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    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
    3.
    发明授权
    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards 有权
    用于电光封装的装置和方法，其有助于将光缆耦合到印刷电路板

    公开(公告)号：US06749345B1

    公开(公告)日：2004-06-15

    申请号：US10155743

    申请日：2002-05-24

    申请人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    发明人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    IPC分类号： G02B638

    CPC分类号： G02B6/4277 ,  G02B6/421 ,  G02B6/424 ,  G02B6/425 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292

    摘要： Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.

    摘要翻译： 将封装的电子元件直接嵌入光缆的电光封装，为高性能提供短的电连接路径，并提供稳健的互连。 第一电光学封装包括集成电路和连接器套管，其被配置为从PC板的下侧接收插入式光学组件。 插入式光学组件包括背衬片和安装在背衬片上的光电装置。 在光电装置和背衬片上的接触位置之间提供电连接，并且在背衬片上的接触位置和集成电路之间提供触点。 通过第二电光封装，提供具有面向第一方向的有源表面的集成电路和具有面向第二方向的接触点的光电装置。 集成电路和光电相对于彼此定位，使得可以在集成电路的有源表面和光电装置的接触点之间形成直接电连接。

    Optoelectronic package with controlled fiber standoff
    10.
    发明授权
    Optoelectronic package with controlled fiber standoff 有权
    具有受控光纤支架的光电封装

    公开(公告)号：US06595699B1

    公开(公告)日：2003-07-22

    申请号：US09922946

    申请日：2001-08-03

    申请人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts

    发明人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts

    IPC分类号： G02B636

    CPC分类号： G02B6/4202 ,  G02B6/4212 ,  G02B6/4231 ,  H01L2224/73207

    摘要： An optoelectronic component is described that includes a photonic device carried by a substrate. A support structure having a relatively higher portion and a relatively lower portion is formed on or attached to the substrate. In a preferred embodiment, the support structure is a dam structure formed by dispensing a flowable material onto the substrate and hardening the dispensed material. The optoelectronic component further includes one or more optical fibers, with each optical fiber being in optical communication with an active facet on the photonic device. The relatively higher and lower portions of the support structure are arranged to position the optical fiber(s) at a desired standoff distance from the photonic device and to slightly incline the distal tip of each optical fiber relative to the top surface of the photonic device. The described packaging approach can be used in both single fiber and multi-channel devices. In some specific embodiments, the support structure is arranged to engage a fiber termination that holds the optical fiber(s). An optically clear cap may also be provided to cover the active facet of the photonic device. In embodiments where the support structure surrounds the photonic device, the support structure may be used as a containment for the cap. With this arrangement, a flowable clear topping material is dispensed over the photonic device without requiring a traditional molding operation.

    摘要翻译： 描述了包括由衬底承载的光子器件的光电子部件。 具有相对较高部分和相对较低部分的支撑结构形成在基底上或附着于基底上。 在优选实施例中，支撑结构是通过将可流动材料分配到基底上并硬化所分配的材料形成的坝结构。 光电子部件还包括一个或多个光纤，每个光纤与光子器件上的有源刻面光学通信。 支撑结构的相对较高和较低的部分被布置成将光纤定位在离光子器件所需的间隔距离处，并且相对于光子器件的顶表面稍微倾斜每个光纤的远端。 所描述的封装方法可用于单光纤和多通道设备。 在一些具体实施例中，支撑结构布置成接合保持光纤的光纤终端。 还可以提供光学透明的盖以覆盖光子器件的活性面。 在支撑结构围绕光子装置的实施例中，支撑结构可用作帽的容纳物。 利用这种布置，可流动的透明顶部材料被分配在光子器件上，而不需要传统的模制操作。