    申请日:2012-04-30

    IPC分类号: G01C19/56 G01C19/5747

    CPC分类号: G01C19/5747

    摘要: A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.

    摘要翻译: 一种微电子机械系统(MEMS)装置,包括设置在第一框架中的两个检验质量块,使得具有振荡组件的MEMS装置分别感测两个轴中的角速度。 具有摆动组件的MEMS装置还包括杠杆结构和在杠杆结构的两个相对端处连接的两个摆动组件,使得摆动组件沿相反方向同步地移动。 具有振荡组件的MEMS装置还包括连接在检验质量块和可动电极之间的弹簧组件,限制了证明物质以驱动可移动电极仅沿特定方向移动。

    Sensing device and manufacturing method thereof
    10.
    发明授权
    Sensing device and manufacturing method thereof 有权
    检测装置及其制造方法

    公开(公告)号:US08763457B2

    公开(公告)日:2014-07-01

    申请号:US13154426

    申请日:2011-06-06

    IPC分类号: G01D11/24

    摘要: A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

    摘要翻译: 感测装置可以设置有各种条件的密封和开放式室,用于通过堆叠多个基板来容纳不同类型的感测结构部件,其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道,与使用焊料或密封材料的密封室相比,实现了优异的密封性能,因此可以精细地控制密封室的状态。